Mr. Peter C. Salmon Profile

Peter C. Salmon

Principle Investigator at Peter C. Salmon, LLC

SPIE Involvement:

Author

Area of Expertise:

systems , electrostatics , roll-to-roll , engineering , semiconductors , intellectual property

Websites:

Company Website

Profile Summary

Inventor with over 30 independent patents: electronic packaging, electrostatics, roll-to-roll printing, semiconductors.

Best in conference paper: • REPAIRABLE 3D SEMICONDUCTOR SUBSYSTEM, 2nd International Wafer Level Packaging Conference, San Jose California, Nov. 3-4, 2005.

Publications (1)

Proceedings Article | 15 January 2003 Paper

Chip on flex with 5-micron features

Peter Salmon

Proceedings Volume 4979, (2003) https://doi.org/10.1117/12.478238

KEYWORDS: Glasses, Manufacturing, Packaging, Metals, LCDs, Semiconducting wafers, Flexible circuits, Silicon, Polymers, Coating

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years