Effect of initial conditions on uniformity of metal assisted chemical etch for ultra-high aspect ratio, taper-free silicon nanostructures

Akhila Mallavarapu; Mark Hrdy; Mariana Castaneda; Paras Ajay; S.V. Sreenivasan

doi:10.1117/12.2604283

13 June 2022 Effect of initial conditions on uniformity of metal assisted chemical etch for ultra-high aspect ratio, taper-free silicon nanostructures

Akhila Mallavarapu, Mark Hrdy, Mariana Castaneda, Paras Ajay, S.V. Sreenivasan

Author Affiliations +

Proceedings Volume PC12056, Advanced Etch Technology and Process Integration for Nanopatterning XI; PC120560C (2022) https://doi.org/10.1117/12.2604283
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Conference Poster

There is no online version at this time. The PDF is only available to people who have bought the paper or have a subscription.

Citation Download Citation

Akhila Mallavarapu, Mark Hrdy, Mariana Castaneda, Paras Ajay, and S.V. Sreenivasan "Effect of initial conditions on uniformity of metal assisted chemical etch for ultra-high aspect ratio, taper-free silicon nanostructures", Proc. SPIE PC12056, Advanced Etch Technology and Process Integration for Nanopatterning XI, PC120560C (13 June 2022); https://doi.org/10.1117/12.2604283

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available