Do-Youn Park
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 27 April 2023 Presentation + Paper
Proceedings Volume 12496, 124961N (2023) https://doi.org/10.1117/12.2656206
KEYWORDS: Semiconducting wafers, Defect inspection, Inspection, Yield improvement, Failure analysis, Electrical breakdown, Semiconductors, Manufacturing, Logic, Image classification

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