Dr. Bernard Courtois Profile

Dr. Bernard Courtois

Director at Circuits Multi-Projets

SPIE Involvement:

Author

Publications (22)

Proceedings Article | 19 April 2002 Paper

CMOS-compatible micromachined tactile fingerprint sensor

F. Parrain, Benoit Charlot, Nicolas Galy, Bernard Courtois

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462857

KEYWORDS: Sensors, Image sensors, Amplifiers, Prototyping, Analog electronics, Finite element methods, Resistance, CMOS sensors, Bulk micromachining, Microelectromechanical systems

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Proceedings Article | 19 April 2002 Paper

Design and characterization of levitated suspended rf inductors

Bohuslav Palan, Kholdoun Torki, Bernard Courtois, Miroslav Husak

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462799

KEYWORDS: Metals, Epoxies, CMOS technology, Silicon, Oxides, Etching, Device simulation, Capacitance, Packaging, Anisotropic etching

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Proceedings Article | 19 April 2002 Paper

SystemC-based cosimulation for global validation of MOEMS

Lobna Kriaa, W. Youssef, Gabriela Nicolescu, Sergio Martinez, Steven Levitan, Jose Martinez, Timothy Kurzweg, Ahmed Jerraya, Bernard Courtois

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462873

KEYWORDS: Mirrors, Interfaces, Telecommunications, Microopto electromechanical systems, Systems modeling, Control systems, Actuators, Free space optics, Sensors, C++

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Proceedings Article | 16 May 2001 Paper

Study of scalability for micromachined free-space optical cross-connects

Sergio Martinez, Bernard Courtois

Proceedings Volume 4290, (2001) https://doi.org/10.1117/12.426907

KEYWORDS: Mirrors, Single mode fibers, GRIN lenses, Collimators, Free space optics, Signal attenuation, Gaussian beams, Tolerancing, Fiber couplers, Refractive index

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Proceedings Article | 15 May 2001 Paper

Design and test of an active pixel sensor (APS) for space applications

Jerome Goy, Bernard Courtois, Jean Michel Karam, Francis Pressecq

Proceedings Volume 4306, (2001) https://doi.org/10.1117/12.426945

KEYWORDS: Transistors, Photodiodes, Capacitance, Diodes, Sensors, CMOS sensors, Diffusion, Camera shutters, Image processing, Active sensors

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Proceedings Article | 5 April 2001 Paper

Insertion losses in micromachined free-space optical cross-connects due to fiber misalignments

Sergio Martinez, Bernard Courtois

Proceedings Volume 4408, (2001) https://doi.org/10.1117/12.425399

KEYWORDS: Mirrors, Single mode fibers, Diffraction, Collimators, GRIN lenses, Gaussian beams, Tolerancing, Free space optics, Refractive index, Packaging

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Proceedings Article | 5 April 2001 Paper

Self-testable CMOS thermopile-based infrared imager

Benoit Charlot, F. Parrain, Salvador Mir, Bernard Courtois

Proceedings Volume 4408, (2001) https://doi.org/10.1117/12.425341

KEYWORDS: Imaging systems, Infrared radiation, Infrared imaging, Thermography, Electronics, Resistors, Analog electronics, Sensors, Infrared detectors, Prototyping

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This paper describes a CMOS-compatible self-testable uncooled InfraRed (IR) imager that can be used in multiple applications such as overheating detection, night vision, and earth tracking for satellite positioning. The imager consists of an array of thermal pixels that sense an infrared radiation. Each pixel is implemented as a front-side bulk micromachined membrane suspended by four arms, each arm containing a thermopile made of Poly/Al thermocouples. The imager has a pixel self-test function that can be activated off-line in the field for validation and maintenance purposes, with an on-chip test signal generation that requires only slight modifications in the pixel design. The self-test of a pixel takes about 15 ms. The area overhead required by the test electronics does not imply any reduction of the pixel fill factor, since the electronics fits in the pixel silicon boundary. However, the additional self-test circuitry contributes to a small increase in the thermal conductance of a pixel due to the wiring of a heating resistor over the suspended arms. The self-test capability of the imager allows for a production test with a standard test equipment, without the need of special infrared sources and the associated optical equipment. A prototype with 8 X 8 pixels is currently in fabrication for validation of the self-test approach. In this prototype, each pixel occupies an area of 200 X 200 micrometer², with a membrane size of 90 X 90 micrometer² (fill factor of 0.2). Simulation results indicate a pixel thermal conductance of 22.6 (mu) W/K, giving a responsivity of 138 V/W, with a thermocouple Seebeck coefficient that has been measured at 248 (mu) V/K for the 0.6 micrometer CMOS technology used. The noise equivalent power (considering only Johnson noise in the thermopile) is calculated as 0.18 nW.H^-1/2 with a detectivity of 5.03 X 10⁷ cm.Hz^1/2.W^-1, in line with current state-of-the-art. Since the imager may need to measure irradiation intensities below 1(mu) W, with a pixel output voltage much smaller than 1 mV, the analog front-end electronics incorporated on the chip uses modulation and correlated-double-sampling to reduce the amplifier offset and the noise floor.

Proceedings Article | 5 April 2001 Paper

Thermal and mechanical evaluation of micromachined planar spiral inductors

Renato Ribas, Jerome Lescot, Jean Louis Leclercq, Bernard Courtois

Proceedings Volume 4408, (2001) https://doi.org/10.1117/12.425369

KEYWORDS: Finite element methods, Transformers, Metals, Gallium arsenide, Etching, Microelectromechanical systems, Micromachining, Dielectrics, Thermal analysis, Silicon

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Proceedings Article | 5 April 2001 Paper

MEMS synthesis and optimization

Zein Juneidi, Kholdoun Torki, Benoit Charlot, Bernard Courtois

Proceedings Volume 4408, (2001) https://doi.org/10.1117/12.425364

KEYWORDS: Microelectromechanical systems, Computer aided design, Analog electronics, Instrument modeling, Optimization (mathematics), Resistance, Electronic circuits, Finite element methods, Databases, Resistors

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Proceedings Article | 24 October 2000 Paper

From MEMS to the global simulation of SoCs

Marta Rencz, Vladimir Szekely, Andras Poppe, Bernard Courtois

Proceedings Volume 4228, (2000) https://doi.org/10.1117/12.405418

KEYWORDS: Computer aided design, Microelectromechanical systems, Packaging, Finite element methods, Bridges, Microelectronics, 3D modeling, Sensors, System on a chip, Data modeling

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Proceedings Article | 10 April 2000 Paper

THERMODEL: a tool for thermal model generation and application for MEMS packages

Vladimir Szekely, Marta Rencz, Andras Poppe, Bernard Courtois

Proceedings Volume 4019, (2000) https://doi.org/10.1117/12.382288

KEYWORDS: Thermal modeling, Microelectromechanical systems, Fused deposition modeling, Deconvolution, Instrument modeling, Convolution, Packaging, Einsteinium, Performance modeling, Microelectronics

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Proceedings Article | 10 April 2000 Paper

Design of an APS CMOS image sensor for space applications using standard CAD tools and CMOS technology

Jerome Goy, Bernard Courtois, Jean Michel Karam, Francis Pressecq

Proceedings Volume 4019, (2000) https://doi.org/10.1117/12.382275

KEYWORDS: Transistors, Diodes, Sensors, CMOS sensors, Photodiodes, Capacitance, Computer aided design, Quantum efficiency, CMOS technology, Standards development

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Proceedings Article | 8 October 1999 Paper

Tool and method for the theremal transient evaluation of packages

Vladimir Szekely, Marta Rencz, Bernard Courtois

Proceedings Volume 3893, (1999) https://doi.org/10.1117/12.368429

KEYWORDS: Resistance, Capacitance, Thermal modeling, Sensors, Silicon, Human-machine interfaces, Chemical elements, Temperature metrology, Transistors, Stars

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Proceedings Article | 10 March 1999 Paper

Advanced integrated solution for MEMS design

Karim Liateni, David Moulinier, Bachar Affour, H. Boutamine, Jean Michel Karam, D. Veychard, Bernard Courtois, Ariel Cao

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341194

KEYWORDS: Microelectromechanical systems, 3D modeling, Finite element methods, Integration, Computer aided design, Data modeling, Anisotropic etching, Systems modeling, Visualization, Solids

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Proceedings Article | 10 March 1999 Paper

Providing technology infrastructure for MEMS

Renato Ribas, D. Veychard, Jean Michel Karam, Bernard Courtois

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341213

KEYWORDS: Computer aided design, Chemical mechanical planarization, Microelectromechanical systems, Gallium arsenide, Manufacturing, Field effect transistors, Integrated circuits, Sensors, Prototyping, Silicon

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Proceedings Article | 10 March 1999 Paper

Fault modeling of electrostatic comb-drives for MEMS

Benoit Charlot, Spiridon Moussouris, Salvador Mir, Bernard Courtois

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341226

KEYWORDS: Microelectromechanical systems, Computer aided design, Microresonators, Resonators, Analog electronics, Transducers, Systems modeling, Instrument modeling, 3D modeling, Motion models

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Proceedings Article | 10 March 1999 Paper

Fault simulation of MEMS using HDLs

Benoit Charlot, Salvador Mir, Erika Cota, Marcelo Lubaszewski, Bernard Courtois

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341215

KEYWORDS: Microelectromechanical systems, Resistors, Instrument modeling, Systems modeling, Finite element methods, Analog electronics, Failure analysis, Device simulation, Thermal modeling, Etching

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Proceedings Article | 8 September 1998 Paper

Integrated mixed-technology design environment to support micro-electro-mechanical systems development

Jean Michel Karam, Bernard Courtois, Ariel Cao, K. Hofmann

Proceedings Volume 3514, (1998) https://doi.org/10.1117/12.323899

KEYWORDS: Microelectromechanical systems, Computer aided design, 3D modeling, Finite element methods, Etching, Chemical elements, Solids, Telecommunications, Systems engineering, Silicon

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Proceedings Article | 2 September 1997 Paper

Engineering tool set for monolithic and hybrid microsystem design

H. Boutamine, Jean Michel Karam, Bernard Courtois, P. Drake, J. Oudinot, H. El Tahawi, Ariel Cao, Marta Rencz, Andras Poppe, Vladimir Szekely

Proceedings Volume 3225, (1997) https://doi.org/10.1117/12.284556

KEYWORDS: Computer aided design, Microsystems, Standards development, Anisotropic etching, Finite element methods, Solid modeling, Etching

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Proceedings Article | 23 September 1996 Paper

Collective fabrication of gallium-arsenide-based microsystems

Jean Michel Karam, Bernard Courtois, M. Holjo, Jean Louis Leclercq, Pierre Viktorovitch

Proceedings Volume 2879, (1996) https://doi.org/10.1117/12.251219

KEYWORDS: Gallium arsenide, Etching, Silicon, Field effect transistors, Microsystems, Chemical species, Micromachining, Microelectronics, Manufacturing, Wet etching

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Proceedings Article | 13 September 1996 Paper

Microsystem design framework based on tool adaptations and library developments

Jean Michel Karam, Bernard Courtois, Marta Rencz, Andras Poppe, Vladimir Szekely

Proceedings Volume 2880, (1996) https://doi.org/10.1117/12.250956

KEYWORDS: Computer aided design, Microsystems, Etching, Electronics, Bulk micromachining, Silicon, Sensors, Device simulation, Microelectronics, Anisotropic etching

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Besides foundry facilities, Computer-Aided Design (CAD) tools are also required to move microsystems from research prototypes to an industrial market. This paper describes a Computer-Aided-Design Framework for microsystems, based on selected existing software packages adapted and extended for microsystem technology, assembled with libraries where models are available in the form of standard cells described at different levels (symbolic, system/behavioral, layout). In microelectronics, CAD has already attained a highly sophisticated and professional level, where complete fabrication sequences are simulated and the device and system operation is completely tested before manufacturing. In comparison, the art of microsystem design and modelling is still in its infancy. However, at least for the numerical simulation of the operation of single microsystem components, such as mechanical resonators, thermo-elements, elastic diaphragms, reliable simulation tools are available. For the different engineering disciplines (like electronics, mechanics, optics, etc) a lot of CAD-tools for the design, simulation and verification of specific devices are available, but there is no CAD-environment within which we could perform a (micro-)system simulation due to the different nature of the devices. In general there are two different approaches to overcome this limitation: the first possibility would be to develop a new framework tailored for microsystem-engineering. The second approach, much more realistic, would be to use the existing CAD-tools which contain the most promising features, and to extend these tools so that they can be used for the simulation and verification of microsystems and of the devices involved. These tools are assembled with libraries in a microsystem design environment allowing a continuous design flow. The approach is driven by the wish to make microsystems accessible to a large community of people, including SMEs and non-specialized academic institutions.

Proceedings Article | 15 September 1995 Paper

CAD framework concept for the design of integrated microsystems

Andras Poppe, Marta Rencz, Vladimir Szekely, Jean Michel Karam, Bernard Courtois, K. Hofmann, M. Glesner

Proceedings Volume 2642, (1995) https://doi.org/10.1117/12.221171

KEYWORDS: Computer aided design, Microsystems, Standards development, Finite element methods, Manufacturing, Microelectronics, Design for manufacturability, TCAD, Solid modeling, Analog electronics

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