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Hiroaki Kasai
at Hitachi Ltd
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Publications (1)
Proceedings Article | 10 April 2024 Presentation + Paper
Cu pad surface height evaluation technique by in-line SEM for wafer hybrid bonding
Proceedings Volume 12955, 129551N (2024) https://doi.org/10.1117/12.3008658
KEYWORDS: Copper, Semiconducting wafers, Scanning electron microscopy, Wafer bonding, Sensors, Atomic force microscopy, Signal detection, Image sensors, Chemical mechanical planarization, Target detection
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