Cleaving of glass substrates with shaped edges using a laser-only concept is presented. In a first laser process shaped ultrashort laser pulses modify in a single pass the entire material thickness with arbitrary edge shape geometries. Afterwards in a second pass CO2 laser radiation is absorbed in the modified area and resulting stresses lead to the separation of the glass. We investigate the quality of the achieved edges and corresponding mechanical properties. The cutting strategy, so far conducted on straight contours, is successfully transferred to curved contours maintaining edge qualities.
Simulations and measurements on selective laser etching of display glasses are reported. By means of a holographic 3D beam splitter, ultrashort laser pulses are focused inside the volume of a glass sample creating type III modifications along a specific trajectory like pearls on a string. Superimposed by a feed of the glass sample a full 3D area of modifications is achieved building the cornerstone for subsequent etch processes. Based on KOH the modifications are selectively etched at a much higher rate compared to unmodified regions resulting in a separation of the glass along the trajectory of modifications. For gaining further insight into the etch process, we perform simulations on this wet chemical process and compare it to our experimental results.
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