KEYWORDS: Sensors, Monte Carlo methods, Electron beams, Signal detection, Lithography, Electron beam lithography, Detector arrays, Optical simulations, Semiconducting wafers, Silicon
Multiple-electron-beam-direct-write lithography is one of the promising candidates for next-generation lithography
because of its high resolution and ability of maskless operation. In order to achieve the throughput requirement for highvolume
manufacturing, miniaturized electro-optics elements are utilized in order to drive massively parallel beams
simultaneously. Electron beam drift problems can become quite serious in multiple-beam systems. Periodic recalibration
with reference markers on the wafer has been utilized in single-beam systems to achieve beam placement accuracy. This
technique becomes impractical with multiple beams. In this work, architecture of a two dimensional beam position
monitor system for multiple-electron-beam lithography is proposed. It consists of an array of miniaturized electron
detectors placed above the wafer to detect backscattered electrons. The relation between beam drift and distribution of
backscattered-electron trajectories is simulated by an in-house Monte Carlo electron-scattering simulator. Simulation
results indicate that electron beam drift may be effectively estimated from output signals of detector array with some
array signal processing to account for cross-coupling effects between beams.
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