Paper
25 March 2019 Development of metal organic cluster EUV photoresists
Kazunori Sakai, Seok Heon Jung, Wenyang Pan, Emmanuel P. Giannelis, Christopher K. Ober
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Abstract
Extreme ultraviolet (EUV) lithography, using 13.5 nm radiations, is almost ready for high volume manufacturing. EUV lithography is expected to be the main technology for manufacturing leading-edge devices and continuous improvement of lithography performance is still needed. We have developed several metal oxide containing resists and recently focused on metal organic cluster photoresists with controlled size distribution. In this paper, material properties and lithography performance of our new metal organic cluster photoresists are discussed.
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Kazunori Sakai, Seok Heon Jung, Wenyang Pan, Emmanuel P. Giannelis, and Christopher K. Ober "Development of metal organic cluster EUV photoresists", Proc. SPIE 10960, Advances in Patterning Materials and Processes XXXVI, 1096015 (25 March 2019); https://doi.org/10.1117/12.2516133
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KEYWORDS
Metals

Extreme ultraviolet lithography

Photoresist materials

Deep ultraviolet

Extreme ultraviolet

Lithography

Nanoparticles

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