Mr. Miho Yamaguchi Profile

Miho Yamaguchi

at Merck Electronics Ltd

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 1 December 2022 Poster + Paper

Study on rinse material for pattern collapse mitigation in EUV lithography

Kazuma Yamamoto, Hiroshi Yanagita, Maki Ishii, Miho Yamaguchi, Rikio Kozaki

Proceedings Volume 12292, 122920T (2022) https://doi.org/10.1117/12.2643712

KEYWORDS: Capillaries, Extreme ultraviolet lithography, Critical dimension metrology, Lithography, Photoresist processing, Materials processing, Extreme ultraviolet, Coating

Read Abstract +

Extreme ultraviolet (EUV) lithography is part of the high-volume manufacturing (HVM) processes for devices beyond 7 nm node. However, the technology still has several issues for HVM. Especially, RLS (Resolution, LWR, and Sensitivity) trade-off remains as one of the obvious problems for EUV Lithography. In which, resist pattern collapse is one of the hurdles that is preventing a process window/margin for resist patterning. Resist, under-layer, and rinse materials are continuously being developed to mitigate resist pattern collapse. In such status, rinse materials for chemically amplified resist (CAR) in the development process are known well as one approach for mitigation of the pattern collapse. In this study, we focused on the effectiveness of rinse material against lithography performance with parameters, such as surface tension and affinity with resist. In the paper, Rinse material considering low surface tension and low affinity with resist exhibited significant pattern collapse mitigation and wide process window at 28nm pitch. In addition to the rinse study, a new rinse process was investigated focusing on resist surface modification for more pattern collapse mitigation than the conventional process by suppression of water droplet generation. Furthermore, New rinse process exhibited better pattern collapse margin than the conventional rinse process.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years