Poster + Presentation + Paper
5 March 2021 Development of dual-side view swept source optical coherence tomography for opaque materials thickness measurement
Author Affiliations +
Conference Poster
Abstract
In this study, we developed a novel dual-side view OCT (DSV-OCT) system for thickness measurement on opaque materials. The dual-side view was achieved on conventional swept source OCT platform by creating two symmetrical sampling arms. This allows to image both sides of the material simultaneously and produce the surface contours of the two sides in a single C-scan. Finally, the thickness of the opaque material can be calculated from the two surface contours above. We evaluated the performance of our DSV-OCT using a microscope slide as sample. The results demonstrated that our DSV-OCT has a good capability for thickness measurement on opaque materials with an accuracy of about 3 μm.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qian Wu, Xiwen Wang, Jiewen Chen, and Jianhua Mo "Development of dual-side view swept source optical coherence tomography for opaque materials thickness measurement", Proc. SPIE 11630, Optical Coherence Tomography and Coherence Domain Optical Methods in Biomedicine XXV, 1163024 (5 March 2021); https://doi.org/10.1117/12.2577181
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Optical coherence tomography

Opacity

Interferometry

Microscopes

Optical imaging

Optical testing

Signal attenuation

Back to Top