As deep ultra-violet (DUV) wavelength optical systems progress towards higher numerical aperture (NA), at least some
of the lens surfaces in the system approach almost complete hemispherical shape and some of the lens surfaces have very
high angle of incidence (AOI) requirements. The antireflection (AR) coating designs for such lens surfaces must address
intensity apodization due to coating thickness nonuniformity and polarization purity. We present some of the recent
results in the area of DUV coatings that highlight these challenges and demonstrate production capability.
157nm lithography is currently considered as the main technology for the manufacturing of critical 65nm node layers and beyond. After a number of potential show stoppers of 157nm have been removed in the last three years, the final phase of development will now start based on the first full-field step and scan exposure systems, that will be inserted in the next 6 months. This paper describes the status and progress of the IMEC 157nm program, that is aiming to remove the remaining 157nm engineering challenges. Despite the fact that the first full field scanner (ASML Micrascan VII) will ship next month to IMEC, the investigation on a number of full-field issues already started. Results on reticle handling including vacuum ultra violet cleaning, on hard pellicle printing and on 157nm resist full field patterning are discussed in this paper.
In this paper we present a status update of the exposure tool developments for sub 65 nm CD’s. Main development path is 157-nm lithography. ASML follows a two step approach volume will be presented. Step 1 is based on the Micrascan step and scans platform and step 2 is based on the TWINSCAN platform. The progress of the development and first results on prototypes are discussed. This includes optics, purging, and pellicle status. The impact of CaF2 birefringence (intrinsic and stress induced) on lens performance is evaluated. Experimental data on optical path purging is presented. The pellicle status is reviewed, and results of hard pellicle testing in KrF scanners are presented. For the Micrascan system, first imaging and overlay results are presented.
This paper describes the system performance for Micrascan VII and reports on some of the photo-resist testing results. The challenges of tool design range from the optical form to new resists. The Micrascan VII architecture has the traditional look of the prior Micrascan family of tools. The evolution of design for operation at 157 nm wavelength has been implemented and is presented. The use of calcium fluoride exclusively in the projection optics design presented many challenges. Performance of the projection optics is shown as well as lithographic results. Initial lithographic results indicate that pattern features well below 100 nm can be printed even with first generation 157 nm resists. 60 nm resist lines with 0.3 μm depth of focus are reported.
SVG Lithography (SVGL) has established and is executing a comprehensive program for the development of an advanced 157 nm Lithography Exposure System capable of processing 70 nm critical dimensions for three years now. This paper presents the approach, and details the present state of the challenges in the development of 157 nm lithography. It also describes the SVGL 157 nm program approach and provides some insight into the progress made to date addressing the challenges. Specific attention is paid to addressing 3 critical areas: Molecular contamination/purging, optical coating, and optical surfacing.
SVG Lithography (SVGL) has instigate da comprehensive program for the development of an advanced 157nm lithography exposure system of processing 70nm critical dimensions. This paper presents the need for 157nm technology to be an evolutionary approach and details the present state of the challenges in the development of 157nm lithography. It also describes the SVGL 157nm program approach and provides some insight into the progress made to date addressing the challenges.
Grading the refractive index period of a rugate is a technique for depositing broad band reflectors using rugate technology. The principle advantage of this technique is the ability to deposit long and short pass reflectors in parallel with other rugate spectral features and thus generate complex performance in a single optical film. Variation of the amplitude of the index profile as the period is changed allows for good edge definition for long or short pass designs. Several of these devices were fabricated and measured performance is presented. These devices demonstrate rugate properties of harmonic suppression and superposition with other rugate structures.
KEYWORDS: Control systems, Raman spectroscopy, Reflectivity, Refractive index, Optical filters, Gradient-index optics, Crystals, Fabrication, Control systems design, Signal detection
The wide range of optical thin film applications utilizing gradient index coatings has prompted the development of advanced optical control techniques. These include ellipsometric and photometric instruments capable of in-situ measurement of optical performance as the optical structure is being deposited. This paper discusses design sensitivity analysis and instrument configuration for development of a control strategy. The ability to measure optical thickness, refractive index and mechanical thickness is a function of several instrument parameters including wavelength, number of wavelengths, angle of incidence, and complexity of measurement surface. The most critical control data in the fabrication of a particular rugate design, and the instrument parameters and techniques employed and how they affect the control strategy is presented in this discussion.
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