We have scaled up and improved an established Plasma Assisted Reactive Magnetron Sputtering (PARMS) system for high-precision volume manufacturing of complex optical filters. The system can process batches of substrates having a diameter of up to 300 mm. By means of rotatable targets for the sputter deposition, a planetary drive system for the substrate holders, and an optical monitoring system for in-situ process control, deposition of highly complex optical filters can be performed. A comparison of coating results from this machine and its predecessor for substrates with a diameter of up to 200 mm is shown. Due to the improvements, the layer non-uniformity of oxides could be reduced from ±0.5 % down to about ±0.15 % compared to the predecessor, even though the substrate diameter was increased. Using the optical monitoring system an optical band pass filter was deposited on Ø300 mm glass wafers demonstrating the capability of the machine for production with high throughput and yield.
We have assessed and reduced the particle count in coatings from a magnetron sputter coater used for production of optical coatings for applications in photonics and semiconductor industry. Results for particle levels in single layers from Al2O3, SiO2, Nb2O5, Ta2O5, and TiO2 showed semiconductor grade particle levels for the upgraded deposition system. Moreover, particle levels were also investigated for optical filter stacks deposited on bare Si, glass substrates and actual CMOS device wafers, which were used for the manufacturing of hyperspectral imaging (HSI) sensors. In all cases, low particle counts were detected in the optical filters as expected from the results obtained for the single layer. It could be shown that the coating on the device wafers had no negative impact on the production yield of the HSI sensors.
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