The backend optical assembly module for a space-based, laser communication terminal is presented. The backend optical assembly utilizes voice coil-fast steering mirror technology embedded into a control loop that both provides terminal-level pointing capability, and maintains receive channel fiber coupling. The fast steering mirror technology presents a technical solution for operating within the space environment, while simultaneously meeting the bandwidth requirements for characteristic satellite vibration profiles. The system’s architecture design meets the demands of onplatform, jitter-rejection performance to establish and maintain a communication link.
The main driving force for High Operating Temperature (HOT) detectors is the strong need for low cost, compact IR imaging solution capable of supporting a wide range of military and civilian applications. In the HOT regime where imagers can be cooled with multi-stage thermoelectric coolers, the major portion of the cost is due to the die-level back-end process, from the chip hybridization to final packaging. We present here an approach to achieve significant cost reduction of MWIR imagers by monolithically integrating III-V devices directly on Silicon substrates for wafer-scale fabrication and packaging of focal plane arrays (FPAs). High quality InAs films can be grown on a blanket Silicon wafer by metal-organic chemical vapor deposition (MOCVD) in a low growth temperature regime that complies with the thermal budget of the Si-electronics. High Resolution Transmission Electron Microscopy reveals predominantly oriented, single-crystal-like InAs films, with Σ3(111) twin boundaries, which our band structure calculations predict to be electrically benign. More intriguingly, selective-area growth on SiO2-masked ROIC-like templates is demonstrated with single-crystal-like InAs film nucleation at small Si(001) openings, together with the suppression of unwanted deposition on the dielectric mask. High crystallinity lateral epitaxial overgrowth of the InAs islands and film coalescence is achieved, enabling the potential to fully cover the entire patterned substrate. MBE-grown MWIR devices (λcut-off = 4.1 μm) on blanket InAs/Si templates exhibit a dark current of 2x10-5 A/cm2 , a specific detectivity of 6x1011 Jones and a quantum efficiency (QE) above 60% at 100K. The QE remains constant at high temperatures (<200K) where the dark current approaches that of baseline single-crystal HOT devices grown on native substrates At 230K, it is 6x10-2 A/cm2, yielding a specific detectivity of 1010 Jones.
Recent advances over the last several years in III-V strained-layer superlattice-based infrared detectors have lead this material system to emerge as a solid alternative to HgCdTe for dual-band focal plane arrays (FPAs). Rapid development of superlattice-based detectors has been realized by capitalizing on mature, III-V foundry-compatible processing. Furthermore, superlattice-based epitaxial wafers exhibit a high degree of lateral uniformity with low macroscopic defect densities (< 50 cm-2) and can achieve dark current levels comparable to HgCdTe detectors. In this paper, we review our recent efforts towards producing HD-format (1280x720, 12 μm pitch) superlattice-based, dual-band MWIR/LWIR FPAs. For a representative FPA, characterization was conducted in a pour-fill dewar at 80K, f/3 and using a blackbody range of 22°C to 32°C. For the MWIR band, the noise equivalent temperature difference (NETD) was 14.9 mK with a 3x median NETD operability of 99.91%. For the LWIR band, the median NETD was 28.1 mK with a 3x median NETD operability of 99.66%. To illustrate the manufacturability of superlattice technology, we will present results on 1280x720, 12 μm pitch MWIR/LWIR FPAs built over the last year at HRL through multiple fabrication lots utilizing 4" epiwafers.
Barrier detectors based on III-V materials have recently been developed to realize substantial improvements in the performance of mid-wave infrared (MWIR) detectors, enabling FPA performance at high operating temperatures. The relative ease of processing the III-V materials into large-format, small-pitch FPAs offers a cost-effective solution for tactical imaging applications in the MWIR band as an attractive alternative to HgCdTe detectors. In addition, small pixel (5-10μm pitch) detector technology enables a reduction in size of the system components, from the detector and ROIC chips to the focal length of the optics and lens size, resulting in an overall compactness of the sensor package, cooling and associated electronics. To exploit the substantial cost advantages, scalability to larger format (2kx2k/10μm) and superior wafer quality of large-area GaAs substrates, we have fabricated antimony based III-V bulk detectors that were metamorphically grown by MBE on GaAs substrates. The electro-optical characterization of fabricated 2kx2k/10μm FPAs shows low median dark current (3 x 10-5 A/cm2 with λco = 5.11μm or 2.2 x 10-6 A/cm2 with λco = 4.6μm) at 150K, high NEdT operability (3x median value) >99.8% and >60% quantum efficiency (non-ARC). In addition, we report our initial result in developing small pixel (5μm pitch), high definition (HD) MWIR detector technology based on superlattice III-V absorbing layers grown by MBE on GaSb substrates. The FPA radiometric result is showing low median dark current (6.3 x 10-6 A/cm2 at 150K with λco = 5.0μm) with ~50% quantum efficiency (non-ARC), and low NEdT of 20mK (with averaging) at 150K. The detector and FPA test results that validate the viability of Sb-based bulk and superlattice high operating temperature MWIR FPA technology will be discussed during the presentation.
Recent advances in superlattice-based infrared detectors have rendered this material system a solid alternative to HgCdTe for dual-band sensing applications. In particular, superlattices are attractive from a manufacturing perspective as the epitaxial wafers can be grown with a high degree of lateral uniformity, low macroscopic defect densities (< 50 cm-2) and achieve dark current levels comparable to HgCdTe detectors. In this paper, we will describe our recent effort on the VISTA program towards producing HD-format (1280x720, 12 μm pitch) superlattice based, dual-band MWIR/LWIR FPAs. We will report results from several multi-wafer fabrication lots of 1280x720, 12 μm pitch FPAs processed over the last two years. To assess the FPA performance, noise equivalent temperature difference (NETD) measurements were conducted at 80K, f/4.21 and using a blackbody range of 22°C to 32°C. For the MWIR band, the NETD was 27.44 mK with a 3x median NETD operability of 99.40%. For the LWIR band, the median NETD was 27.62 mK with a 3x median operability of 99.09%. Over the course of the VISTA program, HRL fabricated over 30 FPAs with similar NETDs and operabilities in excess of 99% for both bands, demonstrating the manufacturability and high uniformity of III-V superlattices. We will also present additional characterization results including blinkers, spatial stability, modulation transfer function and thermal cycles reliability.
We describe our recent results in developing and maturing small pixel (5μm pitch), high definition (HD) mid-wave infrared (MWIR) detector technology as well as focal-plane-array (FPA) hybrids, and prototype 2.4 Megapixel camera development operating at high temperature with low dark current and high operability. Advances in detector performance over the last several years have enabled III-V high operating temperature (T≥150K), unipolar detectors to emerge as an attractive alternative to HgCdTe detectors. The relative ease of processing the materials into large-format, small-pitch FPAs offers a cost-effective solution for tactical imaging applications in the MWIR band. In addition, small pixel detector technology enables a reduction in size of the system components, from the detector and ROIC chips to the focal length of the optics and lens size, resulting in an overall compactness of the sensor package, cooling and associated electronics. An MBE system has been used to grow antimony-based detector structures with 5.1μm cutoff with low total thickness variation (TTV) across a 3” wafer, in order to realize high interconnect yield for small-pitch FPAs. A unique indium bump scheme is proposed to realize 5μm pitch arrays with high connectivity yield. Several 1kx2k /5μm hybrids have been fabricated using Cyan’s CS3 ROICs with proper backend processing and finally packaged into a portable Dewar camera. The FPA radiometric result is showing low median dark current of 2.3x10-5 A/cm2 with > 99.9% operability, and >60% QE (without AR coating).
InAsSb material with a cutoff wavelength in the 5 μm range has been grown on GaAs substrates. The MWIR InAsSb detector arrays were fabricated and hybridized to a ROIC to permit measurement of the electrical and optical properties of detectors. Detector arrays were fabricated in a 1024 x 1024 format on an 18 μm pitch. A fanout was utilized to directly acquire data from a set of selected detectors without an intervening read out integrating circuit (ROIC). Variable temperature Jdark vs Vd measurements have been made with the dark current density ~ 10-5 A/cm2 at 150 K. The external QE measured using a narrow band filter centered at ~ 4 μm had values in the 65 – 70 % range. Since the detectors were illuminated through a GaAs substrate, which has a reflectance of 29%, the internal QE is greater than 90%. A 1024 x 1024 ROIC on an 18 μm pitch was also designed and fabricated to interface with the barrier detectors. The ROIC operates at 30 Hz frame rate and has a well capacity of 20.7 M electrons. QE at 150 K for a 1024 x 1024 detector array hybridized to a ROIC had a median D* at 150 K under a flux of 1.07 x 1015 ph/(cm2/s) was 1.2 x 1011 cm Hz1/2 /W. The NEdT was 44 mK and imagery was obtained at 150 K using an f/2.3 MWIR lens.
InAsSb material with a cutoff wavelength in the 5 μm range has been grown on GaAs substrates. The MWIR
InAsSb detector arrays were fabricated and hybridized to fanouts and ROICs to permit measurement of the
electrical and optical properties of detectors. Detector arrays were fabricated in a 1024 x 1024 format on an 18
μm pitch. A fanout was utilized to directly acquire data from a set of selected detectors without an intervening
read out integrating circuit (ROIC). Variable temperature Jdark vs Vd measurements have been made with the
dark current density ~ 10-5 A/cm2 at 150 K. The external QE measured using a narrow band filter centered at ~ 4 μm had values in the 65 - 70 % range. Since the detectors were illuminated through a GaAs substrate
which has a reflectance of 29%, the internal QE is greater than 90 %.
A 1024 x 1024 ROIC on an 18 μm pitch was also designed and fabricated to interface with the barrier
detectors. The ROIC operates at 30 Hz frame rate and has a well capacity of 20.7 M electrons. QE at 150 K
for a 1024 x 1024 detector array hybridized to a ROIC had a median D* at 150 K under a flux of 1.07 x 1015
ph/(cm2/s was 1.2 x 1011 cm Hz1/2 /W. The NEdT was 44 mK and imagery was obtained at 150 K using an f/2.3 MWIR lens.
Mid-wavelength infrared (MWIR) InAsSb alloy barrier detectors grown on GaAs substrates were characterized as a function of temperature to evaluate their performance. Detector arrays were fabricated in a 1024 × 1024 format on an 18 μm pitch. A fanout was utilized to directly acquire data from a set of selected detectors without an intervening read out integrating circuit (ROIC). The detectors have a cutoff wavelength equal to ~ 4.9 μm at 150 K. The peak internal quantum efficiency (QE) required a reverse bias voltage of 1 V. The detectors were diffusion-limited at the bias required to attain peak QE. Multiple 18 μm × 18 μm detectors were tied together in parallel by connecting the indium bump of each detector to a single large metal pad on the fanout. The dark current density at -1 V bias for a set of 64 × 64 and 6 × 6 array of detectors, each of which were tied together in parallel was ~ 10-3 A/cm2 at 200 K and 5 × 10-6 A/cm2 at 150 K. The 4096 (64 × 64) and 36 (6 × 6) detectors, both have similar Jdark vs Vd characteristics, demonstrating high operability and uniformity of the detectors in the array. The external QE measured using a narrow band filter centered at ~ 4 μm had values in the 65 – 70 % range. Since the detectors were illuminated through a GaAs substrate which has a reflectance of 29%, the internal QE is greater than 90 %. A 1024 × 1024 ROIC on an 18 μm pitch was also designed and fabricated to interface with the barrier detectors. QE at 150 K for a 1024 × 1024 detector array hybridized to a ROIC matched the QE measured on detectors that were measured directly through a fanout chip. Median D* at 150 K under a flux of 1.07 × 1015 ph/(cm2/s was 1.0 x 1011 cm Hz1/2 /W.
We describe our recent efforts in developing visible to mid-wave (0.5 µm to 5.0 µm) broadband photon-trap InAsSb-based infrared detectors grown on GaAs substrates operating at high temperature (150-200K) with low dark current and high quantum efficiency. Utilizing an InAsSb absorber on GaAs substrates instead of an HgCdTe absorber will enable low-cost fabrication of large-format, high operating temperature focal plane arrays. We have utilized a novel detector design based-on pyramidal photon trapping InAsSb structures in conjunction with compound barrier-based device architecture to suppress both G-R dark current, as well as diffusion current through absorber volume reduction. Our optical simulation show that our engineered pyramid structures minimize the surface reflection compared to conventional diode structures acting as a broadband anti-reflective coating (AR). In addition, it exhibits > 70-80% absorption over the entire 0.5 µm to 5.0 µm spectral range while providing up to 3× reduction in absorber volume. Lattice-mismatched InAs0.82Sb0.18 with 5.25 µm cutoff at 200K was grown on GaAs substrates. 128×128/60μm and 1024×1024/18μm detector arrays that consist of bulk absorber as well as photon-trap pyramid structures were fabricated to compare the detector performance. The measured dark current density for the diodes with the pyramidal absorber was 3× lower that for the conventional diode with the bulk absorber, which is consistent with the volume reduction due to the creation of the pyramidal absorber topology. We have achieved high D* (< 1.0 x 1010 cm √Hz/W) and maintain very high (< 80 %) internal quantum efficiency over the entire band 0.5 to 5 µm spectral band at 200K.
In InAs1-xSbx material alloy composition was adjusted to achieve 200K cutoff wavelengths in the 5 μm
range. Reflectance was minimized and absorption in the InAs1-xSbx material maximized by the use of
pyramid shaped structures fabricated in the InAs1-xSbx material which function as an AR coating.
Compound-barrier (CB) detectors were fabricated and tested for optical response and dark current density
versus bias measurements were acquired as a function of temperature. For 5 μm cutoff detectors, QE is
high, ~ 75 % between 4.0 μm and 4.6 μm and > 80 % between 2.0 μand 4.0 μm, demonstrating the
efficacy of the pyramids as photon trap structures and as a replacement for multi-layer AR-coatings. Jdark
in the low 10-3 A/cm2 range at 200 K and low 10-5 A/cm2 range at 150 K was measured at the bias at
which the QE peaked.
Recent efforts in developing InAs/GaSb strained-layer superlattices for LWIR detectors are
described. The structural properties of the devices grown by MBE at HRL were evaluated using
optical microscopy, x-ray diffraction, and atomic force microscopy. Epilayer roughness and surface
morphology are briefly described. Small format focal plane arrays were fabricated to serve as a
baseline for device study, and to determine the effects of underfill epoxy on detector performance. A
novel approach for epilayer transfer on silicon is also presented.
The Photon-Trap Structures for Quantum Advanced Detectors (PT-SQUAD) program requires MWIR
detectors at 200 K. One of the ambitious requirements is to obtain high (> 80 %) quantum efficiency over
the visible to MWIR spectral range while maintaining high D* (> 1.0 x 1011 cm √Hz/W) in the MWIR. A
prime method to accomplish the goals is by reducing dark diffusion current in the detector via reducing
the volume fill ratio (VFR) of the detector while optimizing absorption. Electromagnetic simulations
show that an innovative architecture using pyramids as photon trapping structures provide a photon
trapping mechanism by refractive-index-matching at the tapered air/semiconductor interface, thus
minimizing the reflection and maximizing absorption to > 90 % over the entire visible to MWIR spectral
range. InAsSb with bandgap appropriate to obtaining a cutoff wavelength ~ 4.3 μm is chosen as the
absorber layer. An added benefit of reducing VFR using pyramids is that no AR-coating is required.
Compound-barrier (CB) detector test structures with alloy composition of the InAsSb absorber layer
adjusted to achieve 200 K cutoff wavelength of 4.3 μm (InAsSb lattice-matched to GaSb). Dark current
density at 200 K is in the low 10-4 A/cm2 at Vd = -1.0 V. External QE ~ 0.65 has been measured for
detectors with a Si carrier wafer attached. Since illumination is through the Si carrier wafer that has a
reflectance of ~ 30 %, this results in an internal QE > 0.9.
InAs/GaSb-based type II superlattices (T2SL) offer a manufacturable FPA technology
with FPA size, scalability and cost advantages over HgCdTe. Work at Jet Propulsion
Laboratory (JPL), Naval Research Laboratory (NRL), and Northwestern University
(NWU) has shown that the performance gap between HgCdTe and T2SL FPAs has
narrowed to within 5-10x over the last two years1,2,3. Due to the potential of T2SL
technology for fabrication of large format (> 1k x1k) and dual-band arrays, HRL has
recently resurrected efforts in this area4. We describe the progress on the FastFPA
program funded by the Army Night Vision Labs towards the development of detectors
and focal plane arrays (FPAs). Progress made in the areas of MBE growth, mesa diode
fabrication, dry etch processing, and FPA fabrication over the last one year is presented.
We have evaluated selective doping techniques for the fabrication of type II LWIR superlattice planar
detectors. Ion-implantation and diffusion of dopants were evaluated for selective doping of the electrical
junction region in planar photodiodes. Residual damage remains when superlattice structures are implanted
with Te ions with an energy of 190 keV and a dose of 5x1013 cm-2, at room temperature. Controlled Zn
diffusion profiles with concentrations from 5x1016 to > 5x1018 cm-3 in the wide bandgap cap layer was
achieved through a vapor phase diffusion technique. Planar p-on-n diodes were fabricated using selective
Zn diffusion. The I-V characteristics were leaky due to G-R and tunneling in the homojunction devices, for
which no attempts were made to optimize the n-type absorber doping level. Work is underway for the
implementation of planar diodes with the n-on-p architecture through selective Te diffusion. Due to
increased minority carrier lifetimes for p-type InAs/GaSb superlattice absorber layers, planar device with
the n-on-p architecture have the potential to provide improved performance as compared to the p-on-n
counterparts.
J. Asbrock, S. Bailey, D. Baley, J. Boisvert, G. Chapman, G. Crawford, T. de Lyon, B. Drafahl, J. Edwards, E. Herrin, C. Hoyt, M. Jack, R. Kvaas, K. Liu, W. McKeag, R. Rajavel, V. Randall, S. Rengarajan, J. Riker
Advanced LADAR receivers enable high accuracy identification of targets at ranges beyond standard EOIR sensors. Increased sensitivity of these receivers will enable reductions in laser power, hence more affordable, smaller sensors as well as much longer range of detection. Raytheon has made a recent breakthrough in LADAR architecture by combining very low noise ~ 30 electron front end amplifiers with moderate gain >60 Avalanche Photodiodes. The combination of these enables detection of laser pulse returns containing as few as one photon up to 1000s of photons. Because a lower APD gain is utilized the sensor operation differs dramatically from traditional "Geiger mode APD" LADARs. Linear mode photon counting LADAR offers advantages including: determination of intensity as well as time of arrival, nanosecond recovery times and discrimination between radiation events and signals. In our talk we will present an update of this development work: the basic amplifier and APD component performance, the front end architecture, the demonstration of single photon detection using a simple 4 × 4 SCA and the design and evaluation of critical components of a fully integrated photon counting camera under development in support of the Ultra-Sensitive Detector (USD) program sponsored by AFRL-Kirtland.
We are developing a passive W-band millimeter wave imaging array that operates without the use of RF low noise
amplifiers. The work is supported by the DARPA MIATA program. Previously reported Phase I results were a noise
equivalent temperature difference (NETD) of 4.8°K. The goal of Phase II, currently underway, is to decrease this to 2°K
or less. There are two improvements that must be made to achieve the goal. The square law diode detector sensitivity
and the RF bandwidth reaching the detector must be increased significantly. This paper mainly deals with the first issue,
the effort to increase the sensitivity by decreasing the diode area and capacitance, using electron beam lithography.
Brief mention will be made of the redesign of the antenna-to-diode transition that simulations indicate will provide a
doubling of bandwidth from 30 to 60 GHz.
Since its initial synthesis and investigation more than 40 years ago, the HgCdTe alloy semiconductor system has evolved into one of the primary infrared detector materials for high-performance infrared focal-plane arrays (FPA) designed to operate in the 3-5 mm and 8-12 mm spectral ranges of importance for thermal imaging systems. Over the course of the past decade, significant advances have been made in the development of thin-film epitaxial growth techniques, such as molecular-beam epitaxy (MBE), which have enabled the synthesis of IR detector device structures with complex doping and composition profiles. The central role played by in situ sensors for monitoring and control of the MBE growth process are reviewed. The development of MBE HgCdTe growth technology is discussed in three particular device applications: avalanche photodiodes for 1.55 +m photodetection, megapixel FPAs on Si substrates, and multispectral IR detectors.
Significant progress has been made in the technology for MBE growth of HgCdTe infrared focal-plane arrays on Si substrates since the initial demonstration of MBE HgCdTe-on- Si heteroepitaxy in 1989. In 1995, the first all-MBE-grown detector arrays on Si were produced through direct MBE growth of (112)B-oriented II-VI films on Si without III-V initiation layers, culminating in detector performance comparable to LPE-grown detectors on bulk CdZnTe substrates. This achievement was enabled by the development of two key contributing technologies: CdTe on Si buffer layer growth and HgCdTe p-on-n double-layer heterojunction growth using p-type chemical doping with As. The MBE process for deposition of high crystalline quality CdTe buffer layers has been developed so that x-ray rocking curve FWHM less than 75 arc-sec and near-surface etch pit densities (EPD) of 2 multiplied by 106 cm-2 are routinely achievable for 9-micrometer-thick CdTe buffer layers. The dependence of CdTe EPD on ZnTe initiation layer thickness, insertion of CdTe/CdZnTe strained layer superlattices, and thermal cycling to cryogenic temperatures has been investigated and is reviewed. HgCdTe baselayers deposited by MBE on these CdTe/Si composite substrates exhibit x-ray FWHM as low as 72 arc-sec and EPD of 3 - 20 multiplied by 106 cm-2. To demonstrate the potential for MBE growth of large-area HgCdTe FPAs on Si, detectors with 78 K cutoff wavelength of 7.8 micrometer have been fabricated in this HgCdTe/Si epitaxial material with array-average R0A product of 1.64 multiplied by 104 (Omega) -cm2 (0 FOV).
To achieve the DoD objective of low cost high performance infrared focal plane arrays a manufacturing technique is required which is intrinsically flexible with respect to device configuration and cutoff wavelength and easily scaleable with respect to volume requirements. The approach adopted is to fully develop the technology of molecular beam epitaxy (MBE) to a level where detector array wafers with a variety of configurations can be fabricated with first pass success at a reduced cost. As a vapor phase process, MBE lends itself directly to: (1) the inclusion of real-time monitoring and process control, (2) a single or multiple wafer growth mode, (3) nearly instantaneous changes in growth parameters. A team has been assembled to carry out the program. It is composed of four industrial organizations -- Rockwell International, Hughes Aircraft Company, Texas Instruments, and Lockheed-Martin, and a university -- Georgia Tech Research Institute. Since team members are committed suppliers and users of IRFPAs, technology transfer among team members is accomplished in real-time. The technical approach has been focused on optimizing the processes necessary to fabricate p-on-n HgCdTe double layer heterostructure focal plane arrays, reducing process variance, and on documenting flexibility with respect to cutoff wavelength. Two device structures have been investigated and fabricated -- a 480 by 4 and a 128 by 128.
HgCdTe MBE technology offers many advantages for the growth of multi-layer heterojunction structures for high performance IRFPAs. This paper reports data on major advances towards the fabrication of advanced detector structures, which have been made in MBE technology at Hughes Research Laboratories during the last couple of years. Currently device quality materials with desired structural and electrical characteristics are grown with the alloy compositions required for short-wavelength infrared (SWIR, 1 - 3 micron) to very long- wavelength infrared (VLWIR, 14 - 18 micron) detector applications. In-situ In (n-type) and As (p-type) doping developed at HRL have facilitated the growth of advanced multi-layer heterojunction devices. Thus, high performance IR focal plane arrays (128 X 128) with state-of-the-art performance have been fabricated with MBE-grown double-layer heterojunction structures for MWIR and LWIR detector applications. In addition, the growth of n-p-p-n multi-layer heterojunction structures has been developed and two-color detectors have been demonstrated. Recently, significant preliminary results on the heteroepitaxy growth of HgCdTe double-layer heterojunction structures on silicon have been achieved.
Molecular-beam epitaxy (MBE) has been utilized to deposit single crystal epitaxial films of CdTe(112)B and HgCdTe(112)B directly onto Si(112) substrates without the use of GaAs interfacial layers. The films have been characterized with x-ray diffraction and wet chemical defect etching, and IR detectors have been fabricated and tested. CdTe(112)B films are twin- free and have x-ray rocking curves as narrow as 72 arc-seconds and near-surface etch pit density (EPD) of 2 X 106 cm-2 for 8 micrometers -thick films. HgCdTe(112)B films deposited on Si substrates have x-ray rocking curve FWHM as low as 92 arc-seconds and EPD of 8 - 30 X 106 cm-2. HgCdTe/Si infrared detectors have been fabricated with R0A equals 4.3 X 103 (Omega) -cm2 (f/2 FOV) and 7.8 micrometers cutoff wavelength at 78 K to demonstrate the capability of MBE for growth of large-area HgCdTe arrays on Si.
A brief review is given of the development of a metalorganic molecular beam epitaxial system for Hg-based II-VI semiconductors. Recent results on the growth of HgZnTe, HgCdTe, and iodine-doped CdTe epitaxial layers are presented and demonstrate the potential of this technique for the growth of high-quality materials.
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