Presentation
13 June 2022 MOL patterning challenges in scaled SRAM with vertical Surrounding Gate Transistors (SGT)
Author Affiliations +
Abstract
The surrounding-gate-transistor (SGT) is a vertical gate-all-around device with a new design to exploit natural area gain for further scaling the SRAM size beyond N5 node. One of the benefits in SGT is it can fully decouple the dependency of the gate length (Lg) and the source/drain (S/D) contact size from the contact gate pitch (CGP) scaling, which is seen as a hard limit for the conventional scaling. To fully realize the benefit of area gain and Lg scaling independent from lithography, the patterning challenges of 3D vertical device structure must be resolved. In this paper, we report the MOL patterning challenges in SGT device fabrication, such as Metal recess process, Bottom Contact formation (VBG), Cross point formation (XC), Top electrode (TE) patterning.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zheng Tao, Yisuo Li, Waikin Li, Minsoo Kim, Basoene Briggs, Katia Devriendt, Lieve Teugels, Farid Sebai, Christophe Lorant, Clement Porret, Erik Rosseel, Alfonso Sepúlveda Márquez, Nicolas Jourdan, Juergen Boemmels, Jerome Mitard, Philippe Matagne, Efrain Altamirano-Sánchez, Lars-ake Ragnarsson, Anish Dangol, Dmitry Batuk, Gerardo Tadeo Martinez Alanis, Jef Geypen, Kenichi Kanazawa, Testuo Izawa, Masakazu Kakumu, Koji Sakui, and Nozomu Harada "MOL patterning challenges in scaled SRAM with vertical Surrounding Gate Transistors (SGT)", Proc. SPIE PC12056, Advanced Etch Technology and Process Integration for Nanopatterning XI, PC120560B (13 June 2022); https://doi.org/10.1117/12.2614772
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KEYWORDS
Optical lithography

Metals

Etching

Atomic layer deposition

Transistors

Electrodes

Inspection

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