Maskless Laser Plating Techniques For Microelectronic Materials

R. J. von Gutfeld; M. H. Gelchinski; L. T. Romankiw

doi:10.1117/12.934964

9 August 1983 Maskless Laser Plating Techniques For Microelectronic Materials

R. J. von Gutfeld, M. H. Gelchinski, L. T. Romankiw

Proceedings Volume 0385, Laser Processing of Semiconductor Devices; (1983) https://doi.org/10.1117/12.934964
Event: 1983 Los Angeles Technical Symposium, 1983, Los Angeles, United States

Abstract

We describe techniques for laser enhanced plating of gold, nickel and copper. This maskless plating results in speeds up to 10³ times that of conventional plating. Mechanisms and applications are discussed.

Citation Download Citation

R. J. von Gutfeld, M. H. Gelchinski, and L. T. Romankiw "Maskless Laser Plating Techniques For Microelectronic Materials", Proc. SPIE 0385, Laser Processing of Semiconductor Devices, (9 August 1983); https://doi.org/10.1117/12.934964

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