One metric to rule them all: new k4 definition for photoresist characterization

J. G. Santaclara; B. Geh; A. Yen; T. A. Brunner; D. De Simone; J. Severi; G. Rispens

doi:10.1117/12.2554493

14 April 2020 One metric to rule them all: new k₄definition for photoresist characterization

J. G. Santaclara, B. Geh, A. Yen, T. A. Brunner, D. De Simone, J. Severi, G. Rispens

Proceedings Volume 11323, Extreme Ultraviolet (EUV) Lithography XI; 113231A (2020) https://doi.org/10.1117/12.2554493
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

As feature sizes continue to shrink, low-k₁ lithographic processes are required to advance chip technologies. In this context, both advances in optical systems and imaging capabilities as well as improvements in EUV photoresist have led to practical gains in resolution. This work focusses on our latest attempt to characterize photoresist performance by a metric that can effectively exclude all other contributors (e.g. scanner) and quantify the true photoresist capabilities. By a cautious analysis of the previous k₄metric for several use cases and resist platforms (chemically amplified vs. metal-oxide resist), we propose an improved formula that incorporates key resist attributes.

Conference Presentation

Citation Download Citation

J. G. Santaclara, B. Geh, A. Yen, T. A. Brunner, D. De Simone, J. Severi, and G. Rispens "One metric to rule them all: new k₄definition for photoresist characterization", Proc. SPIE 11323, Extreme Ultraviolet (EUV) Lithography XI, 113231A (14 April 2020); https://doi.org/10.1117/12.2554493

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