Based on uncooled infrared microbolometer focal plane array technology, an uncooled THz microbolometer detector with 25um pixel pitch and 160×120 array size was developed. The CTIA read-out integrated circuit was designed and manufactured with 0.25um standard CMOS process. The resonant cavity height of the micro-bridge pixel was increased from about 1.5um to about 23um to enhance the absorption in the THz wavelengthes. The increased resonant cavity height was realized with tungsten plug and CMP process above the aluminum reflector. The THz detector was packaged with ceramic hermetic package, a parylene coating was developed on high resistivity silicon window to increase the THz transmission. The developed THz detector was applied in beam profiling of QCL, LN crystal sources etc.
Uncooled infrared focal plane array (UIRFPA) detectors are widely used in industrial thermography cameras, night vision goggles, thermal weapon sights, as well as automotive night vision systems. To meet the market requirement for smaller pixel pitch and higher resolution, we have developed a 17um pitch 640x480 UIRFPA detector. The detector is based on amorphous silicon (a-Si) microbolometer technology, the readout integrated circuit (ROIC) is designed and manufactured with 0.35um standard CMOS technology on 8 inch wafer, the microbolometer is fabricated monolithically on the ROIC using an unique surface micromachining process developed inside the company, the fabricated detector is vacuum packaged with hermetic metal package and tested. In this paper we present the design, fabrication and testing of the 17um 640x480 detector. The design trade-off of the detector ROIC and pixel micro-bridge structure will be discussed, by comparison the calculation and simulation to the testing results. The novel surface micromachining process using silicon sacrificial layer will be presented, which is more compatible with the CMOS process than the traditional process with polyimide sacrificial layer, and resulted in good processing stability and high fabrication yield. The performance of the detector is tested, with temperature equivalent temperature difference (NETD) less than 60mK at F/1 aperture, operability better than 99.5%. The results demonstrate that the detector can meet the requirements of most thermography and night vision applications.
Zhejiang Dali Technology Co. Ltd. is one of the major players in the China Infrared industry. The company has been working on infrared imagers using uncooled FPAs for about 15 years. It started the research and development of uncooled microbolometer detectors since 2006, and has brought several uncooled detectors into mass production, including 35um 384x288, 25um 160x120, 384x288, 640x480, and 17um 384x288, 640x480. In this presentation, we will describe the uncooled infrared detector and imager development at DALI Technology.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.