Poster + Presentation + Paper
5 March 2021 Photon counting x-ray imager with four-sides buttable structure
Toshiyuki Takagi, Katsuyuki Takagi, Tsuyoshi Terao, Hisashi Morii, Takaharu Okunoyama, Hiroki Kase, Akifumi Koike, Toru Aoki
Author Affiliations +
Conference Poster
Abstract
A new photon counting X-ray imager with a 4-sided buttable structure is proposed. The imager consists of a stacked structure of a semiconductor detector such as Cadmium Telluride detector and a Si-based Read-Out Integrated Circuit (ROIC). The imager can be arranged in two dimensions with small gaps of less than 100 μm, because input/output pads of the ROIC are located on the back using through silicon via technology. In addition, daisy-chaining between imagers extends the number of tilings without increasing the number of external connections. This allows to connect small imagers to achieve a larger imaging area.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Toshiyuki Takagi, Katsuyuki Takagi, Tsuyoshi Terao, Hisashi Morii, Takaharu Okunoyama, Hiroki Kase, Akifumi Koike, and Toru Aoki "Photon counting x-ray imager with four-sides buttable structure", Proc. SPIE 11693, Photonic Instrumentation Engineering VIII, 1169313 (5 March 2021); https://doi.org/10.1117/12.2578283
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KEYWORDS
Photon counting

X-ray imaging

Imaging systems

Readout integrated circuits

Sensors

Cadmium

Semiconductors

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