Dr. Chiu Wing Hui Profile

Dr. Chiu Wing Hui

at GLOBALFOUNDRIES Singapore

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Author

Publications (9)

Proceedings Article | 28 March 2017 Paper

User-friendly design approach for analog layout design

Yongfu Li, Zhao Chuan Lee, Vikas Tripathi, Valerio Perez, Yoong Seang Ong, Chiu Wing Hui

Proceedings Volume 10148, 1014814 (2017) https://doi.org/10.1117/12.2258203

KEYWORDS: Transistors, Metals, Databases, Resistors, Lithium, Digital electronics, Error analysis, Capacitors, Analog electronics, Manufacturing, System on a chip, Semiconductors, Silicon, New and emerging technologies

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Proceedings Article | 28 March 2017 Presentation + Paper

Cutting-edge CMP modeling for front-end-of-line (FEOL) and full stack hotspot detection for advanced technologies

Ushasree Katakamsetty, Jiansheng Jansen Chee, Yongfu Li, Chiu Wing Hui, Yaodong Huang, Ernesto Gene de la Garza

Proceedings Volume 10148, 101480Q (2017) https://doi.org/10.1117/12.2262076

KEYWORDS: Chemical mechanical planarization, Front end of line, Metrology, Back end of line, Calibration, Silicon, Data modeling, Metals, Manufacturing, Oxides

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Proceedings Article | 16 March 2016 Paper

Hotspot detection and removal flow using multi-level silicon-calibrated CMP models

Ushasree Katakamsetty, Jansen Chee, Yongfu Li, Colin Hui, Jaime Bravo, Tamba Gbondo-Tugbawa, Brian Lee, Kuang-Han Chen, Aaron Gower-Hall, Sang-Min Han

Proceedings Volume 9781, 97810K (2016) https://doi.org/10.1117/12.2219545

KEYWORDS: Chemical mechanical planarization, Manufacturing, Design for manufacturability, Semiconducting wafers, Silicon, Etching, Product engineering, Design for manufacturing, Data modeling, Calibration, Copper, Back end of line, Metals

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Proceedings Article | 18 March 2015 Paper

Topography aware DFM rule based scoring for silicon yield modeling

Vikas Tripathi, Ushasree Katakamsetty, Sky Yeo, Colin Hui

Proceedings Volume 9427, 94270V (2015) https://doi.org/10.1117/12.2085733

KEYWORDS: Design for manufacturing, Chemical mechanical planarization, Silicon, Manufacturing, Failure analysis, Design for manufacturability, Metals, Chemical analysis, Lithography, Nanoimprint lithography

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Proceedings Article | 18 March 2015 Paper

20nm CMP model calibration with optimized metrology data and CMP model applications

Ushasree Katakamsetty, Dinesh Koli, Sky Yeo, Colin Hui, Ruben Ghulghazaryan, Burak Aytuna, Jeff Wilson

Proceedings Volume 9427, 94270U (2015) https://doi.org/10.1117/12.2085728

KEYWORDS: Chemical mechanical planarization, Data modeling, Metrology, Semiconducting wafers, Calibration, Manufacturing, Visualization, Metals, Polishing, Surface finishing

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Proceedings Article | 28 March 2014 Paper

Scanner correction capabilities aware CMP lithography hotspot analysis

Ushasree Katakamsetty, Hui Colin, Sky Yeo, Perez Valerio, Yang Qing, Quek Shyue Fong, Narayana Samy Aravind, Ruhm Matthias, Schiwon Roberto

Proceedings Volume 9053, 905312 (2014) https://doi.org/10.1117/12.2053035

KEYWORDS: Lithography, Chemical mechanical planarization, Scanners, Manufacturing, Design for manufacturability, Design for manufacturing, Surface finishing, Copper, Semiconducting wafers, Finite element methods

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Proceedings Article | 13 March 2009 Paper

Timing-aware metal fill for optimized timing impact and uniformity

Usha Katakamsetty, Colin Hui, Li-Da Huang, Lannie Weng, Peter Wu

Proceedings Volume 7275, 72751P (2009) https://doi.org/10.1117/12.816476

KEYWORDS: Metals, Copper, Chemical mechanical planarization, Surface finishing, Clocks, Silicon, Calibration, Information operations, Semiconductor manufacturing, Capacitance

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Proceedings Article | 13 March 2009 Paper

Hotspot detection and design recommendation using silicon calibrated CMP model

Colin Hui, Xian Bin Wang, Haigou Huang, Ushasree Katakamsetty, Laertis Economikos, Mohammed Fayaz, Stephen Greco, Xiang Hua, Subramanian Jayathi, Chi-Min Yuan, Song Li, Vikas Mehrotra, Kuang Han Chen, Tamba Gbondo-Tugbawa, Taber Smith

Proceedings Volume 7275, 72751R (2009) https://doi.org/10.1117/12.816556

KEYWORDS: Chemical mechanical planarization, Metals, Copper, Calibration, Data modeling, Manufacturing, Process modeling, Model-based design, Silicon, Physics

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Proceedings Article | 13 March 2009 Paper

Convergent automated chip level lithography checking and fixing at 45nm

Valerio Perez, Shyue Fong Quek, Sky Yeo, Colin Hui, Kuang Kuo Lin, Walter Ng, Michel Cote, Bala Kasthuri, Philippe Hurat, Matt Thompson, Chi-Min Yuan, Puneet Sharma

Proceedings Volume 7275, 72751S (2009) https://doi.org/10.1117/12.816593

KEYWORDS: Calibration, Lithography, Optical proximity correction, Critical dimension metrology, Silicon, Data modeling, Manufacturing, Scattering, Resolution enhancement technologies, Statistical modeling

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Showing 5 of 9 publications

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