Presentation
24 March 2023 Low-cost GeSn focal plane arrays for extended SWIR imaging
Maddy Woodson, Estefano Fodor, Kenneth A. Hay, Daniel S. Renner
Author Affiliations +
Abstract
The novel Group IV materials system germanium silicon tin (GeSiSn) promises a low-cost material alternative to conventional Group III-V and II-VI materials systems for extended shortwave infrared (SWIR) and even mid-wave and long-wave infrared applications. This materials system offers substantial advantages in terms of material cost, processing cost, and substrate size, allowing for the development of large arrays, with small pixels, at low cost. Here, we present the device models we have used for our development and an analysis of both individual diodes and a large area detector array, including initial imagery captured using the detector array hybridized to a commercially available readout integrated circuit.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Maddy Woodson, Estefano Fodor, Kenneth A. Hay, and Daniel S. Renner "Low-cost GeSn focal plane arrays for extended SWIR imaging", Proc. SPIE PC12415, Physics and Simulation of Optoelectronic Devices XXXI, PC1241504 (24 March 2023); https://doi.org/10.1117/12.2650608
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KEYWORDS
Short wave infrared radiation

Staring arrays

Infrared radiation

Instrument modeling

Readout integrated circuits

Detector arrays

Infrared imaging

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