This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.
We investigated the influence of free-standing GaN (FS-GaN) substrates on the performance of ultraviolet light-emitting-diodes (UV-LEDs) grown on top by atmospheric pressure metal-organic chemical vapor deposition. High-resolution double-crystal x-ray diffraction (HRDCXD) analysis demonstrated high-order satellite peaks and clear fringes between them for UV-LEDs grown on the FS-GaN substrate, from which the interface roughness was estimated. In addition, the full width at half maximum of the HRDCXD rocking curve in the (0002) and the (101¯2) reflections were reduced to below 90 arc sec. The Raman results indicated that the GaN-based epilayer of strain free was grown. Additionally, the effect of the FS-GaN substrate on the crystal quality of the UV-LEDs was examined in detail by transmission electron microscopy (TEM). The TEM characterizations revealed no defects and V-pits were found in the scanned area. Based on the results mentioned above, the light output power of UV-LEDs on the FS-GaN substrate can be enhanced drastically by 80% and 90% at 20 and 100 mA, respectively. Furthermore, an ultralow efficiency degradation of about 3% can be obtained for the UV-LEDs on the FS-GaN substrate at a high injection current. The use of an FS-GaN substrate is suggested to be effective for improving the emission efficiency and droop of UV-LEDs grown thereon.
A-plane free-standing GaN was grown on a-plane GaN templates by HVPE. A-plane GaN templates were grown on
r-plane sapphire by MOCVD with multilayer high-low-high temperature AlN buffer layers. A regrowth method was used
for growing GaN through HVPE. First, GaN was grown on a-plane GaN templates, followed by separating the a-plane
GaN film from r-plane sapphire using LLO. Then, the GaN films were regrown using HVPE. The resulting free-standing
GaN contained some voids, which causes to release the stress.
Although it is known that GaN tend to decompose in hydrogen environments, there has been few investigations in
hydrogen etch of GaN. This study performs a systematic research on hydrogen etch of GaN under various pressures. It is
observed that hydrogen atoms initially etch into GaN to form pinholes. Dislocations are usually the preferred places for
initial hydrogen etch, but not all etched holes result from dislocations. When etched at low pressure and high temperature,
deep vertical holes extending several microns can be formed by the hydrogen etch. However, when etch is performed at
high pressure, apparent lateral etch are observed under the initial holes, leading to bollard-like GaN posts. From this
systematic study, a model has been proposed to explain the vertical and the lateral etching mechanisms. With the
established model, a sequential etch of GaN in hydrogen under varying pressure has been designed to successfully
maintain a smooth GaN front surface, but to etch the underlying GaN to form a porous cave structure. Thick GaN films
are then overgrown on such GaN layers with the hydride vapor phase epitaxy technology. It is demonstrated that the
overgrown GaN thick films can self-separate from the underlying Al2O3 substrates.
As one of the most mature techniques for manufacturing free-standing GaN substrates, hydride vapor phase epitaxy
(HVPE) always encounters problems associated with residue thermal stress, such as GaN bending and cracking during
and after growth. This work presents a patterning approach and a non-patterning approach to reduce stress in thick GaN
films grown on sapphires by HVPE. The patterning approach, forming dot air-bridged structures, adopted standard
photolithography to fabricate hexagonally aligned patterns of dots on GaN templates. Following HVPE growth, regular
voids were formed and buried in the GaN thick-films. These voids helped to relax the stress in the GaN thick-films. In
the non-patterning approach, thick GaN films were simply grown at a specially set sequence of ramping temperatures
during HVPE growth without any patterned structure. This temperature-ramping technique, gives crack-free high-quality
2"-diameter GaN films, thicker than 250 μm, on sapphires in high yields. These thick GaN films can be separated from
sapphire using conventional laser-induced lift-off processes, which can be followed by subsequent HVPE regrowths. A
600 μm-thick free-standing GaN films has a typical dislocation density of around 4×106 cm-2 with a full width at half
maximum (FWHM) in the high resolution X-ray diffraction (HRXRD) spectrum of GaN (002) of around 150 arcsec.
The residual stress in the thick GaN films was analyzed by micro-Raman spectroscopy. The effectiveness of the
patterning and the non-patterning techniques in reducing the strain in GaN films is discussed. The advantages and
weaknesses of the patterning and the non-patterning techniques will be elucidated.
This study invests the effect of barrier growth temperature on the properties of InGaN/GaN MQW. Increase the growth temperature will reduce the well thickness and result in the blue shift of the PL peak. This blue shift in PL peak wavelength may be resulted from the stain occur during varying barrier growth temperature rather than only the reduce the well width. Moreover, we introduce a phase separation enhance layer into InGaN/GaN MQW. This layer join with the variation of barrier growth temperature will enhance the phase separation in InGaN/GaN MQW. There are two peaks clearly revealed in RT PL spectra. The higher energy peak might originate the InGaN quasi-wetting layer on the GaN barrier surface. The other one is interpreted of localize state at potential fluctuation owning to phase separation.
A deep level with the activation energy around 0.45-0.6 eV has persistently appeared in GaN samples grown by hydride vapor-phase epitaxy, organometallic vapor-phase epitaxy and molecular beam epitaxy. However, the origin of this deep level still remains unclear. In this study, we investigated this deep level trap E2 of GaN films by using deep level transient spectroscopy. The GaN films were grown by a conventional low pressure organometallic vapor-phase epitaxy technique with different V/III ratios. Frequency-dependent capacitance measurement was performed to determine the most proper frequency for capacitance measurements. Capacitance- voltage measurements were then applied to obtain the carrier concentrations. The carrier concentration became higher as the flow rate of NH3 got lower. The deep level E2 is found in GaN samples grown with higher V/III ratios. The trap concentration of level E2 increased with increasing NH3 flow rate. Compared with the theoretical prediction of the nitrogen antisite level in GaN, the level E2 was believed to be related to nitrogen antisites.
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