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13 November 2024 Drastic dose reduction of metal oxide resist induced by functional surface treatment process and primers
Taiki Saijo, Kodai Kato, Satoshi Takeda, Mamoru Tamura, Wataru Shibayama, Kiyofumi Wada
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Proceedings Volume PC13215, International Conference on Extreme Ultraviolet Lithography 2024; PC132150O (2024) https://doi.org/10.1117/12.3034659
Event: SPIE Photomask Technology + EUV Lithography, 2024, Monterey, California, United States
Abstract
We propose functional surface treatment process and primers (FSTP). FSTP is a spin-coated ultra-thin material which forms approximately single molecular layer (~1nm) not to bother pattern etch transfer. Moreover, our newly developed FSTP showed lithographic performance enhancement of MOR (metal oxide resist), by having 20~30% dose reduction. Currently, we found that some FSTP has substrate dependency in MOR lithographic performance and optimization of functional unit was effective for solving this issue. Therefore, FSTP plays a important role in both EUVL performance and pattern etch transfer. This makes FSTP as one of the promising candidates for the next-generation High-NA EUV process.
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(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Taiki Saijo, Kodai Kato, Satoshi Takeda, Mamoru Tamura, Wataru Shibayama, and Kiyofumi Wada "Drastic dose reduction of metal oxide resist induced by functional surface treatment process and primers", Proc. SPIE PC13215, International Conference on Extreme Ultraviolet Lithography 2024, PC132150O (13 November 2024); https://doi.org/10.1117/12.3034659
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KEYWORDS
Metal oxides
Lithography
Photoresist processing
Etching
Extreme ultraviolet
Extreme ultraviolet lithography
Chemical vapor deposition
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