A uniform micro-bump formation method using electroplating

Jung O. Son; Young Ho Kim; Kyung Heon Kim; Sun Ho Kim; Hyun Ja Im; Nam Hwan Kim; Han Jung

doi:10.1117/12.2518583

7 May 2019 A uniform micro-bump formation method using electroplating

Jung O. Son, Young Ho Kim, Kyung Heon Kim, Sun Ho Kim, Hyun Ja Im, Nam Hwan Kim, Han Jung

Proceedings Volume 11002, Infrared Technology and Applications XLV; 110022B (2019) https://doi.org/10.1117/12.2518583
Event: SPIE Defense + Commercial Sensing, 2019, Baltimore, MD, United States

Abstract

Recently, infrared detectors have become increasingly dense and miniaturized. The development of micro solder bumps with small diameter and high aspect ratio is necessary for high pixel density and miniaturized infrared detectors. Indium solder bump has been used for infrared detectors because of its stability at low temperature, electrical conductivity and ductility. In this work, the method and results of forming indium bumps with uniform and high aspect ratio by electroplating is presented. In particular, the electroplating method for forming a uniform micro bump and the method for manufacturing a bump having a uniform height will be presented in detail. Finally, the result of indium bump made of pixel pitch 5 μm and 7.5 μm is presented.

Citation Download Citation

Jung O. Son, Young Ho Kim, Kyung Heon Kim, Sun Ho Kim, Hyun Ja Im, Nam Hwan Kim, and Han Jung "A uniform micro-bump formation method using electroplating", Proc. SPIE 11002, Infrared Technology and Applications XLV, 110022B (7 May 2019); https://doi.org/10.1117/12.2518583

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