Journal of Micro/Nanolithography, MEMS, and MOEMS

Co-Editors-in-Chief:
Harry Levinson, HJL Lithography, USA
Hans Zappe, University of Freiburg, Germany

The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM ³) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.

On the cover: The figure is from the paper " Cascade and cluster of correlated reactions as causes of stochastic defects in exrtreme ultraviolet lithography" by Hiroshi Fukuda, from Vol. 19, Issue 2.

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Design and modeling of a highly sensitive microelectromechanical system capacitive microphone

S. B. Sedaghat and B. A. Ganji

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Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch

J. Church et al.

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High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features

Wei Sun et al.

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Design and modeling of a highly sensitive microelectromechanical system capacitive microphone

Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch

High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features

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Retrospective on VLSI value scaling and lithography

Attenuated phase shift mask for extreme ultraviolet: can they mitigate three-dimensional mask effects?

Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

Review of scanning electron microscope-based overlay measurement beyond 3-nm node device

Overlay error statistics for multiple-exposure patterning

Control of optical nanometer gap shapes made via standard lithography using atomic layer deposition

Design, simulation, and fabrication of three-dimensional microsystem components using grayscale photolithography

High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features

Electrostatically tunable MOEMS waveguide Bragg grating-based DWDM optical filter

Current understanding of the electrostatic risk to reticles used in microelectronics and similar manufacturing processes

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