Xintuo Dai
at GlobalFoundries
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 28 March 2017 Paper
Proceedings Volume 10145, 101450G (2017) https://doi.org/10.1117/12.2260870
KEYWORDS: Critical dimension metrology, Nanowires, Metrology, X-rays, Semiconductors, Logic, Overlay metrology, 3D metrology, Signal processing, Inspection, Signal to noise ratio, High volume manufacturing, Silicon, Scanning electron microscopy, Image resolution

Proceedings Article | 28 March 2017 Presentation + Paper
Eric Solecky, Allen Rasafar, Jason Cantone, Benjamin Bunday, Alok Vaid, Oliver Patterson, Andrew Stamper, Kevin Wu, Ralf Buengener, Weihao Weng, Xintuo Dai
Proceedings Volume 10145, 101450R (2017) https://doi.org/10.1117/12.2261524
KEYWORDS: Defect inspection, Metrology, Process control, Critical dimension metrology, Inspection, Optical lithography, Semiconducting wafers, Dimensional metrology, Overlay metrology, Manufacturing, Electron beam lithography, Image resolution, Scanning electron microscopy, Image processing

Proceedings Article | 28 March 2017 Paper
Lei Sun, Tsunehito Kohyama, Kuniaki Takeda, Hiroto Nozawa, Yuji Asakawa, Taher Kagalwala, Granger Lobb, Frank Mont, Xintuo Dai, Shyam Pal, Wenhui Wang, Jongwook Kye, Francis Goodwin
Proceedings Volume 10145, 101452D (2017) https://doi.org/10.1117/12.2258623
KEYWORDS: Process control, Metrology, Optical metrology, Defect inspection, Inspection, Semiconducting wafers, Critical dimension metrology, Finite element methods, Wafer-level optics, Line edge roughness, Lithography, Optics manufacturing

SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top