Dr. Yubao Wang Profile

Dr. Yubao Wang

Senior Research Associate at Brewer Science Inc

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Publications (11)

Proceedings Article | 28 March 2014 Paper

Streamlined etch integration with a unique neutral layer for self-assembled block copolymers (BCPs)

Mary Ann Hockey, Kui Xu, Yubao Wang, Douglas Guerrero, Eric Calderas

Proceedings Volume 9049, 90492A (2014) https://doi.org/10.1117/12.2046351

KEYWORDS: Etching, Annealing, Resistance, Scanning electron microscopy, Polymethylmethacrylate, Plasma etching, Photoresist materials, System on a chip, Picosecond phenomena, Directed self assembly

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Proceedings Article | 29 March 2013 Paper

Evaluating spin-on carbon materials at low temperatures for high wiggling resistance

Michael Weigand, Vandana Krishnamurthy, Yubao Wang, Qin Lin, Douglas Guerrero, Sean Simmons, Brandy Carr

Proceedings Volume 8685, 86850R (2013) https://doi.org/10.1117/12.2011466

KEYWORDS: System on a chip, Etching, Reactive ion etching, Scanning electron microscopy, Photoresist materials, Semiconducting wafers, Carbon, Resistance, Lithography, Silicon

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Proceedings Article | 26 March 2013 Paper

Multifunctional hardmask neutral layer for directed self-assembly (DSA) patterning

Douglas Guerrero, Mary Ann Hockey, Yubao Wang, Eric Calderas

Proceedings Volume 8680, 86801P (2013) https://doi.org/10.1117/12.2011567

KEYWORDS: Etching, Optical lithography, System on a chip, Lithography, Reflection, Critical dimension metrology, Photoresist materials, Polymethylmethacrylate, Polonium, Directed self assembly

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Proceedings Article | 2 April 2010 Paper

High-resolution defect metrology for silicon BARC analysis

Brian Smith, Steve McGarvey, Zhimin Zhu, Yubao Wang, Dan Sullivan

Proceedings Volume 7638, 763824 (2010) https://doi.org/10.1117/12.846690

KEYWORDS: Coating, Semiconducting wafers, Silicon, System on a chip, Particles, Reflectivity, Air contamination, Metrology, Etching, Surface roughness

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Measuring coating defects on two or more blanket film layers is difficult and can be misleading due to reflectivity changes from the bottom layer, and surface roughness not present when the substrate is only polished silicon. To improve signal-to-noise ratio and establish a lower limit for particle size detection, polystyrene latex (PSL) spheres are deposited on the film stack. Particles as small as 54 nm were detectable on a stack 330-nm thick using a Hitachi LS Series Surface Scanning Inspection System (SSIS) and RS5500 Defect Review Scanning Electron Microscope (DRSEM). These systems have advanced capabilities enabling automated detection, classification, and characterization of defects down to 30 nm or smaller on some substrates and films. Haze wafer maps are related to surface roughness and reflectivity and show unusual asymmetries possibly caused by dispense problems or exhaust flow patterns during baking. These maps can be helpful to find problems in the coating system, even if film thickness is on target. Preliminary testing results are presented for a typical trilayer pattern stack for high-resolution 193-nm patterning consisting of a silicon spinon hardmask (HM) layer on top of a spin-on carbon (SOC) layer. The majority of the defects were caused by bubble formation within the HM that was modulated by process conditions used for these tests. A higher spin speed for the HM coating produced lower defects, most likely due to a thinner film with less trapped solvent during baking, but this effect will require more study, as it could also be due to a faster evaporation rate caused by higher airflow. Pre-wet, spin time, and bake temperature did not produce significant effects within these tests, but showed trends requiring further study. These advanced spin-on HM materials can be applied as thin as 15 to 20 nm due to their high etch selectivity. With the use of such high-resolution defect metrology, very subtle chemical interactions and process effects can be examined to find the ideal process conditions for both the SOC and HM layers.

Proceedings Article | 16 March 2009 Paper

Thin hardmask patterning stacks for the 22-nm node

Zhimin Zhu, Emil Piscani, Yubao Wang, Jan Macie, Charles Neef, Brian Smith

Proceedings Volume 7274, 72742K (2009) https://doi.org/10.1117/12.813816

KEYWORDS: Silicon, Optical lithography, Ultraviolet radiation, Silicon carbide, Lithography, Etching, Carbon, Reflectivity, Photoresist materials, Diffraction

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Proceedings Article | 2 April 2007 Paper

Materials for and performance of multilayer lithography schemes

Marc Weimer, Yubao Wang, Charles Neef, James Claypool, Kevin Edwards, Zhimin Zu

Proceedings Volume 6519, 65192S (2007) https://doi.org/10.1117/12.712342

KEYWORDS: Reflectivity, Silicon, Lithography, System on a chip, Etching, Multilayers, Photomasks, Semiconducting wafers, Plasma etching, Plasma

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Proceedings Article | 4 April 2005 Paper

Hybrid high refractive index polymer coatings

Yubao Wang, Tony Flaim, Ramil Mercado, Shelly Fowler, Douglas Holmes, Curtis Planje

Proceedings Volume 5724, (2005) https://doi.org/10.1117/12.589149

KEYWORDS: Refractive index, Polymers, Titanium, Photorefractive polymers, Optical coatings, Polymer thin films, Metals, Oxides, Transparency, Titanium dioxide

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Proceedings Article | 18 June 2004 Paper

Thin-film polyetherimides with controlled refractive indices

Ramil Mercado, Yubao Wang, Tony Flaim, William DiMenna, Udayan Senapati

Proceedings Volume 5351, (2004) https://doi.org/10.1117/12.529576

KEYWORDS: Refractive index, Polymers, Photorefractive polymers, Optical coatings, Transparency, Glasses, Visible radiation, Thin films, Refraction, Light emitting diodes

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Proceedings Article | 25 February 2004 Paper

High-refractive-index polymer coatings for optoelectronics applications

Tony Flaim, Yubao Wang, Ramil Mercado

Proceedings Volume 5250, (2004) https://doi.org/10.1117/12.513363

KEYWORDS: Refractive index, Optical coatings, Polymers, Oxides, Metals, Photorefractive polymers, Thin film coatings, Transmittance, Sol-gels, Titanium dioxide

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Proceedings Article | 26 June 2003 Paper

BARC-resist interfacial interacations

Chelladurai Devadoss, Yubao Wang, Rama Puligadda, Joseph Lenhart, Erin Jablonski, Daniel Fischer, Sharadha Sambasivan, Eric Lin, Wen-li Wu

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485347

KEYWORDS: Polymers, Carbon, Chemistry, X-rays, Sensors, Molecules, Chlorine, Thin films, Liquids, Silicon

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Proceedings Article | 24 August 2001 Paper

Development of full-fill bottom antireflective coatings for dual-damascene process

Yubao Wang, Xiaoming Wu, Gu Xu, James Lamb, John Sullivan, James Claypool, Jackie Backus, Sean Trautman, Xie Shao, Satoshi Takei, Yasuhisa Sone, Kenichi Mizusawa, Hiroyoshi Fukuro

Proceedings Volume 4345, (2001) https://doi.org/10.1117/12.436917

KEYWORDS: Coating, Etching, Photoresist materials, Semiconducting wafers, Bottom antireflective coatings, Antireflective coatings, Lithography, Thin films, Critical dimension metrology, Deep ultraviolet

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Showing 5 of 11 publications

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