CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 10450 > Article
Paper
16 October 2017 Thermo-mechanical behavior analysis of extreme-ultraviolet pellicle cooling with H2 flow
Myung-Gi Kang, Sung-Gyu Lee, Eun-Sang Park, Hye-Keun Oh
Author Affiliations +
Proceedings Volume 10450, International Conference on Extreme Ultraviolet Lithography 2017; 104501N (2017) https://doi.org/10.1117/12.2280691
Event: SPIE Photomask Technology and EUV Lithography, 2017, Monterey, California, United States
Abstract
To protect the extreme-ultraviolet (EUV) mask from contaminations, the EUV pellicle is required. Internal temperature of EUV pellicle is increased during exposure process and then, thermal stress is also varied owing to increased temperature of EUV pellicle, so that the EUV pellicle will be broken. The cooling system by hydrogen gas (H2) flow is used to reduce internal temperature of EUV pellicle during exposure process. In order to determine the effect of cooling, we simulated variation of temperature and thermal stress for EUV pellicle membranes by using finite element method (FEM). Also, we considered a film coefficient with a few nanometer EUV pellicle thickness as simulation parameter. As a result, we determined that the cooling system of EUV pellicle by using H2 flow is efficient to decrease temperature and thermal stress of EUV pellicle during exposure process.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Myung-Gi Kang, Sung-Gyu Lee, Eun-Sang Park, and Hye-Keun Oh "Thermo-mechanical behavior analysis of extreme-ultraviolet pellicle cooling with H2 flow", Proc. SPIE 10450, International Conference on Extreme Ultraviolet Lithography 2017, 104501N (16 October 2017); https://doi.org/10.1117/12.2280691
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 7 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Pellicles
Extreme ultraviolet
Extreme ultraviolet lithography
Convection
Cooling systems
Finite element methods
Silicon
RELATED CONTENT
Multi-stack extreme-ultraviolet pellicle with out-of-band reduction
Proceedings of SPIE (March 19 2015)
Properties and performance of EUVL pellicle membranes
Proceedings of SPIE (October 23 2015)
Stress-induced pellicle analysis for extreme-ultraviolet lithography
Proceedings of SPIE (March 18 2016)
Lifetime impact on residual stress of EUV pellicle
Proceedings of SPIE (October 16 2017)
Introducing the EUV CNT pellicle
Proceedings of SPIE (October 25 2016)
CNTs in the context of EUV pellicle history
Proceedings of SPIE (April 23 2018)
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top