The Back-side Surface Treatment ("BST") is a module that cleans the backside of a wafer just before a process on
the exposure system. To support immersion lithography, Tokyo Electron introduces a bevel cleaning function to
this module. This enables cleaning of both wafer backside and bevel section at the same time. We evaluate the new
BST module for wafer cleaning performance, wafer backside cleaning performance and wafer topside particle
control performance. The effectiveness of the BST module is tested in an actual production line. It is proved that the
introduction of the BST module reduces defocus and blocked images.
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