Recent advances in integrated photonic-electronic technologies for high-speed processing and communication circuits for light-based transducers

Sergio Saponara

doi:10.1117/12.2519583

14 May 2019 Recent advances in integrated photonic-electronic technologies for high-speed processing and communication circuits for light-based transducers

Sergio Saponara

Author Affiliations +

Proceedings Volume 10996, Real-Time Image Processing and Deep Learning 2019; 109960J (2019) https://doi.org/10.1117/12.2519583
Event: SPIE Defense + Commercial Sensing, 2019, Baltimore, MD, United States

Abstract

The paper reviews recent advances in integrated technologies to embed photonic and electronic circuits and systems within the same chip and/or package. Thanks to multi-project wafer services like Europractice, new technologies (e.g. the SG25_PIC by IHP or the iSiPP50G by IMEC), are available at affordable cost to integrate on silicon chip also photonic devices like waveguides, photodiodes, photonic modulators and fiber-couplers. As an evolution, SG25H_EPIC technology is a high performance technology by IHP, which combines in the same chip integrated Silicon Photonic devices of the SG25_PIC technology with Bipolar and CMOS electronic circuits of the SiGe BiCMOS SG25H4 technology. The paper reviews these capabilities and show how it is possible to integrate in the same chip photonics and electronics to reach high speed in terms of signal acquisition, processing and transmission of light-based transducers.

Citation Download Citation

Sergio Saponara "Recent advances in integrated photonic-electronic technologies for high-speed processing and communication circuits for light-based transducers", Proc. SPIE 10996, Real-Time Image Processing and Deep Learning 2019, 109960J (14 May 2019); https://doi.org/10.1117/12.2519583

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KEYWORDS

Vertical cavity surface emitting lasers

Computer aided design

CMOS technology

Waveguides

Electronic circuits

Silicon

Metals

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