Dr. Yue Liu Profile

Dr. Yue Liu

Fellow at Honeywell International Inc

SPIE Involvement:

Author

Publications (28)

Proceedings Article | 29 August 2002 Paper

The VCSELs are coming

Jim Tatum, Yue Liu

Proceedings Volume 4905, (2002) https://doi.org/10.1117/12.481051

KEYWORDS: Vertical cavity surface emitting lasers, Optical fibers, Polarization, Reliability, Gallium arsenide, Thermography, Mirrors, Fiber lasers, Quantum wells, Active optics

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Proceedings Article | 4 June 2002 Paper

Beyond 850 nm: progress at other wavelengths and implications from the standard

Jim Tatum, Mary Hibbs-Brenner, J. Robert Biard, Andrew Clark, J. Allen Cox, James Guenter, Robert Hawthorne, Klein Johnson, Ralph Johnson, J. Kim, Yue Liu, Fouad Nusseibeh, Gyoungwon Park

Proceedings Volume 4649, (2002) https://doi.org/10.1117/12.469216

KEYWORDS: Vertical cavity surface emitting lasers, Reliability, Optics manufacturing, Standards development, Control systems, Manufacturing, Dielectrics, Packaging, Optical networks, Data communications

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Proceedings Article | 3 June 2002 Paper

Chip-scale integration of VCSEL, photodetector, and microlens arrays

Yue Liu, Klein Johnson, Mary Hibbs-Brenner

Proceedings Volume 4652, (2002) https://doi.org/10.1117/12.469564

KEYWORDS: Vertical cavity surface emitting lasers, Interfaces, Microlens array, Semiconducting wafers, Integrated optics, Microlens, Free space optics, Optical alignment, Optical interconnects, Photodetectors

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Proceedings Article | 6 December 2001 Paper

Parallel three-dimensional free-space optical interconnection for an optoelectronic processor

Guoqiang Li, Dawei Huang, Emel Yuceturk, Sadik Esener, Volkan Ozguz, Yue Liu

Proceedings Volume 4470, (2001) https://doi.org/10.1117/12.449665

KEYWORDS: Mirrors, Sensors, Optical interconnects, Optoelectronics, Vertical cavity surface emitting lasers, Microlens, Packaging, Optical components, Very large scale integration, Free space optics

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Proceedings Article | 30 May 2001 Paper

Free-space optical interconnection of 3D optoelectronic VLSI chip stacks

Dawei Huang, Emel Yuceturk, Guoqiang Li, Mark Wang, Xuezhe Zheng, Philippe Marchand, Sadik Esener, Yue Liu, Volkan Ozguz

Proceedings Volume 4292, (2001) https://doi.org/10.1117/12.428019

KEYWORDS: Optoelectronics, Switches, Optical interconnects, Very large scale integration, Microlens, Mirrors, Computing systems, Information operations, Vertical cavity surface emitting lasers, Semiconducting wafers

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Proceedings Article | 4 May 2001 Paper

Commercialization of Honeywell's VCSEL technology: further developments

James Guenter, Jim Tatum, Andrew Clark, R. Scott Penner, Ralph Johnson, Robert Hawthorne, J. Robert Biard, Yue Liu

Proceedings Volume 4286, (2001) https://doi.org/10.1117/12.424790

KEYWORDS: Vertical cavity surface emitting lasers, Reliability, Data modeling, Oxides, Semiconducting wafers, Manufacturing, Capacitance, Sensors, Data communications, Modulation

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Proceedings Article | 29 April 1999 Paper

VCSEL-based modules for optical interconnects

Eva Strzelecka, Robert Morgan, Yue Liu, B. Walterson, J. Skogen, Edith Kalweit, S. Bounak, H. Chanhvongsak, Terry Marta, D. Skogman, Jim Nohava, J. Gieske, John Lehman, Mary Hibbs-Brenner

Proceedings Volume 3627, (1999) https://doi.org/10.1117/12.347087

KEYWORDS: Vertical cavity surface emitting lasers, Oxides, Sensors, Optical interconnects, Semiconducting wafers, Gallium arsenide, Free space optics, Temperature metrology, Integrated circuits, Reliability

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Proceedings Article | 13 April 1999 Paper

Progress in short-distance (0.5 m to 100 m) optical interconnects

John Lehman, Julian Bristow, Yue Liu, Mary Hibbs-Brenner

Proceedings Volume 3632, (1999) https://doi.org/10.1117/12.344593

KEYWORDS: Optical interconnects, Connectors, Interfaces, Switches, Copper, Transceivers, Optoelectronics, Vertical cavity surface emitting lasers, Computing systems, Clocks

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Proceedings Article | 22 May 1998 Paper

Smart-pixel module development for free-space optical interconnects

Yue Liu

Proceedings Volume 3490, (1998) https://doi.org/10.1117/12.308869

KEYWORDS: Vertical cavity surface emitting lasers, Optical interconnects, Free space optics, Electronics, Free space, Optical components, Sensors, Logic, Fiber optics, Optical arrays

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Proceedings Article | 22 May 1998 Paper

FAST-Net optical interconnection prototype demonstration

Michael Haney, Marc Christensen, Predrag Milojkovic, Jeremy Ekman, Premanand Chandramani, Richard Rozier, Fouad Kiamilev, Yue Liu, Mary Hibbs-Brenner, Jim Nohava, Edith Kalweit, Sommy Bounnak, Terry Marta, B. Walterson

Proceedings Volume 3490, (1998) https://doi.org/10.1117/12.308879

KEYWORDS: Vertical cavity surface emitting lasers, Prototyping, Optical interconnects, Photodetectors, Mirrors, Sensors, Receivers, Gallium arsenide, Metals, Palladium

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Highly interconnected multiprocessor systems are now performance limited by the backplane interconnection bottleneck associated with planar interconnection technologies. Smart pixel throughput capabilities are projected to exceed I Thitls/cm2 [1] and offer the promise of overcoming the bottlenecks of planar technologies for many types of interconnection-limited multiprocessor problems. Systems that use smart pixel-based free space optical interconnects (FSOI) provide two general dense interconnection capabilities: intelligent parallel data transfer and intelligent parallel data interchange. Optical imaging provides a high throughput approach to linking smart pixel planes for data transfer. In this case the high 110 density of smart pixels may provide a power consumption and size advantage over electronics [2,3]. For data interchange, FSOI provides the additional ability to perform the data partitioning and interleaving useful in space variant link interconnection patterns like the perfect shuffle (PS) [41,which are inherently difficult to implement in planar interconnection technologies. Such patterns are characterized by high BSBW [51. In multi-processor architecture design, there is a direct trade-off between minimum BSBW and latency in a network. It is therefore generally desirable to implement networks with the largest minimum BSBW that can be practically achieved to solve a given problem. The ability of optical elements to interconnect large arrays in space-variant patterns, without crosstalk in the medium, suggests that FSOI techniques are particularly promising for problems with high BSBW. For problems with greater than 1 ThitJsec BSBW (i.e., greater than the capabilities of a single chip) free space optical interconnects have a marked advantage [6,71. Therefore, globally interconnected multi-chip smart pixel based architectures have the potential to reap the full benefits of FSOI. This paper describes the experimental demonstration of a smart pixel based optical interconnection prototype currently being developed under the Free-space Accelerator for Switching Terabit tworks (FAST-Net) project, sponsored by the U.S. Defense Advanced Research Projects Agency. The prototype system incorporates 2-D arrays of monolithically integrated high-bandwidth vertical cavity surface emitting lasers (VCSELs) and photodetectors (PDs). A key aspect of the FAST-Net concept is that all smart pixels are distributed across a single multi-chip plane. This plane is connected to itself via an optical system that consists of an array of matched lenses (one for each smart pixel chip position) and a mirror. The optical interconnect system implements a global point-to-point shuffle pattern. The interleaved 2-D arrays of VCSELs and PDs in the prototype are arranged on a clustered self-similar grid pattern with a closest element pitch of 100 tm. The circular VCSEL elements have a diameter of 10 pm and the square PDs have an active region that is 50 jim wide. These arrays are packaged and mounted on printed circuit boards along with CMOS driver, receiver, and FPGA controller chips. Micro-positioning mounts are used to effect alignment that is consistent with current MCM chip placement accuracy. Shuffled optical data links between the multiple ICs have been demonstrated in preliminary evaluation of this system. These results suggest that a multi-Terabit optically interconnected MCM module is feasible.

Proceedings Article | 5 May 1998 Paper

FAST-Net optical interconnection prototype demonstration program

Michael Haney, Marc Christensen, P. Milojkovik, Jeremy Ekman, Premanand Chandramani, Richard Rozier, Fouad Kiamilev, Yue Liu, Mary Hibbs-Brenner, Jim Nohava, Edith Kalweit, Sommy Bounnak, Terry Marta, B. Walterson

Proceedings Volume 3288, (1998) https://doi.org/10.1117/12.307576

KEYWORDS: Vertical cavity surface emitting lasers, Prototyping, Optical interconnects, Modulation, Photodetectors, Palladium, Mirrors, Receivers, Lenses, Field programmable gate arrays

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Proceedings Article | 5 May 1998 Paper

High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging

Yung-Sheng Liu, R. Wojnarowski, W. Hennessy, P. Piacente, John Rowlette, Michael Kadar-Kallen, Jared Stack, Yue Liu, Andrzej Peczalski, Ajay Nahata

Proceedings Volume 3288, (1998) https://doi.org/10.1117/12.307590

KEYWORDS: Waveguides, Polymers, Vertical cavity surface emitting lasers, Polymer multimode waveguides, Packaging, Optical interconnects, Optical alignment, Connectors, Amplifiers, Transceivers

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Proceedings Article | 27 January 1998 Paper

VCSEL-based optoelectronic smart pixels

Mary Hibbs-Brenner, Yue Liu, Robert Morgan, John Lehman

Proceedings Volume 10292, 102920C (1998) https://doi.org/10.1117/12.300609

KEYWORDS: Optoelectronics, Data communications, Vertical cavity surface emitting lasers, Optical interconnects, Optical components, Logic, Integrated optics, Photodetectors

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Proceedings Article | 1 May 1997 Paper

Vertical-cavity surface-emitting lasers: the applications

Robert Morgan, John Lehman, Mary Hibbs-Brenner, Yue Liu, Julian Bristow

Proceedings Volume 3004, (1997) https://doi.org/10.1117/12.273822

KEYWORDS: Vertical cavity surface emitting lasers, Packaging, Waveguides, Polymers, Polymer multimode waveguides, Light emitting diodes, Data communications, Sensors, Computing systems, Optical fibers

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Proceedings Article | 4 April 1997 Paper

Recent progress in short-distance optical interconnects

Julian Bristow, John Lehman, Yue Liu, Mary Hibbs-Brenner, Lynn Galarneau, Robert Morgan

Proceedings Volume 3005, (1997) https://doi.org/10.1117/12.271078

KEYWORDS: Waveguides, Polymers, Optical interconnects, Polymer multimode waveguides, Vertical cavity surface emitting lasers, Connectors, Interfaces, System integration, Wave propagation, Integrated optics

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Proceedings Article | 4 April 1997 Paper

Design and fabrication of passive optical polymer waveguide components for multimode parallel optical links

Robert Scarmozzino, Richard Osgood, Louay Eldada, James Yardley, Yue Liu, Julian Bristow, Jared Stack, John Rowlette, Yung-Sheng Liu

Proceedings Volume 3005, (1997) https://doi.org/10.1117/12.271094

KEYWORDS: Waveguides, Polymer multimode waveguides, Polymers, Computer aided design, Beam propagation method, Signal attenuation, Optical interconnects, Optical fibers, Laser sources, Chlorine

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Proceedings Article | 4 April 1997 Paper

Optoelectronic backplane interconnect technology development (POINT)

Yung-Sheng Liu, W. Hennessy, R. Wojnarowski, Julian Bristow, Yue Liu, John Rowlette, Jared Stack, James Yardley, Louay Eldada, Richard Osgood, Robert Scarmozzino, Shin Lee, Susant Patra

Proceedings Volume 3005, (1997) https://doi.org/10.1117/12.271090

KEYWORDS: Waveguides, Packaging, Polymers, Optoelectronic packaging, Vertical cavity surface emitting lasers, Optical alignment, Polymer multimode waveguides, Transmitters, Optical interconnects, Optoelectronics

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Proceedings Article | 18 October 1996 Paper

Vertical cavity surface emitting lasers for spaceborne photonic interconnects

Robert Morgan, Julian Bristow, Mary Hibbs-Brenner, Jim Nohava, Sommy Bounnak, Terry Marta, John Lehman, Yue Liu

Proceedings Volume 2811, (1996) https://doi.org/10.1117/12.254041

KEYWORDS: Vertical cavity surface emitting lasers, Optical interconnects, Waveguides, Packaging, Polymer multimode waveguides, Polymers, Light emitting diodes, Optoelectronic devices, Radiation effects, Optical fibers

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Proceedings Article | 30 September 1996 Paper

Polymer optical waveguide technology for multichip modules (MCMs) and board level interconnects

Yue Liu, Julian Bristow, Klein Johnson, Andrzej Peczalski, Terry Marta, Sommy Bounnak, W. Goldberg, Brian Hanzel

Proceedings Volume 2891, (1996) https://doi.org/10.1117/12.253163

KEYWORDS: Waveguides, Polymer multimode waveguides, Polymers, Vertical cavity surface emitting lasers, Connectors, Silicon, Optical interconnects, Optoelectronic devices, Interfaces, Photodetectors

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Proceedings Article | 29 March 1996 Paper

MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging

Julian Bristow, Yue Liu, Terry Marta, Klein Johnson, Brian Hanzal, Andrzej Peczalski, Sommy Bounnak, Yung-Sheng Liu, Herbert Cole

Proceedings Volume 2691, (1996) https://doi.org/10.1117/12.236922

KEYWORDS: Waveguides, Packaging, Polymers, Polymer multimode waveguides, Optical interconnects, Vertical cavity surface emitting lasers, Interfaces, Optoelectronic devices, Optoelectronics, Cladding

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Proceedings Article | 30 January 1996 Paper

Polymer optical interconnect technology (POINT): optoelectronic packaging and interconnect for board and backplane applications

Y. S. Liu, R. Wojnarowski, W. Hennessy, Julian P. Bristow, Yue Liu, Andrzej Peczalski, John Rowlette, Alan Plotts, Jared Stack, James Yardley, Louay Eldada, Richard Osgood, Robert Scarmozzino, Sing Lee, Volkan Ozguz

Proceedings Volume 10284, 102840N (1996) https://doi.org/10.1117/12.229274

KEYWORDS: Polymers, Optical interconnects, Optoelectronic packaging, Optoelectronics, Packaging, Diffractive optical elements, Amplifiers, Vertical cavity surface emitting lasers, Optical alignment, Computer simulations

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Proceedings Article | 30 May 1995 Paper

Multimode optical interconnects with low modal noise for spaceborne databusses and commercial computers

Julian Bristow, Yue Liu, John Lehman, Klein Johnson

Proceedings Volume 2482, (1995) https://doi.org/10.1117/12.210525

KEYWORDS: Waveguides, Signal to noise ratio, Interfaces, Interference (communication), Signal attenuation, Connectors, Visibility, Optical interconnects, Semiconductor lasers, Multimode fibers

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Acceptance of optical interconnects into spaceborne and ground-based military systems will be limited by the risk and maturity of the technology. Multimode fibers are currently the interconnect medium of choice for military application due to the availability of qualified parts. Multimode optical interconnects also offer lower assembly cost than singlemode interconnects, making them attractive for use in commercial computers. In both applications, modal noise may limit the attainable bit error rate in a digital system. We report on an investigation of the validity of simple expressions for determining modal noise in multimode systems, and consider in particular waveguides supporting fewer modes than typical multimode fibers and waveguides with incomplete modal excitation. We conclude that the simple expressions are valid for losses greater than approximately 0.5 dB per interface, but that the actual signal-to-noise ratio is significantly poorer than that predicted by theory for large displacements of waveguides in which a small fraction of the total modal volume is excited. We describe two simulation techniques for determining the statistics of the transmission associated with a waveguide bend, and find that the simple formula widely used for straight waveguide intersections do not describe curved waveguide interconnects accurately. We also describe a practical demonstration of two optical interconnect systems in which multimode interconnect media incorporating several imperfect interfaces and excited with coherent sources can achieve useful bit error rates in digital systems. In the first interconnect, a fiber optica data bus for satellite use employs six multimode connectors and multimode fiber to transmit data at 1.2 Gbps over distances from 1 meter to 100 meters. In the second interconnect, passive multimode polymide waveguides compatible with intracabinet optical interconnects are used to implement a multichip module (MCM)-to-MCM interconnect in which optoelectronic die are incorporated in a 'chip first' multichip module technology.

Proceedings Article | 5 April 1995 Paper

Cost-effective optoelectronic packaging for multichip modules and backplane level optical interconnects

Julian Bristow, Yue Liu, Terry Marta, Sommy Bounnak, Klein Johnson, Yung-Sheng Liu, Herbert Cole

Proceedings Volume 2400, (1995) https://doi.org/10.1117/12.206334

KEYWORDS: Waveguides, Packaging, Connectors, Optical interconnects, Optoelectronics, Optoelectronic devices, Interfaces, Polymers, Optics manufacturing, Manufacturing

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Proceedings Article | 5 April 1995 Paper

Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect

Yung-Sheng Liu, Herbert Cole, Julian Bristow, Yue Liu

Proceedings Volume 2400, (1995) https://doi.org/10.1117/12.206296

KEYWORDS: Packaging, Polymers, Optical interconnects, Optoelectronic packaging, Vertical cavity surface emitting lasers, Waveguides, Optoelectronic devices, Computing systems, Electronic components, Thin films

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Proceedings Article | 8 June 1994 Paper

Fiber optic MCM for spaceborne applications

Julian Bristow, John Lehman, Yue Liu, W. Goldberg, John DeRuiter, Dennis Kersch

Proceedings Volume 2215, (1994) https://doi.org/10.1117/12.177630

KEYWORDS: Fiber lasers, Interfaces, Fiber optics, Signal to noise ratio, Sensors, Connectors, Packaging, Semiconductor lasers, Space operations, Polishing

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Proceedings Article | 2 May 1994 Paper

Hybrid integration of electrical and optical interconnects

Yung-Sheng Liu, Herbert Cole, Julian Bristow, Yue Liu

Proceedings Volume 2153, (1994) https://doi.org/10.1117/12.174526

KEYWORDS: Waveguides, Packaging, Optical interconnects, Optical alignment, Optoelectronics, Optics manufacturing, Thermography, Optoelectronic devices, Adaptive optics, Optoelectronic packaging

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Proceedings Article | 1 July 1993 Paper

Progress and status of guided-wave optical interconnection technology

Julian Bristow, Charles Sullivan, Sayan Mukherjee, Yue Liu, Anis Husain

Proceedings Volume 1849, (1993) https://doi.org/10.1117/12.147108

KEYWORDS: Optical interconnects, Information operations, Waveguides, Interfaces, Optoelectronic devices, Fiber optics, Polymers, Silicon, Connectors, Tolerancing

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Proceedings Article | 1 April 1991 Paper

High-performance InGaAs PIN and APD (avalanche photdiode) detectors for 1.54 um eyesafe rangefinding

Gregory Olsen, Donald Ackley, J. Hladky, James Spadafora, K. Woodruff, M. Kazakia, Brian Van Orsdel, Stephen Forrest, Yue Liu

Proceedings Volume 1419, (1991) https://doi.org/10.1117/12.43843

KEYWORDS: Indium gallium arsenide, Sensors, Avalanche photodetectors, Quantum efficiency, Diffusion, Germanium, Silicon, Laser systems engineering, Laser applications, Zinc

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Showing 5 of 28 publications

Conference Committee Involvement (5)

Optoelectronic Integrated Circuits X

23 January 2006 | San Jose, California, United States

Optoelectronic Integrated Circuits IX

25 January 2005 | San Jose, California, United States

Optoelectronic Integrated Circuits VIII

26 January 2004 | San Jose, CA, United States

Optoelectronic Integrated Circuits VII

30 January 2003 | San Jose, CA, United States

Photonic Integrated Systems

28 January 2003 | San Jose, CA, United States

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