Paper
10 May 2018 Industrialization of a robust EUV source for high-volume manufacturing and power scaling beyond 250W
Michael Purvis, Igor V. Fomenkov, Alexander A. Schafgans, Mike Vargas, Spencer Rich, Yezheng Tao, Slava I. Rokitski, Melchior Mulder, Erik Buurman, Michael Kats, Jayson Stewart, Andrew D. LaForge, Chirag Rajyaguru, Georgiy Vaschenko, Alex I. Ershov, Robert J. Rafac, Mathew Abraham, David C. Brandt, Daniel J. Brown
Author Affiliations +
Abstract
In this paper, we provide an overview of various technologies for scaling tin laser-produced-plasma (LPP) extremeultraviolet (EUV) source performance to enable high volume manufacturing (HVM). We will show improvements to source architecture that facilitated the increase of EUV power from 100W to 250W, and the technical challenges for power scaling of key source parameters and subsystems. The performance of critical subsystems such as the Droplet Generator and Collector protection will be shown, with emphasis on stability and lifetime. Finally, we will describe current research activities and provide a perspective for LPP EUV sources towards 500W.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael Purvis, Igor V. Fomenkov, Alexander A. Schafgans, Mike Vargas, Spencer Rich, Yezheng Tao, Slava I. Rokitski, Melchior Mulder, Erik Buurman, Michael Kats, Jayson Stewart, Andrew D. LaForge, Chirag Rajyaguru, Georgiy Vaschenko, Alex I. Ershov, Robert J. Rafac, Mathew Abraham, David C. Brandt, and Daniel J. Brown "Industrialization of a robust EUV source for high-volume manufacturing and power scaling beyond 250W", Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 1058327 (10 May 2018); https://doi.org/10.1117/12.2305955
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Cited by 12 scholarly publications.
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KEYWORDS
Extreme ultraviolet

Extreme ultraviolet lithography

Scanners

Plasma

Tin

High volume manufacturing

Semiconducting wafers

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