Presentation
3 October 2024 Machine-learning-assisted optical authentication of chip tampering
Blake Wilson, Yuheng Chen, Daksh K. Singh, Rohan Ojha, Michael Bezick, Jaxon Pott, Vladimir M. Shalaev, Alexandra Boltasseva, Alexander V. Kildishev
Author Affiliations +
Abstract
The chip industry grapples with a chip shortage and a $75 billion influx of counterfeit chips, risking malfunctions and surveillance. Several techniques to authenticate semiconductors have been introduced to detect counterfeit chips, including using physical security tags integrated into chip functionality or packaging. Among them, physical unclonable functions (PUFs), are known as unique and challenging to replicate. However, some PUFs face verification robustness challenges. We introduce a statistical and fabrication method for semiconductor device packaging that is resilient to adversarial tampering. Our innovative deep-learning approach uses a residual, attention-based discriminator to identify tampering in an optical anti-counterfeit PUF, with a random array of gold nanoparticles embedded in the package. Authentication is swiftly achieved in 80ms with 97.6% accuracy, even in challenging adversarial tampering conditions, and our approach demonstrates substantial improvements in total accuracy compared to state-of-the-art metrics. We also propose to map our concept onto a photonic neuromorphic preprocessor. Such a transition offers significant speedup and additional security.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Blake Wilson, Yuheng Chen, Daksh K. Singh, Rohan Ojha, Michael Bezick, Jaxon Pott, Vladimir M. Shalaev, Alexandra Boltasseva, and Alexander V. Kildishev "Machine-learning-assisted optical authentication of chip tampering", Proc. SPIE PC13113, Photonic Computing: From Materials and Devices to Systems and Applications, PC131130E (3 October 2024); https://doi.org/10.1117/12.3027858
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KEYWORDS
Machine learning

Optical authentication

Packaging

Semiconductors

Counterfeit detection

Fabrication

Gold nanoparticles

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