Mr. Jih-Hsien Yeh Profile

Jih-Hsien Yeh

Technical Manager at United Microelectronics Corp

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Publications (6)

Proceedings Article | 5 April 2007 Paper

Use of in-line AFM as LWR verification tool in 45nm process development

Ming Hsun Hsieh, Kun Ho Shi, J. H. Yeh, Ruei Hung Hsu, Mingsheng Tsai, S. F. Tzou

Proceedings Volume 6518, 651833 (2007) https://doi.org/10.1117/12.712537

KEYWORDS: Critical dimension metrology, Line width roughness, Transmission electron microscopy, Optical proximity correction, Atomic force microscopy, Error analysis, Nondestructive evaluation, Semiconductors, Line edge roughness, Scanning electron microscopy

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Proceedings Article | 21 March 2007 Paper

Novel technique to separate systematic and random defects during 65nm and 45nm process development

J. H. Yeh, Allen Park

Proceedings Volume 6521, 652114 (2007) https://doi.org/10.1117/12.711512

KEYWORDS: Scanning electron microscopy, Semiconducting wafers, Defect inspection, Inspection, Yield improvement, Defect detection, Classification systems, Metrology, Microelectronics, Neodymium

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Proceedings Article | 24 March 2006 Paper

Leakage monitoring and control with an advanced e-beam inspection system

Hermes Liu, J. H. Yeh, Chan Lon Yang, S. C. Lei, J. Y. Kao, Y. D. Yang, Mingsheng Tsai, S. F. Tzou, Wei-Yih Wu, Hong-Chi Wu, Hong Xiao, Jack Jau

Proceedings Volume 6152, 615249 (2006) https://doi.org/10.1117/12.656207

KEYWORDS: Semiconducting wafers, Inspection, Scanning electron microscopy, Diffusion, Nickel, Tungsten, Defect detection, Failure analysis, Control systems, Defect inspection

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Proceedings Article | 24 March 2006 Paper

In-line monitoring of advanced copper CMP processes with picosecond ultrasonic metrology

Ming Hsun Hsieh, J. H. Yeh, Mingsheng Tsai, Chan Lon Yang, John Tan, Sean Patrick Leary

Proceedings Volume 6152, 61522C (2006) https://doi.org/10.1117/12.660205

KEYWORDS: Copper, Picosecond phenomena, Ultrasonics, Semiconducting wafers, Chemical mechanical planarization, Polishing, Transmission electron microscopy, Metrology, Signal detection, Sensors

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Proceedings Article | 24 March 2006 Paper

High-resistance W-plug monitoring with an advance e-beam inspection system

Hermes Liu, J. H. Yeh, Chan Lon Yang, S. C. Lei, J. Y. Kao, Y. D. Yang, Mingsheng Tsai, S. F. Tzou, Wei-Yih Wu, Hong-Chi Wu, Hong Xiao, Jack Jau

Proceedings Volume 6152, 61524A (2006) https://doi.org/10.1117/12.656217

KEYWORDS: Inspection, Scanning electron microscopy, Semiconducting wafers, Transmission electron microscopy, Defect detection, Resistance, Electron microscopes, Tungsten, Failure analysis, Electron beams

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Proceedings Article | 24 March 2006 Paper

Using in-line AFM to monitor STI profile in 65-nm technology development

Ming Hsun Hsieh, J. H. Yeh, Mingsheng Tsai, Chan Lon Yang

Proceedings Volume 6152, 615235 (2006) https://doi.org/10.1117/12.656170

KEYWORDS: Atomic force microscopy, Transmission electron microscopy, Scanning electron microscopy, Etching, Nondestructive evaluation, Semiconducting wafers, Silicon, Oxides, Process control, Photodiodes

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Showing 5 of 6 publications

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