Lithography technology and trends for More than Moore devices: advanced packaging and MEMS devices

Amandine Pizzagalli

doi:10.1117/12.2326784

19 September 2018 Lithography technology and trends for More than Moore devices: advanced packaging and MEMS devices

Amandine Pizzagalli

Proceedings Volume 10775, 34th European Mask and Lithography Conference; 107750C (2018) https://doi.org/10.1117/12.2326784
Event: 34th European Mask and Lithography Conference, 2018, Grenoble, France

Abstract

Lithography requirements for Advanced Packaging & MEMS are very different compared to mainstream semiconductor industries’ needs. Even if the market entry barrier is much lower in the “More than Moore” market, customer adoptions needs are higher in the packaging area with respect to resolution, overlay, sidewall angle, and depth of focus (DOF), wafer handling for wafer bow and backside alignment. Key technical trends, requirements and challenges regarding the lithography technologies will be addressed in this paper. In addition, more insights on the current and emerging lithography methods for More than Moore devices will be included, as well as market forecast, competitive landscape of the major equipment suppliers addressing these fields.

Citation Download Citation

Amandine Pizzagalli "Lithography technology and trends for More than Moore devices: advanced packaging and MEMS devices", Proc. SPIE 10775, 34th European Mask and Lithography Conference, 107750C (19 September 2018); https://doi.org/10.1117/12.2326784

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