Dr. Walter J. Trybula Profile

Dr. Walter J. Trybula

Retired at Trybula Foundation Inc

SPIE Involvement:

Author

Proceedings Article | 10 June 2015 Paper

Autonomous micro and nano sensors for upstream oil and gas

David Chapman, Walt Trybula

Proceedings Volume 9467, 94671F (2015) https://doi.org/10.1117/12.2177183

KEYWORDS: Sensors, Environmental sensing, Nanosensors, Telecommunications, Microsensors, Polymers, Packaging, Prototyping, Gas sensors, Data storage

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SPIE Journal Paper | 1 January 2005

Status of 157-nm optical lithography

Walter Trybula

JM3, Vol. 4, Issue 01, 011007, (January 2005) https://doi.org/10.1117/12.10.1117/1.1860401

KEYWORDS: Lithography, Optical lithography, Birefringence, Optics manufacturing, Crystals, Manufacturing, Photomasks, Pellicles, Chemical elements, Silica

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SPIE Journal Paper | 1 January 2005 Open Access

Editorial: Emerging Lithographic Technologies

Walter Trybula

JM3, Vol. 4, Issue 01, 011001, (January 2005) https://doi.org/10.1117/12.10.1117/1.1875654

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Proceedings Article | 6 December 2004 Paper

Can we afford to replace chrome?

Gilbert Shelden, Long He, Scott Hector, Walt Trybula

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.565124

KEYWORDS: Photomasks, Manufacturing, Etching, Extreme ultraviolet lithography, Reflectivity, Yield improvement, Inspection, Optical lithography, Semiconducting wafers, Chromium

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Chrome-based absorbers have been the mainstay of the photomask industry for three decades. While chrome is attractive because of its durability and opacity, it conversely poses challenges for etch and repair. Due to large capital investments, any new absorber must be designed to work with existing scanners, mask writers, and mask inspection tools. Furthermore changing absorber materials may not improve defect control in mask blank fabrication, which is a paramount concern in blank fabrication. Consequently, blank manufacturers are reluctant to change from chrome. In terms of return on investment (ROI), the only driver to switch technologies is achieving higher mask and wafer yields. This is a reasonable assumption as both etch and repair tool suppliers believe a non-chrome material like tantalum (Ta) compounds would significantly improve their capabilities with known technologies. A high level estimate shows that with even aggressive improvement assumptions, a 100% conversion from chrome does not save money. Based on the current International SEMATECH (ISMT) cost of ownership (COO) model and improved yields for critical dimension (CD) and defects, a case can be made for converting at and below 100 nm ground rules. An industry wide conversion from chrome to a non-chrome absorber is estimated to cost $100M. By contrast, blank suppliers are reportedly spending "multiple" millions of dollars to improve chrome per year. A widespread concern is whether binary optical masks have enough life left to provide sufficient ROI. Optical lithography will continue to be of use in the foreseeable future. Even as leading-edge production moves to new technology, the main manufacturing volumes will continue to create significant demand for masks for 100 nm to 45 nm for many years. With the industry currently pushing extreme ultraviolet lithography (EUVL), the best situation would be for EUVL and optical lithography to choose the same absorber material. This creates a winning situation for the industry independent of EUVL implementation timing. Today Ta-based films are a reasonable choice.

Proceedings Article | 6 December 2004 Paper

Advanced photomask cleaning

Pat Marmillion, Walt Trybula, Brian Grenon

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.570013

KEYWORDS: Photomasks, Ions, Particles, Contamination, Mask cleaning, Semiconducting wafers, Chromium, Pellicles, Air contamination, Manufacturing

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Proceedings Article | 17 December 2003 Paper

A common base for mask cost of ownership

Walter Trybula

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518237

KEYWORDS: Photomasks, Manufacturing, Binary data, Inspection, Neodymium, Tolerancing, Pellicles, Logic devices, Data conversion, Data processing

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Proceedings Article | 2 July 2003 Paper

Technology acceleration: the change in industry requirements

Walter Trybula

Proceedings Volume 5043, (2003) https://doi.org/10.1117/12.485287

KEYWORDS: Manufacturing, Semiconductors, Semiconductor manufacturing, Semiconducting wafers, Yield improvement, Very large scale integration, Photomasks, Integrated circuits, Molybdenum, Astatine

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Proceedings Article | 2 July 2003 Paper

Technology acceleration: the suppliers' challenge

Walter Trybula

Proceedings Volume 5043, (2003) https://doi.org/10.1117/12.485286

KEYWORDS: Manufacturing, Photomasks, Semiconductors, Semiconducting wafers, Birefringence, Logic, Semiconductor manufacturing, Lens design, Silicon

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Proceedings Article | 2 July 2003 Paper

Does technology acceleration equate to mask cost acceleration?

Walter Trybula, Brian Grenon

Proceedings Volume 5043, (2003) https://doi.org/10.1117/12.485285

KEYWORDS: Photomasks, Manufacturing, Inspection, Semiconductors, Tolerancing, Yield improvement, Control systems, Binary data, Optical lithography, Information technology

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Proceedings Article | 2 June 2003 Paper

Challenges of image placement and overlay at the 90-nm and 65-nm nodes

Walter Trybula

Proceedings Volume 5038, (2003) https://doi.org/10.1117/12.485036

KEYWORDS: Photomasks, Tolerancing, Manufacturing, Overlay metrology, Image processing, Semiconducting wafers, Pellicles, Semiconductors, Metrology, Mechanics

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Proceedings Article | 1 August 2002 Paper

157-nm lithography program at International SEMATECH

Giang Dao, Anthony Yen, Walter Trybula

Proceedings Volume 4754, (2002) https://doi.org/10.1117/12.476999

KEYWORDS: Pellicles, Lithography, Manufacturing, Photomasks, Birefringence, Standards development, Optics manufacturing, Silica, Reticles, Optical design

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Proceedings Article | 11 March 2002 Paper

Financial impact of technology acceleration on semiconductor masks

Walter Trybula, Kurt Kimmel, Brian Grenon

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458307

KEYWORDS: Manufacturing, Photomasks, Semiconductors, Inspection, Optical proximity correction, Pellicles, Tolerancing, Roads, Manufacturing equipment, Etching

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Proceedings Article | 18 December 1998 Paper

Effects of material properties on patterning distortions of optical reticles

Bassam Shamoun, Walter Trybula, Roxann Engelstad, Edward Lovell

Proceedings Volume 3546, (1998) https://doi.org/10.1117/12.332829

KEYWORDS: Electron beam lithography, Reticles, Photomasks, Thermography, Thermal modeling, Magnesium fluoride, Optical components, Kinematics, Reflectors, Finite element methods

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Proceedings Article | 5 June 1998 Paper

Mask requirements for advanced lithography

Walter Trybula, Roxann Engelstad

Proceedings Volume 3331, (1998) https://doi.org/10.1117/12.309576

KEYWORDS: Photomasks, Distortion, Semiconducting wafers, Lithography, X-rays, Silicon, Extreme ultraviolet, Charged-particle lithography, Ion beams, Thermal effects

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Proceedings Article | 7 July 1997 Paper

Cost of mask fabrication

Walter Trybula, Daren Dance

Proceedings Volume 3048, (1997) https://doi.org/10.1117/12.275777

KEYWORDS: Photomasks, Inspection, Semiconducting wafers, Manufacturing, Mask making, Semiconductors, Data modeling, Reliability, Metrology, Instrument modeling

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The development of the cost of ownership methodology provided the semiconductor industry with a process that is employed to evaluate the life cycle costs of any particular equipment. Applying this technique has provided a cost focus on areas of potential improvement. The existing methodology is equipment centric. The limitation of this process is that there has not been a means of evaluating the impact of the cost of ownership for a process. An evaluation of process requirements indicated that such a tool would provide an advantage for evaluating not only the process flow cost but also allocate the individual cost of ownership values according to the planned volumes and yields. This would not be the comprehensive evaluation that can be done with dynamic simulation, but a static first approximation at total process costs based on a combined process flow. This paper describes the application of this new process to the development of the process cost of ownership to the optical mask production process. The program employed in work, PRO COOL^TM, was developed by WWK in conjunction with SEMATECH. This paper describes the application of process cost of ownership to the optical mask production process sequence. Using a generic mask fabrication flow, process sequence cost of ownership analysis is used to identify cost drivers, throughput limitations, and process cost sensitivities. This generic process flow consists of the data evaluation and general number crunching requirements at the beginning of the process, followed by exposure, develop, inspection, measure, CD, pelliclize, inspect, and ship. Understanding of the relationship of these factors will help evaluate future mask fabrication technologies and requirements. Analyzing a generic optical mask production process sequence showed that the simple approach of adding process step cost of ownership values underestimates the process cost of ownership. Thus a complete analysis must consider the cost of unused capacity in the process sequence. The cost of unused capacity is correlated to the production throughput rate of the bottleneck tool. Capacity analysis helps to identify the bottleneck tool under static conditions, however, process and reliability variation can create short-term bottlenecks which must also be considered.

Showing 5 of 15 publications

Conference Committee Involvement (2)

Photomask Technology

9 September 2003 | Monterey, California, United States

Photomask Technology

1 October 2002 | Monterey, CA, United States

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