This paper surveys recent work in several photodetector areas including high-speed, low-noise avalanche photodiodes, high-power photodiodes, solar-blind ultra-violet PIN photodiodes, and quantum dot infrared photodetectors (QDIPs).
This paper surveys recent work in several photodetector areas including high-speed, low-noise avalanche photodiodes, solar-blind ultra-violet PIN photodiodes, and quantum dot infrared photodetectors (QDIPs).
InAs quantum dot infrared photodetectors based on bound-to- bound intraband transitions in undoped InAs quantum dots are reported. AlGaAs blocking layers were employed to achieve low dark current. The photoresponse peaked at 6.2 micrometers . At 77 K and -0.7 V bias the responsivity was 14 mA/W and the detectivity, D*, was 1010 cmHz1/2/W. By introducing InGaAs cap layers, a QDIP with bias-controllable two-color characteristic was demonstrated.
The development of a truly smart camera, with inherent capability for low latency semi-autonomous object recognition, tracking, and optimal image capture, has remained an elusive goal notwithstanding tremendous advances in the processing power afforded by VLSI technologies. These features are essential for a number of emerging multimedia- based applications, including enhanced augmented reality systems. Recent advances in understanding of the mechanisms of biological vision systems, together with similar advances in hybrid electronic/photonic packaging technology, offer the possibility of artificial biologically-inspired vision systems with significantly different, yet complementary, strengths and weaknesses. We describe herein several system implementation architectures based on spatial and temporal integration techniques within a multilayered structure, as well as the corresponding hardware implementation of these architectures based on the hybrid vertical integration of multiple silicon VLSI vision chips by means of dense 3D photonic interconnections.
We present results for lattice matched (AlxGai..xAs, x=0.5 and x=0.0) and lattice mismatched
(InxGai..xAs, x□0.25) growth on patterned GaAs (100) substrates. For the AlGai..xAs structures, the
GaAs substrates were patterned in the form of elongated mesas parallel to [011 II with widths of
approximately 3 tim. Interfacet migration effects observed on the nesas via cross-section transmission
electron microscope studies are explained in terms of a ledge-ledge interaction on the vicinal surfaces
formed due to growth on the mesas. InxGai..xAs (x□0.25) structures were grown on GaAs (100)
substrates patterned in the form of elongated mesas parallel to [01 11 with widths of approximately 1 tim.
This patterning direction was chosen since under cutting in the [0 1 1] direction eliminates inter-facet
migration effects so that compositional change induced strain effects can be minimised. For x □0.15, we
find a reduction in misfit dislocation densities in films upto five times the nominal critical thickness for
growths on the patterned mesas as compared to the growths on the corresponding non patterned regions.
For x=0.25 no such difference is observed and a large number ofthreading dislocations ( around iO cm2)
are found in both the patterned and the non patterned regions. This is believed to be a consequence of the
onset ofa 3-D island growth mode. Finally we present some results for the growth of InØ5Gaj•75As I
AlAs resonant tunneling diode (RTD) structures and a 100 period InjØGaØ8As (80 A) IGaAs (160 A)
Multiple Quantum Well (MQW) such as suited for spatial light modulator (SLM) structures on GaAs (100)
substrates patterned in both <01 1> directions on a length scale of 12 to 20 tm. For the RTD structures we
conclude that benefits from patterning are expected for x□0.25 provided the growth kinetics are
appropriately adjusted to prevent 3D island growth mode. For the MQW -SLMstructure we demonstrate
superior optical properties for the growth in the patterned region and a corresponding absence of threading
dislocations in the central region of the mesas.
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