Dr. Po-Hao A. Huang Profile

Dr. Po-Hao A. Huang

Faculty at Univ of Arkansas

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Proceedings Article | 6 April 2012 Paper

Swell-based in situ oxide removal methods for PDMS-copper particle composite corrosion sensing elements

Teng Yang, Feng Pan, Jeremy Hutson, Keerthi Srinivas, Jerry King, Douglas Spearot, Adam Huang

Proceedings Volume 8345, 83454Y (2012) https://doi.org/10.1117/12.915456

KEYWORDS: Particles, Carbon dioxide, Oxides, Composites, Liquids, Etching, Metals, Chemical elements, Copper, Cameras

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A micro-corrosion sensor technology utilizing PDMS (polydimethylsiloxane) and micro/nano -metal particles, as the sensing element, was proposed and currently under-development. One of the key challenges encountered is the removal of the native oxides inherently existing on the metal particles. Numerous techniques were experimented to counter this problem, with swell-based protocols being identified as the most promising solution. Swelling of the composite enhances the diffusion of oxide etchants into and etched oxides out of the material matrix. Two different swelling characterizations, utilizing liquid-based solvents and supercritical CO2 emersions, will be presented here. In terms of compatibility, common microfabrication solvents were used to evaluate the former, while supercritical CO2 is often used in the release of stiction sensitive microstructures. Both methods are classified as low temperature techniques (less than 100 degrees Celcius). Commonly, the composite exhibits a swelling ratio of 10-20%, exhibiting more sensitive to the percentage content of the metal particles albeit well below those reported in literature for pure cross -linked PDMS. The swelling time-constant is found to be on the order of minutes (CO2) to tens of minutes (liquid solvent) while oxide removal for cubed coupons with 6.35mm on each side is on the order of hours. Also in both cases, the oxide etching performance is dependent on the amount of dilation of the material and the mixing compatibility between the swelling agent and the etchant (such as acetic acid and hexafluoroacetylacetone, respectively for copper oxides). The etch

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