Typically, light emission from light-emitting diodes (LEDs) occurs under a broad range of angles. On the other hand, for a lot of applications a more directed light emission is desired. This can be realized with the use of additional optical elements, like lenses. Still, this may provide some complications in case of light sources consisting of a plurality of individual LEDs, e.g., a panel light, which is expected to illuminate a target area homogenously. Instead of a homogeneous illumination, the use of lenses is prone to give reason for an inhomogeneous light distribution in which the emission from the individual LEDs is easily distinguishable. Therefore, there is a strong request for alternative strategies of beam shaping of LED light in LED-luminaires targeting both on a directed as well as homogeneous illumination of an area. In this contribution we discuss an alternative approach in this regard: Firstly, a collimator is designed, which strongly directs the light emitted from a single LED light source. Subsequently, a foil with an optical structure, that can be fabricated in a cost-effective way by soft-lithography and which diffuses the collimated light again, is applied on the collimator. The optical structure and the respective amount of light diffusion are designed in a way that the desired radiation patterns both from a single as well as a plurality of LED sources can be realized. In addition, we show that the realization of a desired radiation profile is not the only advantage of such an approach. A key benefit of this concept is the possibility to reduce the angle dependent inhomogeneity
For a systematic approach to improve the white light quality of phosphor converted light-emitting diodes (LEDs) for general lighting applications it is imperative to get the individual sources of error for color temperature reproducibility under control. In this regard, it is imperative to understand how compositional, optical and materials properties of the color conversion element (CCE), which typically consists of phosphor particles embedded in a transparent matrix material, affect the constancy of a desired color temperature of a white LED source. In this contribution we use an LED assembly consisting of an LED die mounted on a printed circuit board (PCB) by chip-on-board technology and a CCE with a glob-top configuration as a model system and discuss the impact of potential sources for color temperature deviation among individual devices. Parameters that are investigated include imprecisions in the amount of materials deposition, deviations from the target value for the phosphor concentration in the matrix material, deviations from the target value for the particle sizes of the phosphor material, deviations from the target values for the refractive indexes of phosphor and matrix material as well as deviations from the reflectivity of the substrate surface. From these studies, some general conclusions can be drawn which of these parameters have the largest impact on color deviation and have to be controlled most precisely in a fabrication process in regard of color temperature reproducibility among individual white LED sources.
For a systematic approach to improve the white light quality of phosphor converted light-emitting diodes (LEDs) for general lighting applications it is imperative to get the individual sources of error for correlated color temperature (CCT) reproducibility and maintenance under control. In this regard, it is of essential importance to understand how geometrical, optical and thermal properties of the color conversion elements (CCE), which typically consist of phosphor particles embedded in a transparent matrix material, affect the constancy of a desired CCT value. In this contribution we use an LED assembly consisting of an LED die mounted on a printed circuit board by chip-on-board technology and a CCE with a glob-top configuration on the top of it as a model system and discuss the impact of the CCE shape and size on CCT constancy with respect to substrate reflectivity and thermal load of the CCEs. From these studies, some general conclusions for improved glob-top design can be drawn.
Color temperature constancy and color temperature maintenance are key issues in the context of the utilization of light-emitting diodes (LEDs) for general lighting applications. For a systematic improvement, it is imperative to understand how compositional, optical and thermal properties of the color conversion elements (CCE), which typically consist of phosphor particles embedded in a transparent matrix material, affect the constancy of a desired color temperature of a white LED source under operation. In particular, thermal stress, like a distinct thermal load of the CCEs under operation may also cause notable color shifts. In order to gain a better understanding of the thermal behavior of CCEs under operation, in this contribution we give by means of a combined optical and thermal simulation procedure a comprehensive discussion on the impact of different CCE shapes and sizes on their thermal responses.
Color constancy and color maintenance are key issues in the context of the utilization of light-emitting diodes (LEDs) for general lighting applications. For a systematic approach to improve the white light quality of phosphor converted LEDs and to fulfill the demands for color temperature reproducibility and constancy, it is imperative to understand how compositional, optical and thermal properties of the color conversion elements (CCE), which typically consist of a
phosphor particles embedded in a transparent matrix material, affect the correlated color temperature of a white LED
source. Based on a combined optical and thermal simulation procedure, in this contribution we give a comprehensive
discussion on the underlying coherences of light absorption, quantum efficiency and thermal conductivity and deduce
some strategies to minimize the temperature increase within the CCE in order to maintain acceptable color variations
upon device operation.
For a systematic approach to improve the white light quality of phosphor converted light-emitting diodes (LEDs) for
general lighting applications it is imperative to get the sources of error for color constancy under control. In this context,
it is essential to gain a deeper insight how the individual components of an LED package may contribute to color
deviation. Typically, both monochromatic and phosphor converted light-emitting diodes are finally encapsulated by a
pristine silicone layer in order to prevent mechanical damage of the LED packages. In this contribution we focus on the
shapes of such encapsulation layers and discuss, based on an optical simulation procedure, their impact on the color
temperatures of phosphor converted white LEDs as well as the ramifications of manufacturing imprecision of these
shapes on the constancy and reproducibility of a desired color temperature.
The increasing demand for miniaturization and design flexibility of polymer optical waveguides integrated into electrical
printed circuit boards (PCB) calls for new coupling and integration concepts.
We report on a method that allows the coupling of optical waveguides to electro-optical components as well as the
integration of an entire optical link into the PCB. The electro-optical devices such as lasers and photodiodes are
assembled on the PCB and then embedded in an optically transparent material. A focused femtosecond laser beam
stimulates a polymerization reaction based on a two-photon absorption effect in the optical material and locally increases
the refractive index of the material. In this way waveguide cores can be realized and the embedded components can be
connected optically. This approach does not only allow a precise alignment of the waveguide end faces to the
components but also offers a truly 3-dimensional routing capability of the waveguides.
Using this technology we were able to realize butt-coupling and mirror-coupling interface solutions in several
demonstrators. We were also manufacturing demonstrator boards with fully integrated driver and preamplifier chips,
which show very low power consumption of down to 10 mW for about 2.5 Gbit/s. Furthermore, demonstrators with
interconnects at two different optical layers were realized.
Over the last few years two-photon based photo-processes have become an important method to generate 3D
microstructures in organic materials without the use of masks and molds. The present work deals with the
fabrication of optical waveguides in a flexible polysiloxane matrix for data transmission on printed circuit boards
(PCB). In the developed system the waveguide core is formed by two-photon induced photo polymerization
(TPIP) of selected monomers, which are dissolved in a silicone matrix. Through the photo-induced
polymerization an interpenetrating network is generated, resulting in a refractive index change between the
illuminated waveguide cladding and the illuminated core material. Because of the optical transparency,
flexibility, chemical and thermal stability polysiloxanes were chosen as optical matrix material. Different types
of phenyl methacrylates with a high refractive index were used as monomers. In order to obtain a high contrast
in refractive index, the monomers were removed from non-illuminated regions in a vacuum process after laser
exposure. The written optical waveguides were evidenced by phase contrast microscopy, revealing an excellent
structuring behaviour of the developed material. Optical techniques e.g. cut-back measurements and light
extraction tests were applied to characterize the inscribed waveguide structures and to detect the resulting optical
loss. To determine the refractive index change upon UV-irradiation spectroscopic ellipsometry was applied.
Thus, a difference of Δn=0.02 between the non-illuminated cladding and the illuminated core material was
detected. Further, prototypes of optical interconnects on PCBs were fabricated by inscription of a waveguide
bundle between a mounted laser and photo diode, resulting in the desired increase of the transmitted
photocurrent after TPA structuring. In conclusion, the obtained results demonstrate that fully flexible optical
interconnects are accessible by the developed process.
The integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field due
to a continuously increasing demand for high data rates, along with a progressive miniaturization of
devices and components. For high-speed data transfer, materials and integration concepts are
searched for which enable high-speed short-range connections, accounting also for miniaturization,
and costs. Many concepts are discussed so far for the integration of optics in PCB: the use of
optical fibers, or the generation of waveguides by UV lithography, embossing, or direct laser writing.
Most of the concepts require many different materials and process steps. In addition, they also
need highly-sophisticated assembly steps in order to couple the optoelectronic elements to the
optical waveguides.
An innovative approach is presented which only makes use of only one individual inorganic-organic
hybrid polymer material to fabricate optical waveguides by
two-photon absorption (TPA) processes.
Particularly, the waveguides can be directly integrated on
pre-configured PCB by in situ positioning
the optical waveguides with respect to the mounted optoelectronic components by the TPA
process. Thus, no complex packaging or assembly is necessary, and the number of process steps
is significantly reduced, where the process fits ideally into the PCB fabrication process. The material
properties, the TPA processing of waveguides, and the integration concept will be discussed.
Recent experiments employing vertical-cavity surface-emitting lasers demonstrated data rates
exceeding 6 Gbit/s.
The integration of optical interconnections in printed circuit boards (PCBs) is an emerging field that arouses rapidly
growing interest worldwide. At present the key issue is to identify a technical concept, which allows for the realization of
optical interconnections that are compatible to existing PCB manufacturing processes. Above all, the material in which
the optical interconnections are embedded has to withstand increased temperatures and lamination pressures as well as
various wet chemistry processes.
AT&S uses so-called two-photon absorption (TPA) laser structuring - a rather new and innovative technology - to realize
optical circuits in a special polymer layer. In this case a near infrared laser is applied working in the femto-second
regime. The high photon density that can be reached in the laser's focus results in a modification of the optical polymer,
which is usually photosensitive in the UV-spectrum of light only. In our particular case, the refractive index of the
optical polymer is increased. Choosing the right laser intensity and focus propagation speed one achieves a waveguide
well embedded within the polymer layer, which has not been affected by the laser. In contrast to one-photon absorption,
which only allows a two dimensional respectively lateral modification of a polymer, this technology allows a
modification within the volume resulting in 3D-microstructures inside the polymer layer. Apart from the possibility to
realize structures in three dimensions, this TPA-technique has additional advantages. First of all, it allows one step
fabrication, which reduces costs and production time compared to etching procedures or conventional UV lithography
processes. Moreover, this technique allows varying the waveguide's cross section geometry and diameter simply varying
size and form of the structuring laser focus.
Whereas the realization of optical waveguides is not challenging anymore the coupling of waveguides with
optoelectronic components is rather delicate. That is, the waveguide's ends have to be accurately positioned close to the
emitting surface of the signal source and the sensing area of the light detector, respectively. Using the TPA technology to
structure optical waveguides AT&S has successfully evaluated a powerful method to solve this interface problem for the
realization of integrated optical interconnections (IOIs) on PCBs.
The development of integrated optical interconnections (IOIs) represents a quantum leap for the functionality of printed
circuit boards (PCBs). This new technology will allow highly complex product features and hence, higher product added
value. PCBs with optical interconnections will be used where applications call either for very high data streams between
components, modules or functional units (e.g. backplanes or multiprocessor boards) or for a space-saving design for
interconnection paths (e.g. mobile applications).
We discuss the different approaches towards integrating optical waveguides into PCBs and analyze the prerequisites for
a transfer to a product. Application scenarios for different markets are presented and steps proposed for required action
to deliver solutions that can be driven into a market.
In a second section a new and innovative concept for the integration of an optical interconnection system in PCBs is
presented. This revolutionary concept is highly supporting the worldwide trend towards miniaturization of not only
electronic but also optoelectronic systems in PCBs. The alignment of the optoelectronic components to the waveguides
has been addressed by this concept. It is shown that the process will allow the tolerances incurred in the manufacturing
processes to be dealt with in a separate process step, allowing existing standard methods for the production of electronic
interconnection systems to be used.
The availability of reliable ultrafast laser systems and their unique properties for material processing are the basis for new lithographic methods in the sector of micro- and nanofabrication processes such as two-photon 3D-lithography. Beside its flexibility, one of the most powerful features of this technology is the true 3D structuring capability, which allows fabrication with higher efficiency and with higher resolution compared to a sequential layer-by-layer structuring and build-up technique. Up to now, the two-photon method was mainly used for writing 3D structures quasi anywhere inside a bulk volume. In combination with a sophisticated and versatile machine vision support, the two-photon 3D-lithography is now targeting for micro- and nano-optical applications and the integration of optical and photonic components into optical microsystems.
We report on a disruptive improvement of this lithographic method by means of an optical detection system for optical components (e.g. laser diode chips / LEDs and photo diodes) that are already assembled on an optical micropackage. The detection system determines the position coordinates of features of the optical microsystem in all three dimensions with micrometer resolution, combining digital image processing and evaluation of back reflected laser light from the surface of the system. This information is subsequently processed for controlling the fabrication of directly laser written optical and photonic structures inside and around such an optical microsystem. The strong advantage of this approach lies in its adaptation of laser written structures to existing features and structures, which also permits to compensate for misalignments and imperfections of preconfigured packages.
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