Prof. Andreas Ettemeyer Profile

Prof. Andreas Ettemeyer

Head of Institute at OST Institut IMP

SPIE Involvement:

Author

Publications (31)

Proceedings Article | 6 December 2016 Paper

Investigation of the ageing effects exhibited by AR coatings exposed to ultraviolet laser irradiation

Roelene Botha, David Bischof, Bernhard Vetsch, Ueli Scherrer, Markus Michler, Stefan Rinner, Andreas Ettemeyer, Carsten Ziolek

Proceedings Volume 10014, 100141L (2016) https://doi.org/10.1117/12.2244657

KEYWORDS: Antireflective coatings, Laser induced damage, Optical coatings, Ultraviolet radiation, Optical testing, Optical components, Laser damage threshold, Silica, Laser irradiation, Temperature metrology

Read Abstract +

Proceedings Article | 23 November 2015 Paper

Comparative study of the laser damage threshold and optical characteristics of Ta2O5-SiO2 multilayers deposited using various methods

Roelene Botha, Silvia Schwyn Thöny, Martin Grössl, Safer Mourad, Clau Maissen, Jacobus Venter, Thomas Südmeyer, Martin Hoffmann, Pavel Bulkin, Sabine Linz-Dittrich, David Bischof, Markus Michler, Stefan Rinner, Andreas Ettemeyer

Proceedings Volume 9632, 963203 (2015) https://doi.org/10.1117/12.2194084

KEYWORDS: Manufacturing, Optical coatings, Polishing, Laser induced damage, Laser damage threshold, Silica, Multilayers, Optics manufacturing, Ion beams, Sputter deposition

Read Abstract +

Proceedings Article | 22 June 2015 Paper

Smart optical distance sensor for automatic welding detection

Michael Kahl, Stefan Rinner, Andreas Ettemeyer

Proceedings Volume 9525, 952526 (2015) https://doi.org/10.1117/12.2190736

KEYWORDS: Sensors, Light sources, Signal detection, Ultraviolet radiation, Optical filters, Lenses, Charge-coupled devices, Interference (communication), Distance measurement, Optical simulations

Read Abstract +

Proceedings Article | 13 May 2013 Paper

Scanning fringe projection for fast 3D inspection

Marc Honegger, Michael Kahl, Sandra Trunz, Stefan Rinner, Andreas Ettemeyer, Patrick Lambelet

Proceedings Volume 8788, 878814 (2013) https://doi.org/10.1117/12.2020260

KEYWORDS: Cameras, Projection systems, Light emitting diodes, Image acquisition, 3D metrology, Inspection, Content addressable memory, Calibration, Imaging systems, Semiconducting wafers

Read Abstract +

In an earlier paper we have described a concept for high speed 3D inspection using fringe projection techniques. We use a special CMOS camera with 300 x 300 px which can calculate the phase on board. The focus of the first step of development had been a fringe projector, which was able to modulate the projected fringes with up to 250 kHz. In the second step the image acquisition part of the system was developed. In case of 3D measurement with a matrix camera, the camera resp. the measuring object has to be moved stepwise in the lateral direction to cover multiple acquisition areas of the measurement object. Between each image the lateral movement has to correspond to the field of view of the camera. At the intended very high image acquisition rates the high acceleration of the system between each image will lead to inacceptable mechanical forces. In order to obtain a continuous scanning procedure and at the same time to use the performance of a matrix camera, a special lens system was developed. A measurement field 120 mm long and 3 mm wide is imaged onto the camera. The width of the measuring field is imaged onto the 300 rows of the camera, giving a lateral resolution of 10 μm. In the longitudinal direction the 120 mm object length is divided into 12’000 lines to reach the same resolution of 10 μm. Due to technical reasons that will be described later only 240 of the 300 pixel rows on the chip were used. Consequently, with each camera shot 240 separated lines are imaged onto the chip. Between each of these 240 lines there is a large empty space, which is not imaged by the camera. In principle, the camera is operating as 240 single line cameras. Therefore, if the camera is shifted in an inclined direction to the camera orientation over the object, the empty spaces can be recorded as well. In an optimum alignment, the complete measuring object can be scanned in a continuous movement, covering the total length of 120 mm. In this paper we will describe this image acquisition system and give first measuring results.

Proceedings Article | 31 January 2013 Paper

High speed 3D surface inspection with digital holography

Andreas Brunn, Nicolas Aspert, Etienne Cuche, Yves Emery, Andreas Ettemeyer

Proceedings Volume 8759, 87593Q (2013) https://doi.org/10.1117/12.2014598

KEYWORDS: Digital holography, Inspection, Semiconducting wafers, 3D image processing, Microscopy, Microscopes, Wavefronts, Molybdenum, 3D acquisition, Image acquisition

Read Abstract +

SPIE Journal Paper | 14 May 2012

New three-dimensional fiber probe for multisensor coordinate measurement

Andreas Ettemeyer

OE, Vol. 51, Issue 8, 081502, (May 2012) https://doi.org/10.1117/12.10.1117/1.OE.51.8.081502

KEYWORDS: Sensors, Cameras, Optical spheres, Interferometers, Fiber lasers, Light sources, 3D metrology, Optical sensors, Microscopes, Confocal microscopy

Read Abstract +

Proceedings Article | 1 May 2012 Paper

GePaRDT: a framework for massively parallel processing of dataflow graphs

Alexander Schöch, Carlo Bach, Andreas Ettemeyer, Sabine Linz-Dittrich

Proceedings Volume 8437, 843702 (2012) https://doi.org/10.1117/12.921677

KEYWORDS: Computer programming, Data modeling, Image processing, Phase shift keying, Parallel processing, Computing systems, Interferometry, Data processing, 3D visualizations, Visualization

Read Abstract +

Proceedings Article | 16 November 2011 Paper

3D fiber probe for multi sensor coordinate measurement

A. Ettemeyer

Proceedings Volume 8321, 83211N (2011) https://doi.org/10.1117/12.904709

KEYWORDS: Sensors, Cameras, 3D metrology, Optical spheres, Fiber lasers, Optical sensors, Interferometry, Confocal microscopy, Light sources, Microscopes

Read Abstract +

SPIE Journal Paper | 1 October 2011 Open Access

Special Section Guest Editorial: Advances of optical metrology in the transportation industry

Lian Xiang Yang, Andreas Ettemeyer

OE, Vol. 50, Issue 10, 101501, (October 2011) https://doi.org/10.1117/12.10.1117/1.3646735

KEYWORDS: Optical metrology, Optical engineering, Mechanical engineering, Applied sciences, Integrated optics, Mechanics, Sensors, Parallel processing, Data processing, 3D metrology

Read Abstract +

DOWNLOAD PAPER

Proceedings Article | 27 May 2011 Paper

High speed fringe projection for fast 3D inspection

Sandra Caspar, Marc Honegger, Stefan Rinner, Patrick Lambelet, Carlo Bach, Andreas Ettemeyer

Proceedings Volume 8082, 80820Y (2011) https://doi.org/10.1117/12.888930

KEYWORDS: Cameras, Inspection, Light emitting diodes, Modulation, Phase shifts, Image acquisition, Fringe analysis, Projection systems, 3D metrology, Imaging systems

Read Abstract +

Proceedings Article | 26 May 2011 Paper

Optical 3D testing of micro structures

Andreas Ettemeyer

Proceedings Volume 7997, 79971S (2011) https://doi.org/10.1117/12.891863

Read Abstract +

Proceedings Article | 17 June 2009 Paper

Investigation of the thermal lens effect of a NdYAG laser

A. Ettemeyer, J. Jütz, M. Spiegel, K. Dobler

Proceedings Volume 7389, 738906 (2009) https://doi.org/10.1117/12.823257

KEYWORDS: Crystals, Laser crystals, Thermal effects, Microscopes, Laser resonators, Digital holography, Resonators, Holography, Temperature metrology, Lasers

Read Abstract +

Proceedings Article | 12 April 2005 Paper

Industrial applications of shearography for inspection of aircraft components

Rene Krupka, Thomas Walz, Andreas Ettemeyer

Proceedings Volume 5852, (2005) https://doi.org/10.1117/12.621713

KEYWORDS: Inspection, Shearography, Cameras, Composites, Aerospace engineering, Sensors, Carbon, Light emitting diodes, Laser applications, Robotics

Read Abstract +

Proceedings Article | 12 April 2005 Paper

Strain analysis on an Al-foam structure with ESPI

Ronny Wegner, Andreas Ettemeyer, Raphael Schoen, Hermann Buschermoehle

Proceedings Volume 5852, (2005) https://doi.org/10.1117/12.621528

KEYWORDS: Computer aided design, Finite element methods, Strain analysis, Foam, Aluminum, Experimental mechanics, Solid modeling, Measurement devices, 3D modeling, Prototyping

Read Abstract +

Proceedings Article | 30 May 2003 Paper

Industrial applications of shearography for inspections of aircraft components

Rene Krupka, T. Waltz, Andreas Ettemeyer

Proceedings Volume 5144, (2003) https://doi.org/10.1117/12.508366

KEYWORDS: Inspection, Shearography, Cameras, Composites, Aerospace engineering, Sensors, Carbon, Light emitting diodes, Laser applications, Robotics

Read Abstract +

Proceedings Article | 27 May 2003 Paper

A decade of innovation with laser speckle metrology

Andreas Ettemeyer

Proceedings Volume 4933, (2003) https://doi.org/10.1117/12.516643

KEYWORDS: Inspection, Speckle metrology, Shearography, Holographic interferometry, Speckle, Speckle interferometry, Cameras, Laser metrology, Light emitting diodes, Standards development

Read Abstract +

SPIE Journal Paper | 1 May 2003

Fast and full-field measurement of brake squeal using pulsed ESPI technique

Rene Krupka, Thomas Walz, Andreas Ettemeyer

OE, Vol. 42, Issue 05, (May 2003) https://doi.org/10.1117/12.10.1117/1.1566005

KEYWORDS: Pulsed laser operation, 3D metrology, Inspection, Sensors, Laser systems engineering, Analytical research, Image sensors, Modal analysis, Phase measurement, Image processing

SPIE Journal Paper | 1 May 2003

Strain measurement by three-dimensional electronic speckle pattern interferometry: potentials, limitations, and applications

Lian Xiang Yang, Andreas Ettemeyer

OE, Vol. 42, Issue 05, (May 2003) https://doi.org/10.1117/12.10.1117/1.1566781

KEYWORDS: 3D metrology, Sensors, Speckle pattern, Interferometry, Optical engineering, CCD cameras, Glasses, Phase measurement, Fringe analysis, Environmental sensing

Proceedings Article | 23 October 2001 Paper

3D-PulsESPI technique for dynamic deformation measurement

Rene Krupka, Herbert Vetter, Thomas Walz, Andreas Ettemeyer

Proceedings Volume 4398, (2001) https://doi.org/10.1117/12.445549

KEYWORDS: Holography, Sensors, 3D metrology, Inspection, Analytical research, Image sensors, Pulsed laser operation, Structural dynamics, Interferometers, Image processing

Read Abstract +

SPIE Journal Paper | 1 January 2000

Combination of 3-D deformation and shape measurement by electronic speckle pattern interferometry for quantitative strain-stress analysis

Andreas Ettemeyer

OE, Vol. 39, Issue 01, (January 2000) https://doi.org/10.1117/12.10.1117/1.602354

KEYWORDS: 3D metrology, Stress analysis, Sensors, Shape analysis, Inspection, Head, Interferometry, Speckle interferometry, Optical engineering, Computer simulations

Proceedings Article | 21 September 1999 Paper

Automatic shearography inspection systems for aircraft components in production

Oliver Erne, T. Waltz, Andreas Ettemeyer

Proceedings Volume 3824, (1999) https://doi.org/10.1117/12.364267

KEYWORDS: Inspection, Shearography, Aerospace engineering, Imaging systems, Cameras, Composites, Control systems, Glasses, Safety, Manufacturing

Read Abstract +

Proceedings Article | 21 September 1999 Paper

Three-dimensional pulsed ESPI technique of analysis of dynamic problems

Zhiguo Wang, Thomas Walz, H. Schubach, Andreas Ettemeyer

Proceedings Volume 3824, (1999) https://doi.org/10.1117/12.364249

KEYWORDS: Cameras, Phase measurement, Holography, 3D metrology, Interferometers, Pulsed laser operation, Analytical research, Distortion, Inspection, 3D applications

Read Abstract +

Proceedings Article | 21 September 1999 Paper

Miniaturization of speckle interferometry for rapid strain analysis

Ronny Wegner, Andreas Ettemeyer

Proceedings Volume 3824, (1999) https://doi.org/10.1117/12.364278

KEYWORDS: Sensors, Interferometry, Strain analysis, Inspection, Speckle interferometry, Head, Interferometers, Signal detection, Stress analysis, Speckle

Read Abstract +

Proceedings Article | 29 December 1998 Paper

Strain/stress measurements using electronic speckle pattern interferometry

Tilo Pfeifer, Horst Mischo, Andreas Ettemeyer, Zhiguo Wang, Ronny Wegner

Proceedings Volume 3520, (1998) https://doi.org/10.1117/12.334340

KEYWORDS: Sensors, Interferometry, Light sources, Speckle pattern, 3D metrology, Metals, Metrology, Prototyping, Light, Materials analysis

Read Abstract +

Proceedings Article | 31 March 1998 Paper

Automatic shearography inspection system for helicopter rotor blades

Thomas Walz, Andreas Ettemeyer

Proceedings Volume 3397, (1998) https://doi.org/10.1117/12.305050

KEYWORDS: Inspection, Shearography, Cameras, Control systems, Laser systems engineering, Composites, Safety, Glasses, Aerospace engineering, System integration

Read Abstract +

Proceedings Article | 17 September 1997 Paper

Applications of 3D speckle interferometry to material and component testing

Andreas Ettemeyer, Zhiguo Wang, Thomas Walz

Proceedings Volume 3098, (1997) https://doi.org/10.1117/12.281160

KEYWORDS: Speckle interferometry, Aluminum, 3D applications, Strain analysis, Finite element methods, Electro optical systems, Head, Sensors, Thermal effects, Imaging systems

Read Abstract +

Proceedings Article | 18 September 1996 Paper

Laser-optical strain sensor for noncontact and whole-field strain analysis

Andreas Ettemeyer

Proceedings Volume 2782, (1996) https://doi.org/10.1117/12.250770

KEYWORDS: Sensors, Strain analysis, Laser interferometry, Laser marking, Optical analysis, Speckle interferometry, Image resolution, CCD cameras, Image analysis

Read Abstract +

Proceedings Article | 23 August 1996 Paper

Comparison of holographic and numerical vibration modes on ductile cast iron containers at drop tests

Andreas Ettemeyer, Dietmar Schreiber, W. Voelzer

Proceedings Volume 2868, (1996) https://doi.org/10.1117/12.248643

KEYWORDS: Holography, Finite element methods, Iron, Chemical elements, Computer simulations, Licensing, Modeling, Ruby lasers, Optical simulations, Data modeling

Read Abstract +

Proceedings Article | 17 July 1996 Paper

Laseroptical strain sensor: technique and applications

Andreas Ettemeyer

Proceedings Volume 2860, (1996) https://doi.org/10.1117/12.276307

KEYWORDS: Sensors, Laser marking, Laser applications, Optical analysis, Speckle pattern, Laser interferometry, Speckle interferometry, Image resolution, CCD cameras, Image analysis

Read Abstract +