CONFERENCE PROCEEDINGS
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Fumihiko Fukunaga
at Hitachi High-Tech Corp
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Publications (3)
SPIE Journal Paper | 20 December 2018
In-die overlay metrology method using SEM images
Minoru Harada, Yohei Minekawa, Fumihiko Fukunaga, Koji Nakamae
JM3, Vol. 17, Issue 04, 044004, (December 2018) https://doi.org/10.1117/12.10.1117/1.JMM.17.4.044004
KEYWORDS: Overlay metrology, Scanning electron microscopy, Image segmentation, Sensors, Image processing, Semiconducting wafers, Detection and tracking algorithms, Electron beams, Signal to noise ratio, Lithography
Proceedings Article | 10 April 2013 Paper
In-die overlay metrology method using defect review SEM images
Jaehyoung Oh, Gwangmin Kwon, Daiyoung Mun, Hyungwon Yoo, Sungsu Kim, Tae hui Kim, Minoru Harada, Yohei Minekawa, Fumihiko Fukunaga, Mari Nozoe
Proceedings Volume 8681, 868111 (2013) https://doi.org/10.1117/12.2010728
KEYWORDS: Overlay metrology, Scanning electron microscopy, Semiconducting wafers, Sensors, Image segmentation, Image processing, Error analysis, Measurement devices, Detection and tracking algorithms, Metrology
Proceedings Article | 5 April 2012 Paper
Application of review-SEM to high-resolution inspection for 3xnm nodes
J. H. Oh, G. Kwon, D. Y. Mun, H. W. Yoo, Y. S. Choi, T. H. Kim, F. Fukunaga, S. Umehara, M. Nozoe
Proceedings Volume 8324, 83242P (2012) https://doi.org/10.1117/12.916244
KEYWORDS: Inspection, Image processing, Scanning electron microscopy, Defect detection, Sensors, Semiconductors, Image resolution, Bridges, Defect inspection, Image sensors
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