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In this paper we present a range of organic micromachining techniques that enable a planar membrane-based printed circuit to be fabricated on a 5 μm thick organic membrane in the absence of any steps involving thermal oxidation and low pressure chemical vapor deposition. The technologies are suitable for mass production of millimeter-wave or submillimeter-wave components. Transmission losses of a membrane-supported E-plane component are typically less than 0.5 dB/cm.
Wai Yip Liu,David Paul Steenson, andMichael B. Steer
"Organic micromachining techniques for mass production of millimeter-wave and submillimeter-wave planar circuits," Journal of Micro/Nanolithography, MEMS, and MOEMS 1(2), (1 July 2002). https://doi.org/10.1117/1.1463042
Published: 1 July 2002
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Wai Yip Liu, David Paul Steenson, Michael B. Steer, "Organic micromachining techniques for mass production of millimeter-wave and submillimeter-wave planar circuits," J. Micro/Nanolith. MEMS MOEMS 1(2) (1 July 2002) https://doi.org/10.1117/1.1463042