High-resolution three-dimensional (3-D) imaging (stereo imaging) by endoscopes in minimally invasive surgery, especially in space-constrained applications such as brain surgery, is one of the most desired capabilities. Such capability exists at larger than 4-mm overall diameters. We report the development of a stereo imaging endoscope of 4-mm maximum diameter, called Multiangle, Rear-Viewing Endoscopic Tool (MARVEL) that uses a single-lens system with complementary multibandpass filter (CMBF) technology to achieve 3-D imaging. In addition, the system is endowed with the capability to pan from side-to-side over an angle of ±25 deg, which is another unique aspect of MARVEL for such a class of endoscopes. The design and construction of a single-lens, CMBF aperture camera with integrated illumination to generate 3-D images, and the actuation mechanism built into it is summarized.
Damage detection technology needs improvement for aerospace engineering application because detection within
complex composite structures is difficult yet critical to avoid catastrophic failure. Damage detection is challenging
in aerospace structures because not all the damage detection technology can cover the various defect types
(delamination, fiber fracture, matrix crack etc.), or conditions (visibility, crack length size, etc.). These defect states
are expected to become even more complex with future introduction of novel composites including nano-/microparticle
reinforcement. Currently, non-destructive evaluation (NDE) methods with X-ray, ultrasound, or eddy
current have good resolutions (< 0.1 mm), but their detection capabilities is limited by defect locations and
orientations and require massive inspection devices. System health monitoring (SHM) methods are often paired with
NDE technologies to signal out sensed damage, but their data collection and analysis currently requires excessive
wiring and complex signal analysis. Here, we present a capacitance sensor-based, structural defect detection
technology with improved sensing capability. Thin dielectric polymer layer is integrated as part of the structure; the
defect in the structure directly alters the sensing layer’s capacitance, allowing full-coverage sensing capability
independent of defect size, orientation or location. In this work, capacitance-based sensing capability was
experimentally demonstrated with a 2D sensing layer consisting of a dielectric layer sandwiched by electrodes.
These sensing layers were applied on substrate surfaces. Surface indentation damage (~1mm diameter) and its
location were detected through measured capacitance changes: 1 to 250 % depending on the substrates. The damage
detection sensors are light weight, and they can be conformably coated and can be part of the composite structure.
Therefore it is suitable for aerospace structures such as cryogenic tanks and rocket fairings for example. The sensors
can also be operating in space and harsh environment such as high temperature and vacuum.
Studies have shown that stereo images improve surgeons' visuomotor tasks and therefore constructively affect the outcome of a minimally invasive surgery. Stereo images are captured by a stereo endoscope, which consists commonly of duplicate lens systems. However, stereo images can also be captured by a single lens system following a dual aperture scheme (DAS). DAS creates two spatially separated optical channels by placing a dual aperture plate in the limiting aperture of a single lens system. This paper describes efforts to miniaturize the DAS-based imaging system for use in minimally invasive surgery. To demonstrate feasibility, a prototype was fabricated using lens elements 3 mm in diameter and was tested for its stereo depth effect (SDE). The SDE of the prototype was then compared to a duplicate lens system that was constructed theoretically in the same diameter as the 3-mm prototype. The results show that the prototype yields 4/7 of the SDE of the theoretical model. However, the SDE of the prototype provides sufficient SDE, in a viewing range of 1 to 2.5 cm from the lens, for minimally invasive surgery.
We present a technique for imaging full-color 3-D images with a single camera in this paper. Unlike a typical 3-D-imaging system comprising two independent cameras each contributing one viewpoint, the technique presented here creates two viewpoints using a single-lens camera with a bipartite filter whose bandpass characteristics are complementary to each other. The bipartite filter divides the camera's limiting aperture into two spatially separated apertures or viewpoints that alternately image an object field using filter-passband matched, time-sequenced illumination. This technique was applied to construct a 3-D camera to image scenes at a working distance of 10 mm. We evaluated the effectiveness of the 3-D camera in generating stereo images using statistical comparison of the depth resolutions achieved by the 3-D camera and a similar 2D camera arrangement. The comparison showed that the complementary filters produce effective stereopsis at prescribed working distances.
There are many advantages to minimally invasive surgery (MIS). An endoscope is the optical system of choice by the
surgeon for MIS. The smaller the incision or opening made to perform the surgery, the smaller the optical system needed.
For minimally invasive neurological and skull base surgeries the openings are typically 10-mm in diameter (dime sized)
or less. The largest outside diameter (OD) endoscope used is 4mm. A significant drawback to endoscopic MIS is that it
only provides a monocular view of the surgical site thereby lacking depth information for the surgeon. A stereo view
would provide the surgeon instantaneous depth information of the surroundings within the field of view, a significant
advantage especially during brain surgery.
Providing 3D imaging in an endoscopic objective lens system presents significant challenges because of the tight
packaging constraints. This paper presents a promising new technique for endoscopic 3D imaging that uses a single lens
system with complementary multi-bandpass filters (CMBFs), and describes the proof-of-concept demonstrations
performed to date validating the technique. These demonstrations of the technique have utilized many commercial off-the-
shelf (COTS) components including the ones used in the endoscope objective.
JPL has developed high performance cold cathodes using arrays of carbon nanotube bundles that produce > 15
A/cm2 at applied fields of 5 to 8 V/μm without any beam focusing. They have exhibited robust operation in poor
vacuums of 10-6 to 10-4 Torr- a typically achievable range inside hermetically sealed microcavities. Using these
CNT cathodes JPL has developed miniature X-ray tubes capable of delivering sufficient photon flux at acceleration
voltages of <20kV to perform definitive mineralogy on planetary surfaces; mass ionizers that offer two orders of
magnitude power savings, and S/N ratio better by a factor of five over conventional ionizers. JPL has also
developed a new class of programmable logic gates using CNT vacuum electronics potentially for Venus in situ
missions and defense applications. These "digital" vacuum electronic devices are inherently high-temperature
tolerant and radiation insensitive. Device design, fabrication and DC switching operation at temperatures up to
700° C are presented in this paper.
Meeting the requirement of endurance and mission duration is one of the major challenges in the design of
micro-autonomous vehicles. Various power source options and their properties for micro-autonomous
vehicles are reviewed. Strategies to maximize the mission duration within the constraints of mass and
volume for micro-autonomous vehicles are discussed. This paper explores the use of hybridization,
multifunctional integration concepts, elimination of ancillary components and operational strategies as
means of achieving the endurance goals for micro-autonomous vehicles.
A carbon nanotube-based thermal conductivity vacuum gauge is described which utilizes 5-10 μm long diffusively
contacted SWNTs for vacuum sensing. By etching the thermal SiO2 beneath the tubes and minimizing heat conduction
through the substrate, pressure sensitivity was extended toward higher vacuums. The pressure response of unannealed
and annealed devices was compared to that of released devices. The released devices showed sensitivity to pressure as
low as 1 x 10-6 Torr. The sensitivity increased more dramatically with power for the released device compared to that of
the unreleased device. Low temperature electronic transport measurements of the tubes were suggestive of a thermally
activated hopping mechanism where the activation energy for hopping was calculated to be ~ 39 meV.
JPL has developed high performance cold cathodes using arrays of carbon nanotube bundles that routinely produce > 15 A/cm2 at
applied fields of 5 to 8 V/μm without any beam focusing. They have exhibited robust operation in poor vacuums of 10-6 to 10-4
Torr- a typically achievable range inside hermetically sealed microcavities. A new double-SOI process to monolithically integrate
gate and additional beam tailoring electrodes has been developed. These electrodes are designed according to application
requirements making carbon nanotube field emission sources application specific (Application Specific electrode-Integrated
Nanotube Cathodes or ASINCs). ASINCs, vacuum packaged using COTS parts and a reflow bonding process, when tested after 6-month shelf life have shown little emission degradation. Lifetime of ASINCs is found to be affected by two effects- a gradual
decay of emission due to anode sputtering, and dislodging of CNT bundles at high fields (> 10 V/μm). Using ASINCs miniature X-ray
tubes and mass ionizers have been developed for future XRD/XRF and miniature mass spectrometer instruments for lander
missions to Venus, Mars, Titan, and other planetary bodies.
A carbon nanotube-based high current density electron field emission source is under development at Jet Propulsion Laboratory (JPL) for submillimeter-wave power generation (300 GHz to 3 THz). This source is the basis for a novel vacuum microtube component: the nanoklystron. The nanoklystron is a monolithically fabricated reflex klystron with dimensions in the micrometer range. The goal is to operate this device at much lower voltages than would be required with hot-electron sources and at much higher frequencies than have ever been demonstrated. Both single-walled (SWNTs) as well as multi-walled nanotubes (MWNTs) are being tested as potential field-emission sources. This paper presents initial results and observations of these field emission tests. SWNTs and MWNTs were fabricated using standard CVD techniques. The tube density was higher in the case of MWNT samples. As previously reported, high-density samples suffered from enhanced screening effect thus decreasing their total electron emission. The highest emission currents were measured from disordered, less dense MWNTs and were found to be ~0.63 mA @ 3.6 V/μm (sample 1) and ~3.55 mA @ 6.25 V/μm (sample 2). The high density vertically aligned MWNTs showed low field emission as predicted: 0.31 mA @ 4.7 V/μm.
This paper presents a rapid replication technique for polydimethylsiloxane (PDMS) high aspect ratio microstructures (HARMs) and a pattern transfer technique for replication of metallic HARMs on other substrates (such as circuit containing substrates) using such replicated PDMS HARMs. A high aspect ratio metallic micromold insert, featuring a variety of test microstructures made of electroplated nickel, has been fabricated by the standard deep X-ray lithography (DXRL) process. Mixed pre-polymer PDMS with a curing agent has been cast onto the metallic micromold insert test patterns to create replicated polymeric HARMs. The replicated PDMS HARMs could be used to massively reproduce high aspect ratio metallic microstructures on other substrates using a pattern transfer technique. In order to demonstrate the concept, an experiment has been carried out to attach the replicated PDMS HARMs onto a silicon substrate which has pre-deposited photoresist and metallic seed layer. Electrodeposition has been carried out through the attached PDMS HARMs mold followed by the subsequent removal of the PDMS, resulting in high aspect ratio metallic microstructures on the silicon substrate. This technique could be used to massively reproduce metallic HARMs on circuit containing substrates to create 3-D integrated MEMS devices.
A novel device to directly integrate mechanical motion with electronics on a chip for system integration is designed and fabricated. The device is a laterally movable gate field effect transistor. Here the gate moves parallel to the substrate surface rather than perpendicular to its as in the moving gate transistors reported earlier. Lateral motion results in linear response of device drain current with gate motion. It also makes large motion possible. The device has a variety of applications in smart sensors, actuators and integrated smart systems. A simple fabrication process is developed that is compatible with fabrication of high-aspect ratio structures. The latter give distinct performance improvement. The basic principles of operation of the LMGFET is demonstrate din initial measurements. This, to our knowledge, is the first report on the operation of such a device.
The Center for Advanced Micro structures and Devices (CAMD) at Louisiana State University supports one of the strongest programs in synchrotron radiation micro fabrication in the USA and, in particular, in deep x-ray lithography. Synchrotron radiation emitted form CAMD's bending magnets has photon energies in the range extending from the IR to approximately 20 keV. CAMD operates at 1.3 and 1.5 GeV, providing characteristic energies of 1.66 and 2.55 keV, respectively. CAMD bending magnets provide a relatively soft x-ray spectrum that limits the maximal structure height achievable within a reasonable exposure time to approximately 500 micrometers . In order to extend the x-ray spectrum to higher photon energies, a 5 pole 7T superconducting wiggler was inserted in one of the straight sections. A beam line and exposure station designed for ultra deep x-ray lithography was constructed and connected to the wiggler. First exposures into 1 mm and 2 mm thick PMMA resist using a graphite mask with 40 micrometers thick gold absorber has been completed.
In thick photoresist applications, commercially available acrylic sheets are bonded to a substrate as an alternative to the casting and in-situ polymerization of PMMA. The factors affecting the adhesion of a thick acrylic sheet to different substrates have been studied. In case of copper and titanium substrates and bond-strength can be improved by roughening the surface through chemical oxidation which then provides a mechanical interlocking between the resist and substrate surfaces. Annealing of PMMA sheet before gluing and use of adhesion promoter such as organosilane further improves the bond strength at the resist-substrate interface. The resist adhesion to various substrates is evaluated by measuring the debonded length of the acrylic sheet during a mechanical cleaving test.
An exposure radiation power measurement technique utilizing thin gold film thermal sensors has been presented. The sensory system of the power meter (or calorimeter) consists of three interlaced serpentine resistors covering an area of 6 cm by 0.4 cm, functioning as a thermal sensor, a heater and a shielding electrode. The measurement principle is based on recording the change in resistance of the sensor due to heating under radiation and internal calibration. The interlaced gold sensors were fabricated using optical lithography on a 100 mm diameter silicon wafer. The power measurements have been performed at CAMD/LSU 1.3 - 1.5 GeV synchrotron source, on a 'white light' beamline (Emax approximately 4 keV). The measurement results agree with calculations within approximately 4%. The relaxation time of the calorimeter response was 90 seconds in vacuum (10-4Torr) and 18 seconds in 25 Torr helium. The power from a UV lamp of an ORIEL optical exposure station was measured using an interlaced thermal sensor and a commercial calorimeter. The results agree within 2%.
Temperature measurements of thick PMMA resist during X-ray (1 to 5 keV) exposure are presented in this paper. Thin metal (gold) film thermal sensors were fabricated directly on the resist surface and on the resist/substrate interface using micro-lithography methods. The temperature measurements were conducted in vacuum (< 10-4 Torr) and in 1 to 25 Torr helium pressure--conditions corresponding to typically X-ray lithography exposure. The results of temperature rise measurements performed with thermal sensors and with miniature conventional thermocouples are compared.
Conventional resist application techniques are based on spinning a resist layer onto a mechanically dominating substrate. As thicker imaging layers are required, the integrity of the resist/substrate system is influenced by the resist thickness. The traditional LIGA approach is to form a PMMA resist sheet on the substrate by casting using a press. This method causes high stresses in the resist and at the resist/substrate interface. Another method consists of gluing or bonding a PMMA sheet with subsequent machining to a desired thickness. The stresses can be high enough to cause the resist to crack and/or separate from the substrate. In this paper, alternative and improved techniques are presented. One of these is a modified multiple coating spin-on method, suitable for producing PMMA resist thickness of 60-80 micrometers . The other method is based on bonding a solid PMMA sheet of desired thickness using an appropriate solvent. These techniques produce uniform PMMA layers with thicknesses ranging from 5 micrometers to 1500 micrometers and above. A mechanical cleaving test was used to estimate the resist/substrate bond strength and characterize the bonding solvents. Issues such as radiation swelling and thickness losses associated with latent image formation in PMMA are addressed.
Design, fabrication, and testing of thermal micro-sensors suitable for miniature and microscopic systems, for application on thin films (free standing or on substrates) as temperature sensors are presented in this paper. The sensors utilize the electrical resistivity temperature dependence of a metal. Using micro-lithography methods, several sets of gold resistors were fabricated in the form of flat 30 to 250 nm thick wires, 7 - 10 micrometers wide, and several cm long in a serpentine shape covering approximately 1.0 mm2. These sensors have demonstrated better than 0.001 degree(s) C sensitivity. The electrical resistivity and its thermal coefficient of a thin gold metal film were compared with those of bulk material. Temperature measurements on Si wafers were performed in situations corresponding to x-ray lithography exposure conditions suitable for micromachining. The temperature rise and relaxation time of a silicon wafer during x-ray exposure were measured in vacuum and different He gas pressures.
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