Dr. Junyan Dai Profile

Dr. Junyan Dai

at Applied Materials Inc

SPIE Involvement:

Author

Publications (11)

Proceedings Article | 11 December 2009 Paper

High Si content anti-reflective coatings and their extension to a UV freeze dual patterning process

Joseph Kennedy, ZeYu Wu, Kyle Flanigan, Junyan Dai, Thomas Wallow

Proceedings Volume 7520, 75200O (2009) https://doi.org/10.1117/12.837205

KEYWORDS: Ultraviolet radiation, Photoresist materials, Optical lithography, Semiconducting wafers, Silicon, Double patterning technology, Optical properties, Lithography, Photoresist developing, Chemistry

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Proceedings Article | 1 April 2009 Paper

Photoresist stabilization for double patterning using 172 nm photoresist curing

Thomas Wallow, Junyan Dai, Charles Szmanda, Hiram Cervera, Chi Truong, Nikolaos Bekiaris, Jong-Wook Kye, Ryoung-Han Kim, Harry Levinson, Glen Mori

Proceedings Volume 7273, 72730D (2009) https://doi.org/10.1117/12.814468

KEYWORDS: Photoresist processing, Semiconducting wafers, Double patterning technology, Ultraviolet radiation, Photoresist materials, Image processing, Optical lithography, Lithography, Fourier transforms, Antireflective coatings

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Proceedings Article | 1 April 2009 Paper

Performance of an ArF siloxane BARC exposed to a 172-nm UV cure for double patterning applications

Ze-Yu Wu, Joseph Kennedy, Song-Yuan Xie, Ron Katsanes, Kyle Flanigan, Junyan Dai, Nikolaos Bekiaris, Hiram Cervera, Glen Mori, Thomas Wallow

Proceedings Volume 7273, 72731I (2009) https://doi.org/10.1117/12.814416

KEYWORDS: Ultraviolet radiation, Photoresist materials, Optical lithography, Semiconducting wafers, Double patterning technology, Silicon, Optical properties, FT-IR spectroscopy, Lithography, Time division multiplexing

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Proceedings Article | 15 April 2008 Paper

A lithographic and process assessment of photoresist stabilization for double-patterning using 172-nm photoresist curing

Nikolaos Bekiaris, Hiram Cervera, Junyan Dai, Ryoung-han Kim, Alden Acheta, Thomas Wallow, Jongwook Kye, Harry Levinson, Thomas Nowak, James Yu

Proceedings Volume 6923, 692321 (2008) https://doi.org/10.1117/12.774205

KEYWORDS: Photoresist processing, Photoresist materials, Double patterning technology, Ultraviolet radiation, Floods, Lithography, Semiconducting wafers, Optical lithography, Coating, Printing

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Proceedings Article | 15 April 2008 Paper

Wafer shape compensation at the track PEB for improved CD uniformity

Timothy Michaelson, Junyan Dai, Lu Chen, Hiram Cervera, Brian Lue, Harald Herchen, Kim Vellore, Nikolaos Bekiaris

Proceedings Volume 6923, 69233M (2008) https://doi.org/10.1117/12.772894

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Particles, Lithography, Scanners, Scanning electron microscopy, Wafer testing, Lutetium, Metrology, Silicon films

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Proceedings Article | 4 May 2005 Paper

Materials for future lithography

Seung Wook Chang, Da Yang, Junyan Dai, Nelson Felix, Daniel Bratton, Kousuke Tsuchiya, Young-Je Kwark, Juan-Pablo Bravo-Vasquez, Christopher Ober, Heidi Cao, Hai Deng

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.607235

KEYWORDS: Glasses, Line edge roughness, Extreme ultraviolet lithography, Electron beam lithography, Lithography, Extreme ultraviolet, Polymers, Silicon, Chemical elements, Molecules

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Proceedings Article | 19 January 2005 Paper

The convergence of top-down and bottom-up nanofabrication: formation of 3D structures

Da Yang, Junyan Dai, Mingqi Li, Christopher Ober

Proceedings Volume 5592, (2005) https://doi.org/10.1117/12.580239

KEYWORDS: Lithography, Electron beam lithography, X-ray lithography, Etching, X-rays, Absorption, Resistance, Extreme ultraviolet lithography, Ion beam lithography, Electrons

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Proceedings Article | 14 May 2004 Paper

Novel resists with non-traditional compositions for EUV lithography

Junyan Dai, Christopher Ober

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.534319

KEYWORDS: Polymers, Etching, Boron, Resistance, Oxygen, Extreme ultraviolet lithography, Silicon, Transparency, Contamination, Extreme ultraviolet

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Proceedings Article | 12 June 2003 Paper

Synthesis and evaluation of novel organoelement resists for EUV lithography

Junyan Dai, Christopher Ober, Sang-Ouk Kim, Paul Nealey, Victoria Golovkina, Jangho Shin, Lin Wang, Franco Cerrina

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485116

KEYWORDS: Polymers, Silicon, Extreme ultraviolet lithography, Etching, Line edge roughness, Extreme ultraviolet, Resistance, Reactive ion etching, Oxygen, Boron

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Proceedings Article | 24 July 2002 Paper

Organoelement resists for EUV lithography

Junyan Dai, Christopher Ober, Lin Wang, Franco Cerrina, Paul Nealey

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474197

KEYWORDS: Polymers, Silicon, Etching, Reactive ion etching, Extreme ultraviolet, Extreme ultraviolet lithography, Oxygen, Boron, Resistance, Chemical species

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Proceedings Article | 24 July 2002 Paper

Applicaton of blends and side chain Si-O copolymers as high-etch-resistant sub-100-nm e-beam resists

Wu-Song Huang, Ranee Kwong, Wayne Moreau, Robert Lang, David Medeiros, Karen Petrillo, Arpan Mahorowala, Marie Angelopoulos, Qinghuang Lin, Junyan Dai, Christopher Ober

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474242

KEYWORDS: Etching, Polymers, Silicon, Lithography, Resistance, Mask making, Polymer thin films, Atomic force microscopy, Surface roughness, Chromium

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Showing 5 of 11 publications

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