Peng Suo
at Applied Materials South East Asia Pte Ltd
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 9 April 2024 Presentation + Paper
Proceedings Volume 12957, 129570X (2024) https://doi.org/10.1117/12.3010203
KEYWORDS: Lithography, Packaging, Polyimides, Materials properties, Electrical properties, Dielectrics, Image processing, Film thickness, Chemical mechanical planarization, Advanced packaging

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