Thin film flexible electronics refer to a class of electronic devices built on flexible substrates. Examples includes printed Li batteries, Thin film flexible electronics refer to a class of electronic devices manufactured by multiple layering and scribing on flexible polymer substrates. Examples of such devices includes printed Li batteries, flexible photovoltaic cells and light emitting diodes. These devices are often mass manufactured by Roll-to-Roll processing (R2R). Whilst the basic technology is well established, the increasing demands on precision environmental protection and multi layering of devices means that in-process measurement of printed surface features is a critical bottle neck in terms of developing R2R as a process route. The purpose of the present paper is to review the current critical dimensional metrology needs in R2R manufacture and in particular to highlight the development of a new inprocess surface metrology system based on Multi-wavelength Polarizing Interferometry (MPI). The system is capable of measurement in real time, is environmentally robust and has nanometre resolution. The paper concludes by highlighting an example of the first trial implementation of the MPI on a production level R2R machine and discussed issues with quantification of film dimensions and associated signal processing
The line-scan dispersive interferometry (LSDI) benefits from single-shot measurement in nature and has potential to perform in-line surface metrology. In this technique, the interference beam produced by the two arms of the interferometer is spatially dispersed by a diffraction grating along the rows (or columns) of the CCD pixels. In which case, a two-dimensional spectral interferogram is generated. In this paper, fringe order determination is carried out to retrieve the more accurate phase information along the chromaticity axis of the interferogram and then the height map of the tested profile can be calculated with high resolution. Two standard artefacts have been evaluated using the developed LSDI and the experimental results are compared with that of phase slope method as well as the commercial instrument (Talysurf CCI 3000), which shows that better performance in measurement noise is achieved. Additionally, the measurement repeatability is significantly improved and demonstrated within sub-nanometer range.
Embedded metrology is the provision of metrology on the manufacturing platform, enabling measurement without the
removal of the work piece. Providing closer integration of metrology upon the manufacturing platform can lead to the
better control and increased throughput. In this work we present the development of a high precision hybrid optical chip
interferometer metrology device. The complete metrology sensor system is structured into two parts; optical chip and
optical probe. The hybrid optical chip interferometer is based on a silica-on-silicon etched integrated-optic motherboard
containing waveguide structures and evanescent couplers. Upon the motherboard, electro-optic components such as
photodiodes and a semiconductor gain block are mounted and bonded to provide the required functionality. The key
structure in the device is a tunable laser module based upon an external-cavity diode laser (ECDL). Within the cavity is a
multi-layer thin film filter which is rotated to select the longitudinal mode at which the laser operates. An optical probe,
which uses a blazed diffracting grating and collimating objective lens, focuses light of different wavelengths laterally
over the measurand. Incident laser light is then tuned in wavelength time to effectively sweep an ‘optical stylus’ over the
surface. Wavelength scanning and rapid phase shifting can then retrieve the path length change and thus the surface
height. We give an overview of the overall design of the final hybrid photonic chip interferometer, constituent
components, device integration and packaging as well as experimental test results from the current version now under
evaluation.
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