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17 March 2023 Surface functionalisation of transparent materials: high-throughputs meet high resolutions
Laura Gemini, Aurelien Sikora, Laura Loi, Girolamo Mincuzzi, Marc Faucon, Rainer Kling
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Proceedings Volume PC12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII; PC124080C (2023) https://doi.org/10.1117/12.2648757
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
The nature of transparent materials makes their laser-based functionalisation more complex, highly material dependant and often characterised by process throughputs too low to be considered competitive for an industrial uptake. In this frame, direct laser interference patterning (DLIP) appears to be the right compromise to achieve 100s-nm surface features while running at competitive throughputs. A state-of-the-art DLIP processing setup is employed to shape the 100s-nm nanostructure features to obtain highly homogeneous morphologies in different regimes of interaction on polycarbonate, fused silica and sapphire, including a DLIP-tailored f-theta lens connected to a 30-mm aperture high-speed galvanometric scanning head.
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Laura Gemini, Aurelien Sikora, Laura Loi, Girolamo Mincuzzi, Marc Faucon, and Rainer Kling "Surface functionalisation of transparent materials: high-throughputs meet high resolutions", Proc. SPIE PC12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII, PC124080C (17 March 2023); https://doi.org/10.1117/12.2648757
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KEYWORDS
Laser engraving
Optical lithography
Laser processing
Manufacturing
Nanostructures
Picosecond phenomena
Pulsed laser operation
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