The packaging of high speed Photonic Integrated Circuits (PICs) should maintain the electrical signal integrity. The standard packaging of high speed PICs relies on wire bonds. This is not desirable because wire bonds degrade the quality of the electrical signal. The research presented in this paper proposes to replace wire bonds with an interposer with multilevel transmission lines. By attaching the PIC by flip chip onto the interposer, the use of wire bonds is avoided. The main concern for designing an interposer with multilevel transmission lines is the vertical transition, which must be designed to avoid return and radiation losses. In this paper, a novel design of a high speed vertical transition for Low Temperature Co-fired Ceramic (LTCC) is presented. The proposed vertical transition is simpler than others recently published in the literature, due to eliminating the need for additional ceramic layers or air cavities. A LTCC board was fabricated with several variations of the presented transition to find the optimal dimensions of the structure. The structures were fabricated then characterized and have a 3 dB bandwidth of 37 GHz and an open eye diagram at 44 Gbps. A full wave electromagnetic simulation is described and compared with good agreement to the measurements. The results suggest that an LTCC board with this design can be used for 40 Gbps per channel applications. Keywords: Photonics packaging, Low Temperature Co-Fired Ceramics.
Designing photonic integrated circuits (PICs) with packaging in mind is important since this impacts the performance of the final product. In coherent optical communication applications there are a large number of DC and RF lines that need routed to connect the PIC to the outer packaging. These RF lines should be impedance matched to the devices, isolated from each other, low loss and protected against electromagnetic interference (EMI) over the frequency range of interest to achieve the performance required for the application. Multilevel low temperature co-fired ceramic (LTCC) boards can be used as a carrier board connecting the PIC to the packaging due to its good RF performance, machinability, compatibility with hermetic sealing, and ability to integrate drivers into the board. Flexibility with layer numbers enables additional layers for shielding against electromagnetic interference or increased space for routing electrical connections. In this paper the design, simulations, and measured results for a set of 4 phase matched transmission lines in LTCC that would be used with an IQ MZM are presented. The measured 3dB bandwidth for a set of four phase matched transmission lines for an IQ MZM was measured to be 19.8 GHz.
To compensate for velocity mismatch in travelling wave opto-electronic devices, the microwave velocity of the propagating RF signal is reduced by introducing capacitively loaded elements. For high speed operation, these elements must be electrically isolated from one another, which is typically achieved by using ion-implantation to render the p-doped material non-conducting. We propose and demonstrate through optical and electrical simulations that ion-implantation can be avoided by using a quasi-shallow etch to electrically isolate the capacitive elements. High isolation can be achieved using such an etch without introducing additional losses to the propagating optical signal.
We present the design of a smart multiple-mode indoor optical wireless system that combines line-of-sight (LOS) and non-LOS optical wireless methods to smartly adapt to changes in environment and application. The proposed design is able to operate in three optical wireless modes called directed LOS, non-directed LOS, and diffuse non-LOS. These modes smartly accommodate for changes in the number of users and their mobility, along with providing optimal light coverage area and increased robustness to receive light blocking. Experiments for the first time demonstrate the use of multimode light sources in the proposed smart links using electronically controlled variable focal length lenses. Specifically demonstrated is a visible 670-nm multimode laser-based directed LOS link with variable range of 0.2 to 1.5 m and a 650-nm LED-based nondirected LOS link with variable range of 0.2 to 1.1 m. Compared to nonsmart links, these smart links demonstrate an improvement in the received optical power of 1.7× and 2.1× for the laser and LED links, respectively.
This paper presents a novel, non-intrusive, non-contact object boundary mapping sensor using a Digital Micromirror
Device (DMD) and real-time pixel processing. The presented sensor is ideal for use in environments where brightly
illuminated or radiating objects are in a hazardous environment such as in environments with radiation, heat, cold,
harmful machine parts, etc. Experimental results demonstrate the boundary mapping sensor for a rectangular target and a
multi-square target illuminated by visible wavelengths.
Presented is a novel design of a multimode laser beam analyzer to enable beam measurements of minimum beam waist
size, minimum waist location, divergence and the beam propagation parameter called M2. Experimental results
demonstrate these measurements for a 532 nm multimode test laser beam.
This paper presents a non-intrusive, non-contact object distance mapping sensor using an Electronically Controlled
Variable Focus Lens (ECVFL). The proposed sensor is a free-space-based optical sensor that uses ECVFL-based agile
optics to direct light from a object that requires terrain height mapping. The presented compact design makes the
proposed sensor ideal for use in environments where laser illuminated objects are in a hazardous environment such as in
environments with radiation, heat, cold, harmful machine parts, etc. The proposed design uses a few optical components
and smart detection optics for making its object distance/terrain measurements. The presented sensor can find potential
remote sensing applications in ground and space vehicle maneuvering, machine parts inspection and in chemical,
transportation and aerospace industries.
Precise knowledge of laser beam parameters is a key requirement in many photonics applications including
for lasers and optics used in the transportation industry. This paper reports on a novel motion-free laser
beam characterization system using electronically agile digital and analog photonics such as a Digital
Micromirror Device (DMD) and an analog variable focal length lens. The proposed system has the
capability of measuring all the parameters of a laser beam including minimum waist size, minimum waist
location, beam divergence and the beam propagation parameter (M2). Experimental results demonstrate the measurement of the minimum beam waist size and location for a test 633 nm fundamental mode Gaussian laser beam. The system is also applicable for imaging of arbitrary beams including non-laser beams.
To the best of our knowledge, proposed is the first liquid lens technology-based 1x2 fiber optic switch using a single Electronically Controlled Variable Focus Lens (ECVFL). By controlling the focal length of the liquid ECVFL, the input optical beam is spatially adjusted to couple into the respective output fiber port. The switch demonstrates a 3-dB bandwidth of 175.67 nm, with a center frequency of 1550 nm, and features low power consumption suitable for mobile applications. The proposed switch can be useful in communication and control systems, in roadway sensor systems, vehicle detection systems, and monitoring systems.
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