The small depth of focus of high-NA EUV systems asks for robust focus metrology and possibly even focus control. Fast optical focus metrology is possible with dedicated focus-sensitive targets that make use of mask-3D effects. It is beneficial to connect this optical focus measurement to the focus behavior of actual device structures. Focus errors of device structures can be determined by measuring Pattern Placement Errors (PPE) with e-beam since a focus error usually lead to a layout-dependent PPE. By using a large field of view SEM we can capture a large variety of pattern layouts in 1 image acquisition. This large pattern variety creates a lot of diversity resulting in a robust “on-device” focus measurement.
Stochastic printing variations are a challenge for EUV lithography and it is well known that these variations worsen if exposed out-of-focus because the EUV image contrast degrades. The introduction of 0.55NA will improve image contrast at a reduced depth-of-focus. This paper will describe how best focus planes differences between features can be used to design focus-sensitive metrology targets that can report EUV focus if used in combination with an optical metrology tool. Moreover, the developed target methodology ensures design rules compliance. The focus metrology target concept is experimentally demonstrated using a 24nm pitch line/spacer in combination with a low-n EUV mask absorber material, metal-oxide-resist (MOR), and a 0.33NA EUV scanner. The observed focus variation is modeled to quantify how much content is correctable using scanner feedback. This illustrates that on-product focus metrology can improve focus performance if combined with advanced process control.
Double Dipole Lithography (DDL) is one of the candidates for extending optical lithography into the k1=0.30 regime. In 2001 the first experimental 2D elbow structures were reported. In 2002 a rule based decomposition and a model assisted decomposition method were presented. In 2003 a new, model based decomposition step has been presented. Now we present the results of applying this model based decomposition by discussing the first experimental results on a 0.75 NA ArF scanner printing 70 nm lines at various pitches (160 nm and larger, i.e. k1=0.31 and up). We provide an assessment of the current state of maturity of the DDL technology for the low-k1 regime (0.3..0.4). This is based upon CD uniformity, 2D pattern fidelity and through pitch process latitude behavior.
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