Paper
3 October 1983 3-D Profile Detection Of Etched Patterns Using A Laser Scanner (3D-SCAN DETECTION) For Automatic Inspection Of Printed Circuit Boards
Moritoshi Ando, Kikuo Mita, Yoshikazu Kakinoki, Takefumi Inagaki
Author Affiliations +
Proceedings Volume 0389, Optical Systems Engineering III; (1983) https://doi.org/10.1117/12.935024
Event: 1983 Los Angeles Technical Symposium, 1983, Los Angeles, United States
Abstract
A new detection method named 3D-SCAN DETECTION has been developed. The method can detect three dimensional profiles of etched pattern on an inner layer of multilayer printed circuit boards (PC boards). In this system, one scanning of a laser beam allows the simultaneous detection of both top and bottom widths of an etched pattern (standard width and thickness: 100 x 35 μm) to within an accuracy of 10 pm. A prototype of 3D-SCAN DETECTION has been experimentally confirmed to have sufficient performance for the detection of such flaws as nicks in a copper pattern and poor spacing between adjacent conductors.
© (1983) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Moritoshi Ando, Kikuo Mita, Yoshikazu Kakinoki, and Takefumi Inagaki "3-D Profile Detection Of Etched Patterns Using A Laser Scanner (3D-SCAN DETECTION) For Automatic Inspection Of Printed Circuit Boards", Proc. SPIE 0389, Optical Systems Engineering III, (3 October 1983); https://doi.org/10.1117/12.935024
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KEYWORDS
Copper

Inspection

Spatial filters

Defect detection

Signal detection

Laser scanners

Algorithm development

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