Progress in photonics by monolithic integration for higher functional density, performance and reduced cost faces challenging hurdles due to technological and functional heterogeneities. Advanced local material growth techniques are enabling concepts towards high-density photonic integration, unprecedented performance and multi-functionality and ultimately optical systems-on-a-chip.
For example mode-locked laser diodes (MLLDs) are key devices for ultra-short pulse generation for all-optical Tbit/s communication networks. MLLDs suffer from material compromises and will benefit from the possibility to design the gain, absorber and passive-waveguiding sections independently. We have proposed and demonstrated the integration of a saturable absorber with a fast absorption recovery time based on an InP/InGaAsP uni-traveling-carrier structure (UTC) to achieve pulses below 1 ps with repetition rates up to 40 GHz. The use of the UTC absorber instead of the commonly employed reverse-biased gain material requires however the heterogeneous growth of multiple layer stacks on the same chip with the butt-coupled regrowth technique.Critical for the MLLD performance are the reflections and the optical coupling between the different monolithic integrated layer structures of passive, absorbing and amplifying sections. 2D FDTD simulations of the optical waveguides demonstrate that to minimize reflections an angled interface between the different structures is preferable and can lead to reflection coefficients as low as 10^-6. To obtain an angled interface we used a wet chemical etching process sequence of selective and non-selective etchants, which is sensitive to crystal orientation and yields a 55° tilted interface. In addition we can conclude from our simulations that in order to minimize both, insertion loss and reflections, a bending of the light guiding layers has to be prevented. Bendings can lead to measured losses of 5-7 dB per interface whereas correctly aligned light guiding layers results in losses of 1.5 dB and intensity reflections below 10^-5 per interface. The bendings originate from different growth rates near and far away from masked areas during regrowth due to reactants diffusion on the SiO2 mask. The bending can be minimized by optimizing the mask under etch of the SiO2 mask and low pressure MOVPE growth. We demonstrate operation of mode-locked laser diodes with an integrated UTC absorber and pulse durations below 1 ps.
The monolithic integration of photonic circuits will open new perspectives for optical communication networks. It will enable higher transmission rates, new functionalities, higher functional densities, leading to all-optical networks and reduced cost for telecommunication. Mode-locked laser diodes (MLLDs) will play an important role for short pulse generation in Tb/s networks for the transmitters, as well as for clock recovery for the receivers and optical regenerators. To overcome the limitations of conventional monolithically integrated MLLDs, where the pulse width is limited by the relatively slow absorption recovery, we demonstrate an ultrafast semiconductor saturable absorber based on the uni-traveling-carrier (UTC) concept. The UTC absorber is designed to be monolithically integrated in InGaAsP/InP mode-locked laser diodes grown by MOVPE. The absorber shows a saturation energy of Esat,abs of 1pJ at 1.55μm and a voltage-dependent recovery time of 2ps at 2V reverse bias. The importance of an optimum absorption-bandgap to absorber-length ratio is demonstrated to keep the saturation energy low. The voltage-dependent absorption and absorption recovery time make this absorber ideal for hybrid mode-locking and synchronization to an external RF-source.
Monolithic photonic integration offers unsurpassed perspectives for higher functional density, new functions, high per-formance, and reduced cost for the telecommunication. Advanced local material growth techniques and the emerging photonic crystal (PhC) technology are enabling concepts towards high-density photonic integration, unprecedented per-formance, multi-functionality, and ultimately optical systems-on-a-chip. In this paper, we present our achievements in photonic integration applied to the fabrication of InP-based mode-locked laser diodes capable of generating optical pulses with sub-ps duration using the heterogeneous growth of a new uni-traveling carrier ultrafast absorber. The results are compared to simulations performed using a distributed model including intra-cavity reflections at the sections inter-faces and hybrid mode-locking. We also discuss our work on InP-based photonic crystals (PhCs) for dense photonic integration. A combination of two-dimensional modeling for functional optimization and three-dimensional simulation for real-world verification is used. The fabricated structures feature more than 3.5μm deep holes as well as excellent pattern-transfer accuracy using electron-beam lithography and advanced proximity-effects correction. Passive devices such as waveguides, 60° bends and power splitters are characterized by means of the end-fire technique. The devices are also investigated using scanning-near field optical microscopy. The PhC activity is extended to the investigation of TM bandgaps for all-optical switches relying on intersubband transitions at 1.55μm in AlAsSb/InGaAs quantum wells.
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